Cooling device and method of manufacturing the same
A cooling device for cooling a plurality of electronic components mounted on a circuit board. The device includes a contact sheet shaped for conforming to the plurality of electronic components and comprising a mating face for mating against the plurality of electronic components and a cooled face. An enclosure is mounted to the cooled face and defines a coolant transport circuit for circulating coolant liquid therethrough. A coupling may be provided for biassing the mating face toward the plurality of electronic components.
1. A system, comprising:
a device configured to cool a plurality of electronic components having different heights and mounted on a circuit board, the device comprising:
a contact sheet formed of sheet metal and conforming to the plurality of electronic components, the contact sheet comprising a bottom face that is three-dimensionally shaped to mate against the plurality of electronic components having the different heights, the contact sheet further comprising a top face that has a surface with varying heights; and
an enclosure formed of sheet metal and mounted to the top face of the contact sheet, a coolant transport circuit for circulating coolant liquid therethrough being defined by a space between the top face of the contact sheet and the enclosure.
2. The system according to claim 1 , the device further comprising:
a coupling that biases the bottom face of the contact sheet toward the plurality of electronic components.
3. The system according to claim 2 , wherein the coupling connects the contact sheet to the circuit board.
4. The system according to claim 3 , wherein the coupling comprises a plurality of connection points that biases the contact sheet toward the circuit board.
5. The system according to claim 4 , wherein the connection points comprise a fixture to connect to the circuit board and a spring coupled to the fixture and configured to apply a bias force to the contact sheet.
6. The system according to claim 5 , wherein the contact sheet further comprises a plurality of apertures configured to receive the fixtures, wherein, when connected, each fixture connects to the circuit board through a respective aperture.
7. The system according to claim 1 , wherein the contact sheet has a footprint shaped to expose other electronic components mounted to the circuit board.
8. The system according to claim 1 ,
wherein the contact sheet comprises a first sheet section and a second sheet section, and
wherein the enclosure comprises a first enclosure section mounted to the top face of the first sheet section and a second enclosure section mounted to the top face of the second sheet section, the enclosure further comprises a conduit for fluid connection of the first and second enclosure sections.
9. The system according to claim 1 , wherein the enclosure comprises one or more substantially cuboidal fluid transport cavities, the fluid transport cavities being interconnected as part of the coolant transport circuit.
10. The system according to claim 9 , wherein the one or more substantially cuboidal fluid transport cavities have a flattened configuration.
11. The system according to claim 1 , wherein the contact sheet is conformed to each electronic component of the plurality of electronic components.
12. A method comprising:
manufacturing a device configured to cool a plurality of electronic components having different heights and mounted on a circuit board, wherein manufacturing the device comprises:
shaping sheet metal into a contact sheet to conform to the plurality of electronic components, wherein the contact sheet comprises a bottom face that is three-dimensionally shaped to mate against the plurality of electronic components having the different heights, the contact sheet further comprises a top face that has a surface with varying heights; and
mounting an enclosure to the top face of the contact sheet to define a coolant transport circuit for circulating coolant liquid therethrough in a space between the top face of the contact sheet and the enclosure.
13. The method according to claim 12 , wherein shaping the contact sheet comprises shaping the contact sheet to have a footprint shaped to expose other electronic components mounted to the circuit board.
14. The method according to claim 12 , wherein manufacturing the device further comprises forming the enclosure from sheet metal.
15. The method according to claim 12 , wherein manufacturing the device further comprises biasing the bottom face of the contact sheet toward the plurality of electronic components using a coupling.
16. The method according to claim 15 , wherein the coupling connects the contact sheet to the circuit board.
17. The method according to claim 15 , wherein the coupling comprises a plurality of connection points biasing the contact sheet toward the circuit board.
18. The method according to claim 12 , wherein:
the contact sheet comprises a first sheet section and a second sheet section, and
the enclosure comprises a first enclosure section mounted to the top face of the first sheet section and a second enclosure section mounted to the top face of the second sheet section, the enclosure further comprising a conduit for fluid connection of the first and second enclosure sections.
19. The method according to claim 12 , wherein the enclosure comprises one or more substantially cuboidal fluid transport cavities, the fluid transport cavities being interconnected as part of the coolant transport circuit.
20. The method according to claim 19 , wherein the one or more substantially cuboidal fluid transport cavities have a flattened configuration.