EMI shielding material, EMI shielding process, and communication module product
Disclosed is an EMI shielding material. The EMI shielding material includes a resin material and metal particles mixed with each other, and the surface of the metal particles has an insulating protective layer. Further disclosed is a communication module product, including a module element arranged on a substrate, and the periphery of the module element that requires EMI shielding is filled with said shielding material. Further disclosed is an EMI shielding process, including the following steps: a. preparing a communication module on which a module element is provided; and b. applying said shielding material to a region of the module element that needs to be EMI shielded on the communication module. The shielding material shields a chip region in a wrapping manner, that is, the shielding material wraps and shields all six surfaces or six directions of the chip, and provides shielding between chips.
1. A communication module product, comprising module elements provided on a substrate, wherein a periphery of the module elements where EMI shielding is to be performed is filled with EMI shielding material, to form a segmental shielding between the module elements, wherein the EMI shielding material comprises a resin material and metal particles, wherein the resin material and the metal particles are mixed with each other, and an insulating protective layer is disposed on a surface of each of the metal particles, and
wherein a material of the metal particles is a gradient composite consisting of silver, gold, copper, chromium, nickel, and nickel-iron, an alloy thereof,
wherein a size of the metal particles is between 0.1 μm and 30 μm, and
wherein the shielding material further comprises a curing agent, wherein the curing agent account for 0.1% to 0.2% of a weight of the shielding material.
2. The communication module product according to claim 1 , wherein the shielding material further comprises silica particles mixed in a specific proportion.
3. The communication module product according to claim 1 , wherein the metal particles account for 1% to 95% of a weight of the shielding material.
4. The communication module product according to claim 1 , wherein the resin material account for 1% to 30% of a weight of the shielding material.
5. The communication module product according to claim 1 , wherein the metal particles comprise a mixture of particles made of different metal materials.
6. The communication module product according to claim 1 , wherein the insulating protective layer on each of the metal particles is a coating of resin, Teflon, silicon nitride or silicon oxide, and a thickness of the insulating protective layer is between 1 nm and 5000 nm.
7. The communication module product according to claim 1 , wherein a region between the module element and the substrate is filled with the EMI shielding material, and a top of the module element is filled with the EMI shielding material.
8. The communication module product according to claim 1 , wherein the EMI shielding material at a top of the module element has a thickness greater than 30 μm.
9. The communication module product according to claim 1 , wherein the communication module product is coated by a metal shielding layer.
10. The communication module product according to claim 1 , wherein the shielding material further comprises alumina particles mixed in a specific proportion.
11. The communication module product according to claim 2 , wherein the silica particles account for 1% to 40% of a weight of the shielding material.
12. The communication module product according to claim 2 , wherein a size of the silica particles is between 0.1 μm and 30 μm.
13. The communication module product according to claim 10 , wherein the alumina particles account for 1% to 40% of a weight of the shielding material.
14. The communication module product according to claim 10 , wherein a size of the alumina particles is between 0.1 μm and 30 μm.
15. An EMI shielding process, comprising:
step a, preparing a communication module on which module elements are provided; and
step b, applying EMI shielding material on a region of the module elements on the communication module where EMI shielding is to be performed, through at least one of a printing process and a dispensing process, to form a segmental shielding between the module elements, wherein the EMI shielding material comprises a resin material and metal particles, the resin material and the metal particles are mixed with each other, an insulating protective layer is disposed on a surface of each of the metal particles, and
wherein a material of the metal particles is a gradient composite consisting of silver, gold, copper, chromium, nickel, and nickel-iron, an alloy thereof,
wherein a size of the metal particles is between 0.1 μm and 30 μm, and
wherein the shielding material further comprises a curing agent, wherein the curing agent account for 0.1% to 0.2% of a weight of the shielding material.
16. The EMI shielding process according to claim 15 , further comprising:
step c, performing injection molding on the communication module after the shielding material is applied.
17. The EMI shielding process according to claim 16 , further comprising:
step d, performing sputtering or spraying on an outer layer of the communication module after the injection molding, to form a metal shielding layer.