IP Library › Granted Patent US 11,768,991
Granted Patent B2
US 11,768,991 · App. 17/332,646 · Granted Sep 26, 2023

Pin access hybrid cell height design

Inventors: Kam-Tou Sio (Hsinchu, TW); Jiann-Tyng Tzeng (Hsinchu, TW)
Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
G06F30/394G03F1/36G06F30/392G06F30/3947G06F30/3953G06F2111/04G06F2119/18
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Quick Facts
Patent No.
US 11,768,991
App. No.
17/332,646
Granted
Sep 26, 2023
Kind
B2
Abstract

A method of generating a layout diagram for an integrated circuit. The method includes arranging a plurality of cells in the layout diagram. The method further includes placing a plurality of cell pins over a plurality of selected via placement points in a first cell of the plurality of cells, wherein at least one cell pin of the plurality of cell pins extends along a routing track of a plurality of routing tracks across a boundary of the first cell and into a second cell of the plurality of cells abutting the first cell.

Claims (26)

1. A method of generating a layout diagram for an integrated circuit, the method comprising:

arranging a plurality of cells in the layout diagram; and

placing a plurality of cell pins over a plurality of selected via placement points in a first cell of the plurality of cells, wherein at least one cell pin of the plurality of cell pins extends along a routing track of a plurality of routing tracks across a boundary of the first cell and into a second cell of the plurality of cells abutting the first cell.

2. The method of claim 1 , wherein placing the plurality of cell pins comprises placing the plurality of cell pins based on a design rule.

3. The method of claim 2 , wherein the design rule comprises a minimum end-to-end spacing design rule.

4. The method of claim 1 , further comprising identifying via placement locations within the first cell, wherein placing the plurality of cell pins comprises placing the plurality of cell pins based on the identified via placement locations.

5. The method of claim 4 , wherein identifying via placement locations comprises identifying locations in the first cell separated from power rails.

6. The method of claim 1 , wherein placing the plurality of cell pins comprises placing the plurality of cell pins using an automatic placement routing (APR) tool.

7. The method of claim 1 , wherein placing the plurality of cell pins comprises placing the plurality of cell pins in a metal 2 (M2) layer of the layout diagram.

8. The method of claim 1 , wherein placing the plurality of cell pins includes placing at least one cell pin of the plurality of cell pins offset from a power rail of the first cell.

9. The method of claim 1 , wherein arranging the plurality of cells comprises arranging the plurality of cells having a first power rail along a first boundary of the first cell and a second power rail along a second boundary of the first cell.

10. The method of claim 1 , further comprising fabricating at least one mask based on the layout diagram for forming the integrated circuit.

11. A non-transitory computer readable medium having instructions stored thereon, which when executed by a processor, cause the processor to:

arrange a plurality of cells in a layout diagram; and

place a plurality of cell pins over a plurality of selected via placement points in a first cell of the plurality of cells, wherein at least one cell pin of the plurality of cell pins extends along a routing track of a plurality of routing tracks across a boundary of the first cell and into a second cell of the plurality of cells abutting the first cell.

12. The non-transitory computer readable medium of claim 11 , wherein the instructions, when executed by the processor, cause the processor to instruct a manufacturing device to manufacture a mask based on the placement of the plurality of cell pins.

13. A method of generating a layout diagram for an integrated circuit, the method comprising:

arranging a plurality of cells in the layout diagram, wherein a first cell of the plurality of cells forms an interface with a second cell of the plurality of cells, and a plurality of routing tracks extend across the interface; and

placing a plurality of cell pins over a plurality of selected via placement points in the first cell, wherein a first cell pin of the plurality of cell pins extends along a first routing track of the plurality of routing tracks, and the first cell pin extends across the interface.

14. The method of claim 13 , wherein placing the plurality of cell pins comprises placing a second cell in of the plurality of cell pins extending along a second routing track of the plurality of routing tracks.

15. The method of claim 14 , wherein placing the second cell pin comprises placing the second cell pin extending across the interface.

16. The method of claim 14 , wherein placing the second cell pin comprises placing the second cell pin entirely within the first cell.

17. The method of claim 13 , wherein placing the plurality of cell pins comprises placing the first cell pin a first distance from a pin cell in the second cell, and the first distance is equal to or greater than a minimum spacing distance of the layout diagram.

18. The method of claim 13 , further comprising placing a cell pin in the second cell along the first routing track.

19. The method of claim 18 , wherein placing the cell pin in the second cell comprises placing the cell pin entirely within the second cell.

20. The method of claim 13 , further comprising fabricating at least one mask based on the layout diagram for forming the integrated circuit.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2021
From: SIO, KAM-TOU; TZENG, JIANN-TYNG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 056377/0212 →
Continuity (4)
Continuation 16995509 · Aug 17, 2020
Continuation 16556928 · Aug 30, 2019
Provisional Application 62753427 · Oct 31, 2018
Related Publication 20210286927A1 · Sep 16, 2021