Fin field effect transistor having airgap and method for manufacturing the same
A method of manufacturing a FinFET includes at last the following steps. A semiconductor substrate is patterned to form trenches in the semiconductor substrate and semiconductor fins located between two adjacent trenches of the trenches. Gate stacks is formed over portions of the semiconductor fins. Strained material portions are formed over the semiconductor fins revealed by the gate stacks. First metal contacts are formed over the gate stacks, the first metal contacts electrically connecting the strained material portions. Air gaps are formed in the FinFET at positions between two adjacent gate stacks and between two adjacent strained materials.
1. A fin field effect transistor (FinFET), comprising:
a semiconductor substrate, comprising semiconductor fins disposed thereon and separated from each other;
a plurality of insulators, disposed on the semiconductor substrate, and each being between two adjacent semiconductor fins of the semiconductor fins;
gate structures, disposed over the semiconductor substrate, wherein the gate structures are disposed over portions of the semiconductor fins and portions of the plurality of insulators;
a plurality of sources, each disposed at a first side of a respective one of the gate structures; and
a plurality of drains, each disposed at a second side of a respective one of the gate structures opposing to the first sides,
wherein air gaps are simultaneously disposed in the FinFET at positions between any two adjacent gate structures of the gate structures along a lengthwise direction of the semiconductor fins and in at least one of the insulators.
2. The FinFET of claim 1 , wherein the air gaps are further disposed at positions between any two adjacent sources of the plurality of sources, any two adjacent drains of the plurality of sources, between two adjacent semiconductor fins of the semiconductor fins disposed below the plurality of sources and the plurality of drains.
3. The FinFET of claim 1 , further comprising:
a dielectric layer, disposed in the FinFET and at sidewalls of the air gaps, wherein the air gaps are wrapped by the dielectric layer.
4. The FinFET of claim 1 , further comprising:
first metal contacts, disposed over and electrically connected to the plurality of the sources and the plurality of drains; and
second metal contacts, disposed over and electrically connected to the gate structures.
5. The FinFET of claim 4 , wherein the air gaps are further disposed at positions between any two adjacent sources of the plurality of sources, any two adjacent drains of the plurality of sources, between two adjacent semiconductor fins of the semiconductor fins disposed below the plurality of sources and the plurality of drains, and between the two adjacent first metal contacts of the first metal contacts overlaying the plurality of sources and the plurality of drains.
6. The FinFET of claim 1 , wherein the semiconductor fins are extended along a first direction, the gate structures are extended along a second direction, and the first direction is different from the second direction,
wherein the first sides of the gate structures are opposite to the second sides of the gate structure along the first direction.
7. The FinFET of claim 1 , wherein the gate structures are separated from and spacing away from the plurality of insulators by the air gaps.
8. The FinFET of claim 1 , wherein some sources of the plurality of sources are disposed at the first side of one of the gate structures and are spacing away separated from each other by the air gaps.
9. The FinFET of claim 1 , wherein some drains of the plurality of drains are disposed at the second side of one of the gate structures and are spacing away separated from each other by the air gaps.
10. The FinFET of claim 1 , further comprising:
first silicide layers, wrapping around the plurality of sources; and
second silicide layers, wrapping around the plurality of drains,
wherein the first silicide layers and the second silicide layers are spacing away separated from each other by the air gaps.
11. A fin field effect transistor (FinFET), comprising:
a semiconductor substrate, comprising trenches and semiconductor fins disposed between the trenches;
gate structures, disposed over the semiconductor substrate, wherein the gate structures are disposed over portions of the semiconductor fins and portions of the trenches; and
strained material portions, disposed over portions of the semiconductor fins revealed by the gate structures; and
silicide layers, wrapping around the strained material portions,
wherein air gaps are disposed in the FinFET at positions between any two adjacent gate structures of the gate structures along a lengthwise direction of the semiconductor fins and positions between the gate structures and the semiconductor substrate within the trenches.
12. The FinFET of claim 11 , wherein the air gaps are further disposed at positions between any two adjacent strained material portions of the strained material portions, between two adjacent semiconductor fins of the semiconductor fins underlying the strained material portions, and between the two adjacent silicide layers of the silicide layers,
wherein the two adjacent strained material portions are arranged along a lengthwise direction of the gate structures at one side of a respective one of the gate structures.
13. The FinFET of claim 11 , further comprising:
a dielectric layer, disposed in the FinFET and at sidewalls of the air gaps, wherein the air gaps are wrapped by the dielectric layer.
14. The FinFET of claim 11 , further comprising:
first metal contacts, disposed over and electrically connected to the strained material portions through the silicide layers; and
second metal contacts, disposed over and electrically connected to the gate structures,
wherein the air gaps are further disposed at positions between any two adjacent strained material portions of the strained material portions, between two adjacent semiconductor fins of the semiconductor fins underlying the strained material portions, between the two adjacent silicide layers of the silicide layers, and between the two adjacent first metal contacts of the first metal contacts overlaying the strained material portions.
15. The FinFET of claim 11 , wherein some of the strained material portions being disposed at one side of a respective gate structure of the gate structures are spacing away separated from each other by the air gaps.
16. A fin field effect transistor (FinFET), comprising:
a semiconductor substrate, comprising trenches and semiconductor fins disposed between the trenches;
gate structures, disposed over the semiconductor substrate, wherein the gate structures are disposed over portions of the semiconductor fins and portions of the trenches;
strained material portions, standing on portions of the semiconductor fins revealed by the gate structures;
silicide layers, covering and electrically connected to the strained material portions;
first metal contacts, disposed over and electrically connected to the silicide layers; and
second metal contacts, disposed over and electrically connected to the gate structures,
wherein air gaps are disposed in the FinFET at positions between any two adjacent gate structures of the gate structures along a lengthwise direction of the semiconductor fins and positions between the gate structures and the semiconductor substrate within the trenches.
17. The FinFET of claim 16 , wherein the air gaps are further disposed at positions between any two adjacent strained material portions of the strained material portions, between two adjacent semiconductor fins of the semiconductor fins underlying the strained material portions, between the two adjacent silicide layers of the silicide layers, and between the two adjacent first metal contacts of the first metal contacts overlaying the strained material portions,
wherein the two adjacent strained material portions are arranged along a lengthwise direction of the gate structures at one side of a respective one of the gate structures.
18. The FinFET of claim 16 , further comprising:
a dielectric layer, disposed in the FinFET and at sidewalls of the air gaps, wherein the air gaps are wrapped by the dielectric layer.
19. The FinFET of claim 16 , further comprising:
a plurality of insulators, respectively disposed in the trenches, and each being between two adjacent semiconductor fins of the semiconductor fins,
wherein the gate structures are further disposed over portions of the plurality of insulators, and the air gaps are disposed in the plurality of insulator, wherein the air gaps and a part of the plurality of insulators are between the gate structures and the semiconductor substrate within the trenches.
20. The FinFET of claim 16 , further comprising:
conductive structures, disposed over and electrically connected to the first metal contacts and the second metal contacts.