IP Library Granted Patent US 11,769,949
Granted Patent B2
US 11,769,949 · App. 16/237,583 · Granted Sep 26, 2023

Apparatus with partitioned radio frequency antenna and matching network and associated methods

Inventors: Attila Zolomy (Budapest, HU); Pasi Rahikkala (Vihti, FI); Thomas E. Voor (Cedar Park, TX)
Assignee: Silicon Laboratories Inc.
H01Q7/00H01Q1/2225H01Q1/50H01Q9/14H01Q23/00
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Quick Facts
Patent No.
US 11,769,949
App. No.
16/237,583
Granted
Sep 26, 2023
Kind
B2
Abstract

An apparatus includes a radio frequency (RF) circuit to transmit or receive RF signals. The apparatus further includes a loop antenna to transmit or receive the RF signals. The apparatus further includes an impedance matching circuit coupled to the RF circuit and to the loop antenna. The impedance matching circuit includes lumped reactive components.

Claims (26)

1. An apparatus, comprising:

a radio frequency (RF) circuit to transmit or receive RF signals;

a loop antenna to transmit or receive the RF signals; and

an impedance matching circuit coupled to the RF circuit and to the loop antenna, wherein the impedance matching circuit comprises lumped reactive components, and wherein the lumped reactive components include a single capacitor split into a plurality of series-coupled capacitors to reduce sensitivity to component variations.

2. The apparatus according to claim 1 , wherein the impedance matching circuit comprises a resonant network coupled to a reactive network.

3. The apparatus according to claim 2 , wherein the resonant network comprises a series resonant circuit.

4. The apparatus according to claim 2 , wherein the resonant network comprises a parallel resonant circuit.

5. The apparatus according to claim 2 , wherein the resonant network is series-coupled to the reactive network.

6. The apparatus according to claim 2 , wherein the resonant network is shunt-coupled to the reactive network.

7. The apparatus according to claim 1 , wherein the impedance matching circuit comprises a first reactive network coupled to a second reactive network.

8. The apparatus according to claim 1 , wherein the loop antenna comprises a conductive loop of a substrate.

9. The apparatus according to claim 8 , wherein a side of the conductive loop is disposed along an edge of the substrate.

10. The apparatus according to claim 8 , wherein the matching circuit comprises at least one conductive pattern of the substrate coupled to the lumped reactive components.

11. A method of fabricating an apparatus, the method comprising:

providing a radio frequency (RF) circuit to transmit or receive RF signals;

fabricating a loop antenna to transmit or receive the RF signals; and

providing an impedance matching circuit coupled to the RF circuit and to the loop antenna, wherein the impedance matching circuit comprises lumped reactive components, and wherein the lumped reactive components include a single capacitor split into a plurality of series-coupled capacitors to reduce sensitivity to component variations.

12. The method according to claim 11 , wherein the impedance matching circuit comprises a resonant network coupled to a reactive network.

13. The method according to claim 12 , wherein the resonant network comprises a series resonant circuit.

14. The method according to claim 12 , wherein the resonant network comprises a parallel resonant circuit.

15. The method according to claim 12 , wherein the resonant network is series-coupled to the reactive network.

16. The method according to claim 12 , wherein the resonant network is shunt-coupled to the reactive network.

17. The method according to claim 11 , wherein the impedance matching circuit comprises a first reactive network coupled to a second reactive network.

18. The method according to claim 11 , wherein fabricating the loop antenna to transmit or receive the RF signals comprises fabricating a conductive loop of a substrate.

19. The method according to claim 18 , wherein fabricating the conductive loop of the substrate comprises disposing a side of the conductive loop along an edge of the substrate.

20. The method according to claim 18 , wherein the matching circuit comprises at least one conductive pattern of the substrate coupled to the lumped reactive components.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2019
From: ZÓLOMY, ATTILA; RAHIKKALA, PASI; VOOR, THOMAS E.
To: SILICON LABORATORIES INC.
Reel/Frame 048604/0588 →
Continuity (2)
Continuation In Part 15250719 · Aug 29, 2016
Related Publication 20190140352A1 · May 9, 2019