Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods
An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.
1. An electronic device selected from a phone, tablet, laptop, or mouse comprising an enclosure that is a housing or case, wherein the housing or case comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles; wherein the cured epoxy resin composition comprises a plurality of microspheres partially embedded in the cured epoxy resin composition.
2. The electronic device of claim 1 wherein the electronic device comprises a battery that can be charged through the cured epoxy resin composition of the housing or case.
3. The electronic device of claim 1 wherein the cured epoxy resin composition comprising the plurality of microspheres partially embedded in the cured epoxy resin composition has a pencil hardness of greater than 6H.
4. The electronic device of claim 1 wherein the cured epoxy resin composition has a thermal conductivity of at least 1 W/m*K.
5. The electronic device of claim 1 wherein the electrically non-conductive thermally conductive particles comprise a material having an electronic band gap >0 eV.
6. The electronic device of claim 1 wherein the cured epoxy resin composition is radio frequency transparent such that the cured epoxy resin composition has a dielectric loss tangent <0.03 ranging from 10 4 to 10 10 Hz.
7. The electronic device of claim 1 wherein the electrically non-conductive thermally conductive particles comprise a material having a bulk thermal conductivity >10 W/m*K.
8. The electronic device of claim 1 wherein the electrically non-conductive thermally conductive particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate, and mixtures thereof.
9. The electronic device of claim 1 wherein the electrically non-conductive thermally conductive particles have a median particle size of less than 20 microns.
10. The electronic device of claim 1 wherein the cured epoxy resin comprises cyclic moieties.
11. The electronic device of claim 1 wherein the cured epoxy resin composition further comprises 2 to 20 wt.-% of oligomeric or polymeric moieties having a glass transition temperature less than 0° C.
12. The electronic device of claim 1 wherein the cured epoxy resin composition has a tensile strain at break ranging from 1 to 10%, an elastic modulus ranging from 5 to 50 GPa, or a combination thereof.
13. The electronic device of claim 11 wherein the oligomeric or polymeric moieties comprises a reacted epoxy-reactive oligomer, the epoxy reactive oligomer having a weight average molecular weight ranging from 100-3000 g/mole.
14. The electronic device of claim 1 wherein the cured epoxy resin composition has a glass transition temperature of less than 150° C.
15. The electronic device of claim 1 wherein the cured epoxy resin composition has a single glass transition temperature or at least two glass transition temperatures.
16. The electronic device of claim 1 wherein the cured epoxy resin composition has a tan delta peak width at half height of less than 50° C.
17. The electronic device of claim 1 wherein the cured epoxy resin composition has a tan delta peak width at half height of 50° C. or greater.
18. An electronic device selected from a phone, tablet, laptop, or mouse comprising an enclosure that is a housing or case, wherein the housing or case comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles; wherein the cured epoxy resin composition has a tan delta peak width at half height of 50° C. or greater.
19. The electronic device of claim 18 wherein the electronic device comprises a battery that can be charged through the cured epoxy resin composition of the housing or case.
20. The electronic device of claim 18 , wherein the cured epoxy resin composition comprises a plurality of microspheres partially embedded in the cured epoxy resin composition.
21. The electronic device of claim 20 wherein the cured epoxy resin composition comprising the plurality of microspheres partially embedded in the cured epoxy resin composition has a pencil hardness of greater than 6H.
22. The electronic device of claim 18 wherein the cured epoxy resin composition has a thermal conductivity of at least 1 W/m*K.
23. The electronic device of claim 18 wherein the electrically non-conductive thermally conductive particles comprise a material having an electronic band gap >0 eV.
24. The electronic device of claim 18 wherein the cured epoxy resin composition is radio frequency transparent such that the cured epoxy resin composition has a dielectric loss tangent <0.03 ranging from 10 4 to 10 10 Hz.
25. The electronic device of claim 18 wherein the electrically non-conductive thermally conductive particles comprise a material having a bulk thermal conductivity >10 W/m*K.
26. The electronic device of claim 18 wherein the electrically non-conductive thermally conductive particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate, and mixtures thereof.
27. The electronic device of claim 18 wherein the electrically non-conductive thermally conductive particles have a median particle size of less than 20 microns.
28. The electronic device of claim 18 wherein the cured epoxy resin comprises cyclic moieties.
29. The electronic device of claim 18 wherein the cured epoxy resin composition further comprises 2 to 20 wt.-% of oligomeric or polymeric moieties having a glass transition temperature less than 0° C.
30. The electronic device of claim 18 wherein the cured epoxy resin composition has a tensile strain at break ranging from 1 to 10%, an elastic modulus ranging from 5 to 50 GPa, or a combination thereof.
31. The electronic device of claim 18 wherein the oligomeric or polymeric moieties comprises a reacted epoxy-reactive oligomer, the epoxy reactive oligomer having a weight average molecular weight ranging from 100-3000 g/mole.
32. The electronic device of claim 18 wherein the cured epoxy resin composition has a glass transition temperature of less than 150° C.
33. The electronic device of claim 18 wherein the cured epoxy resin composition has a single glass transition temperature or at least two glass transition temperatures.