Semiconductor test device and system and test method using the same
A test method for a semiconductor device includes determining a contact failure between a first semiconductor chip and a second semiconductor chip during assembly of a semiconductor package including the first semiconductor chip and the second semiconductor chip, using a test circuit embedded in the first semiconductor chip, and after the assembly of the semiconductor package, determining whether the semiconductor package is defective by using the test circuit.
1. A method using a semiconductor test device for testing a semiconductor package including a semiconductor chip, the method comprising:
receiving a control signal through a test pad from an external circuit control device;
controlling a test circuit embedded in the semiconductor chip according to the control signal, to cause emission of an electric field from at least a set of microbumps among microbumps connected to the semiconductor package;
using a sensor disposed above an upper surface of the microbumps and spaced apart therefrom by a predetermined interval, to detect the electric field emitted from one or more microbumps of the set of microbumps and to output a signal including information about one or more electric field waveforms; and
using the signal output from the sensor by a signal processing device to determine whether the semiconductor package is defective,
wherein the set of microbumps are bumps for connecting the semiconductor package to an external package substrate.
2. The method of claim 1 , wherein the external circuit control device controls the test circuit to cause emission of the electric field from the set of microbumps, and the set of microbumps includes all microbumps for connecting the semiconductor package to an external package substrate, and
the signal processing device calculates an electric field waveform at a position of each microbump of the set of microbumps, based on the signal output from the sensor, and determines whether the semiconductor package is defective, based on the electric field waveform of each position.
3. The method of claim 1 , wherein the external circuit control device controls the test circuit to cause emission of the electric field from the set of microbumps, which correspond to a specific pattern from among the microbumps for connecting the semiconductor package to the external package substrate, and
the signal processing device calculates an electric field waveform at a position of each of the microbumps of the set of microbumps, based on the signal output from the sensor, and determines whether the semiconductor package is defective based on the electric field waveform of each position.
4. The method of claim 1 , wherein each of the microbumps of the set of microbumps comprises a pillar and a solder layer stacked on the pillar,
wherein the semiconductor test device determines a contact failure between the pillar and the solder layer of each of the microbumps of the set of microbumps.
5. The method of claim 1 , wherein a group of the microbumps connected to the semiconductor package are disposed on lower pads disposed on the semiconductor chip, and the semiconductor test device determines a contact failure between the microbumps and the lower pads.
6. The method of claim 1 , wherein a group of the microbumps connected to the semiconductor package are disposed on lower pads disposed on the semiconductor chip, and the semiconductor test device determines a contact failure between the lower pads and vias connected to the lower pads.
7. The method of claim 1 , wherein the signal processing device calculates an electric field waveform at a position of each of the microbumps connected to the semiconductor package using the signal output from the sensor, and generates an image for identifying a position of a microbump determined as being defective using the electric field waveform for each position, and,
the semiconductor test device determines whether the semiconductor package is defective, based on whether at least one of the microbumps connected to the semiconductor package is defective.
8. The method of claim 7 , wherein the signal processing device receives design data corresponding to each of the microbumps of the semiconductor package, and outputs position information of microbumps, determined to be defective, by matching the image and the design data.
9. The method of claim 1 , wherein the signal processing device determines whether the semiconductor package is defective, based on electric field distribution and an electric field waveform serving as a criterion for determining whether the semiconductor package is defective.
10. The method of claim 1 , wherein when the sensor is a sensor using an electro-optic crystal, the sensor detects the electric field, using a refractive index that varies according to a waveform of the electric field.
11. The method of claim 1 , wherein the semiconductor chip is a base die in the semiconductor package, and the semiconductor package includes one or more additional semiconductor chips disposed below the base die during the emission of the electric field from at least the set of microbumps, so that the base die is between the microbumps and the one or more additional semiconductor chips.
12. The method of claim 11 , wherein controlling the test circuit includes inputting a test signal to a test pad of the base die.
13. A method using a semiconductor test device for testing a semiconductor package including a base die and one or more semiconductor chips formed thereon, the method comprising:
controlling a test circuit embedded in the base die to cause emission of an electric field from at least a set of microbumps among microbumps connected to the base die, wherein the base die is disposed between the one or more semiconductor chips and the set of microbumps;
using a sensor disposed outside of an outer surface of the microbumps and facing the microbumps, and spaced apart from the microbumps by a predetermined interval, to detect the electric field emitted from one or more microbumps of the set of microbumps and to output a signal including information about an electric field waveform; and
using the signal output from the sensor by a signal processing device to determine whether the semiconductor package is defective,
wherein the set of microbumps are exposed externally with respect to the semiconductor package.
14. The method of claim 13 , wherein the microbumps are bumps for connecting the semiconductor package to a wiring circuit board.
15. The method of claim 13 , wherein controlling the test circuit includes inputting a test signal to a test pad of the base die from an external circuit control device.