Glass dielectric layer with patterning
Embodiments of the present disclosure may generally relate to systems, apparatus, and/or processes directed to a manufacturing process flow for packages that include one or more glass layers that include patterning features, such as electrically conductive traces, RDLs, and vias within the packages. In embodiments, a package may include a glass layer with a first side and a second side opposite the first side, where the glass layer is a dielectric layer. The package may include another layer coupled with the first side of the glass layer, and a pattern on the second side of the glass layer to receive a deposited material in at least a portion of the pattern.
1. A package comprising:
a glass layer with a first side and a second side opposite the first side, wherein the glass layer is a dielectric layer;
another layer coupled with the first side of the glass layer; and
a pattern on the second side of the glass layer to receive a deposited material in at least a portion of the pattern, wherein the pattern includes a trace etched in glass and a through-glass via.
2. The package of claim 1 , wherein the trace etched in glass is to provide a redistribution layer (RDL).
3. The package of claim 2 , wherein the RDL includes a fan out.
4. The package of claim 1 , wherein the deposited material includes copper or a copper alloy, or wherein the deposited material includes a seed layer.
5. The package of claim 1 wherein the another layer is a selected one of a substrate, an adhesive layer, or another glass layer.
6. The package of claim 1 , wherein the glass layer is a first glass layer, and the deposited material is a first deposited material; and
further comprising:
a second glass layer with a first side and a second side opposite the first side, wherein the first side of the second glass layer is coupled with the second side of the first glass layer; and
a pattern on the second side of the second glass layer to receive the second deposited material in at least a portion of the pattern.
7. The package of claim 6 , wherein the another layer is a first another layer; and
further comprising a second another layer between the first side of the second glass layer and the second side of the first glass layer.
8. The package of claim 6 , further comprising the first deposited material and the second deposited material, wherein the first deposited material and the second deposited material are electrically conductive or are electrically coupled.
9. The package of claim 8 , wherein the first deposited material and the second deposited material are different materials.