Silicone composition
This silicone composition contains (A) an organopolysiloxane which has at least two aliphatic unsaturated hydrocarbon groups per molecule and has a kinematic viscosity at 25° C. of 60-100,000 mm 2 /s, (B) an organohydrogenpolysiloxane represented by general formula (I) (R 1 is an alkyl group having 1-6 carbon atoms, R 2 is R 1 or a hydrogen atom, n is an integer between 2 and 40, m is an integer between 0 and 98, and the value of n+m is such that 5≤n+m≤100), (C) a flaky graphite powder having an average thickness of 100 nm or less, (D) a thermally conductive filler having a thermal conductivity of 10 W/m·° C. or more, (E) a platinum group metal catalyst and (G) a slightly volatile isoparaffin compound which has a boiling point of 160-360° C. and which can disperse or dissolve the component (A) and the component (B). This silicone composition can give a silicone grease having a higher thermal conductivity and better handleability than conventional silicone greases.
1. A silicone composition comprising:
(A) 100 parts by weight of an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule and a kinematic viscosity at 25° C. of from 60 to 100,000 mm 2/s ,
(B) an organohydrogenpolysiloxane of general formula (1) below in an amount corresponding to 0.5 to 3 moles of silicon-bonded hydrogen atoms per mole of silicon-bonded alkenyl groups in the composition
(wherein each R 1 is independently an alkyl group of 1 to 6 carbon atoms, each R 2 is independently R 1 or a hydrogen atom, n is an integer from 2 to 40, m is an integer from 0 to 98, and n+m satisfies the condition 5≤n+m≤100).
(C) from 1 to 50 parts by weight of flaked graphite powder having an average thickness of 100 nm or less,
(D) from 100 to 4.000 parts by weight of a heat-conductive filler having a thermal conductivity of at least 10 W/m·° C.,
(E) an effective amount of a platinum group metal catalyst, and
(G) from 0.1 to 20 wt %, based on the overall silicone composition, of a slightly volatile isoparaffin compound having a boiling point of between 160° C. and 360° C. that can disperse or dissolve components (A) and (B).
2. The silicone composition of claim I, further comprising (F) a reaction regulator in an amount of from 0.05 to 5 parts by weight per 100 parts by weight of component (A).
3. The silicone composition of claim 1 , further comprising (H) a hydrolyzable alkylpolysiloxane of general formula (2) below
(wherein each R 1 is independently an alkyl group of 1 to 6 carbon atoms, and r is an integer from 5 to 100), in an amount of from 1 to 400 parts by weight per 100 parts by weight of component (A).
4. The silicone composition of claim 1 , further comprising (I) a hydrolyzable organopolysiloxane of general formula (3) below
(wherein each R 1 is independently an alkyl group of 1 to 6 carbon atoms, each R 3 is independently an alkenyl group of 2 to 6 carbon atoms, p is an integer from 1 to 20, q is an integer from 0 to 99, and p+q satisfies the condition 5≤p+q≤100), in an amount of from 1 to 50 parts by weight per 100 parts by weight of component (A).
5. The silicone composition of claim 1 , further comprising (J) organohydrogenpolysiloxane having at least one functional group selected from epoxy, (meth)acryloyl, (meth)acryloxy, alkoxysilyl, ether and carbonyl groups per molecule, in an amount corresponding to from 0.5 to 3 moles of silicon-bonded hydrogen atoms per mole of silicon-bonded alkenyl groups in the composition.
6. The silicone composition of claim 1 , further comprising (K) an organic peroxide having a ten hour half-life temperature of at least 40° C., in an amount of from 0.01 to 10 parts by weight per 100 parts by weight of component (A).