Semiconductor memory device and manufacturing method of semiconductor memory device
A semiconductor device includes: a substrate extending in a first direction and a second direction intersecting with the first direction; a plurality of input/output pads disposed at one side of the substrate; a first circuit adjacent to the input/output pads in the first direction; a second circuit disposed to be spaced farther apart from the input/output pads in the first direction than the first circuit; a first memory cell array overlapping the first circuit; a second memory cell array overlapping the second circuit; first metal source patterns overlapping the first memory cell array and being spaced apart from each other in the second direction; and a second metal source pattern overlapping the second memory cell array and formed to have a width wider than a width of each of the first metal source patterns in the second direction.
1. A semiconductor memory device comprising:
a bit line;
a common source line overlapping a portion of the bit line;
a gate stack structure including interlayer insulating layers and conductive patterns, which are alternately stacked between the bit line and the common source line;
a channel structure disposed in the gate stack structure, wherein the channel structure extends to be in direct contact with the common source line;
a memory pattern disposed between the channel structure and the gate stack structure; and
a circuit group including a transistor,
wherein the common source line includes a silicide layer,
wherein the silicide layer is in direct contact with an outer surface of an end portion of the channel structure,
wherein the bit line and the gate stack structure are disposed between the circuit group and the common source line,
wherein the channel structure includes a first end portion and a second end portion, the second end portion facing the circuit group, the first end portion facing in a direction opposite to a direction of the second end portion, and
wherein the first end portion of the channel structure includes the outer surface in direct contact with the silicide layer.
2. The semiconductor memory device of claim 1 , wherein the common source line includes tungsten silicide or a nickel silicide, which is in direct contact with the channel structure.
3. A semiconductor memory device comprising:
a bit line;
a common source line overlapping a portion of the bit line;
a gate stack structure including interlayer insulating layers and conductive patterns, which are alternately stacked between the bit line and the common source line;
a channel structure disposed in the gate stack structure, wherein the channel structure extends to be in direct contact with the common source line;
a memory pattern disposed between the channel structure and the gate stack structure;
a bit line contact plug connecting the channel structure and the bit line;
a substrate overlapped by the gate stack structure, wherein the bit line interposed between the substrate and the gate stack structure;
a first interconnection structure disposed between the substrate and the bit line;
a second interconnection structure disposed between the first interconnection structure and the substrate;
a junction region defined in a partial region of the substrate, which is connected to the second interconnection structure, wherein the junction region includes an n-type or p-type impurity; and
bonding metals respectively connected to the first interconnection structure and the second interconnection structure, wherein the bonding metals are bonded to each other.
4. The semiconductor memory device of claim 1 , further comprising:
a metal source pattern overlapping the common source line; and
a source contact plug connecting the metal source pattern and the common source line.
5. The semiconductor memory device of claim 1 , wherein the silicide layer forms an ohmic contact with the channel structure.