Semiconductor device with field plate electrode
View Patent ↗A semiconductor device includes: a first insulating film provided in a trench reaching a second semiconductor layer from above the second semiconductor region; a second electrode provided in the trench, the second electrode facing the second semiconductor layer via the first insulating film; the second insulating film being provided between the side surface of the second electrode and a fifth insulating film provided between a side surface of the second electrode and the second semiconductor layer, the second insulating film containing a second insulating material having a higher dielectric constant than the first insulating material; a third electrode provided above the second electrode, the first insulating film and the second insulating film, the third electrode facing the first semiconductor region; an interlayer insulating film provided on the third electrode; and a fourth electrode provided above the interlayer insulating film.
1. A semiconductor device comprising:
a first electrode;
a first semiconductor layer of first conductivity type provided on the first electrode;
a first semiconductor region of second conductivity type provided on the first semiconductor layer;
a second semiconductor region of first conductivity type provided on the first semiconductor region;
a first insulating film provided in a trench reaching the first semiconductor layer from above the second semiconductor region via the second semiconductor region and the first semiconductor region, the first insulating film containing a first insulating material;
a second electrode provided in the trench, the second electrode facing the first semiconductor layer via the first insulating film;
a second insulating film provided between the second electrode and a fifth insulating film provided between the second electrode and the first semiconductor layer, the fifth insulating film containing the first insulating material, the second insulating film containing a second insulating material having a higher dielectric constant than the first insulating material;
a third electrode provided above the second electrode and the first insulating film, the third electrode facing the first semiconductor region via a gate insulating film;
an interlayer insulating film provided on the third electrode; and
a fourth electrode provided above the interlayer insulating film, wherein
the second insulating film is not provided at least at a part of the bottom of the trench, and wherein
a distance between an upper end of the second insulating film and the first electrode is longer than a distance between an upper end of the second electrode and the first electrode.
2. The semiconductor device according to claim 1 , wherein a film thickness of the second insulating film between a side surface of the second electrode and the first semiconductor layer is 30% or more of a film thickness of the first insulating film where the second insulating film is not provided, and the first insulating film is provided between the side surface of the second electrode and the first semiconductor layer.
3. The semiconductor device according to claim 1 , further comprising a third insulating film provided between a side surface of the second electrode and the second insulating film, the third insulating film containing the first insulating material.
4. The semiconductor device according to claim 1 , wherein the second insulating film has a first portion and a second portion provided on the first portion, the second portion having a larger film thickness than the first portion in a horizontal direction.
5. The semiconductor device according to claim 1 , wherein the second electrode has a third portion and a fourth portion provided on the third portion, the fourth portion having a larger film thickness than the third portion in a horizontal direction.
6. The semiconductor device according to claim 1 , wherein the first insulating material is silicon oxide, and the second insulating material is silicon nitride.
7. The semiconductor device according to claim 1 , further comprising a second semiconductor layer of first conductivity type provided between the first electrode and the first semiconductor layer.
8. The semiconductor device according to claim 1 , wherein the second insulating film is provided between a side surface of the second electrode and the fifth insulating film provided between the side surface of the second electrode and the first semiconductor layer.
9. The semiconductor device according to claim 1 , wherein a distance between a lower end of the second insulating film and the first electrode is longer than a distance between a lower end of the second electrode and the first electrode.
10. A semiconductor device comprising:
a first electrode;
a first semiconductor layer of first conductivity type provided on the first electrode;
a first semiconductor region of second conductivity type provided on the first semiconductor layer;
a second semiconductor region of first conductivity type provided on the first semiconductor region;
a first insulating film provided in a trench reaching the first semiconductor layer from above the second semiconductor region via the second semiconductor region and the first semiconductor region, the first insulating film containing a first insulating material;
a second electrode provided in the trench, the second electrode facing the first semiconductor layer via the first insulating film;
a second insulating film provided between the second electrode and a fifth insulating film provided between the second electrode and the first semiconductor layer, the fifth insulating film containing the first insulating material, the second insulating film containing a second insulating material having a higher dielectric constant than the first insulating material;
a third electrode provided above the second electrode and the first insulating film, the third electrode facing the first semiconductor region via a gate insulating film;
an interlayer insulating film provided on the third electrode;
a fourth electrode provided above the interlayer insulating film; and
a fourth insulating film provided between the second electrode and the third electrode, wherein
the second insulating film is not provided at least at a part of the bottom of the trench, and wherein
the second insulating film includes a first insulating portion and a second insulating portion, and wherein
the fourth insulating film is provided between the first insulating portion and the second insulating portion.
11. The semiconductor device according to claim 10 , wherein a film thickness of the second insulating film between a side surface of the second electrode and the first semiconductor layer is 30% or more of a film thickness of the first insulating film where the second insulating film is not provided, and the first insulating film is provided between the side surface of the second electrode and the first semiconductor layer.
12. The semiconductor device according to claim 10 , further comprising a third insulating film provided between a side surface of the second electrode and the second insulating film, the third insulating film containing the first insulating material.
13. The semiconductor device according to claim 10 , wherein the second insulating film has a first portion and a second portion provided on the first portion, the second portion having a larger film thickness than the first portion in a horizontal direction.
14. The semiconductor device according to claim 10 , wherein the second electrode has a third portion and a fourth portion provided on the third portion, the fourth portion having a larger film thickness than the third portion in a horizontal direction.
15. The semiconductor device according to claim 10 , wherein the first insulating material is silicon oxide, and the second insulating material is silicon nitride.
16. The semiconductor device according to claim 10 , further comprising a second semiconductor layer of first conductivity type provided between the first electrode and the first semiconductor layer.
17. The semiconductor device according to claim 10 , wherein the second insulating film is not provided at least a part between a lower part of the side surface of the second electrode and the fifth insulating film.
18. The semiconductor device according to claim 10 , wherein the second insulating film is provided between a side surface of the second electrode and the fifth insulating film provided between the side surface of the second electrode and the first semiconductor layer.
19. The semiconductor device according to claim 10 , wherein a distance between a lower end of the second insulating film and the first electrode is longer than a distance between a lower end of the second electrode and the first electrode.
20. The semiconductor device according to claim 10 , wherein a lower end of the first insulating portion and a lower end of the second insulating portion are provided separately from each other.