Method of manufacturing semiconductor devices and semiconductor devices
In a method of manufacturing a semiconductor device, a gate dielectric layer is formed over a channel region made of a semiconductor material, a first work function adjustment material layer is formed over the gate dielectric layer, an adhesion enhancement layer is formed on the first work function adjustment material layer, a mask layer including an antireflective organic material layer is formed on the adhesion enhancement layer, and the adhesion enhancement layer and the first work function adjustment material layer are patterned by using the mask layer as an etching mask. The adhesion enhancement layer has a higher adhesion strength to the antireflective organic material layer than the first work function adjustment material layer.
1. A method of manufacturing a semiconductor device, comprising:
forming a gate dielectric layer over a channel region made of a semiconductor material;
forming a first work function adjustment material layer over the gate dielectric layer;
forming an adhesion enhancement layer on the first work function adjustment material layer;
forming a mask layer on the adhesion enhancement layer, the mask layer including an antireflective organic material layer; and
patterning the adhesion enhancement layer and the first work function adjustment material layer by using the mask layer as an etching mask,
wherein the adhesion enhancement layer has a higher adhesion strength to the antireflective organic material layer than the first work function adjustment material layer, and
the first work function adjustment material layer is nitrogen free or contains nitrogen in an amount less than 50 atomic % and the adhesion enhancement layer contains nitrogen in a range from 55 atomic % to 75 atomic %.
2. The method of claim 1 , wherein the first work function adjustment material layer contains nitrogen in an amount less than 50 atomic %.
3. The method of claim 1 , wherein the adhesion enhancement layer includes one or more of TiN X , where x is 1.1 to 1.5, TiSiN or AN.
4. The method of claim 3 , further comprising:
removing the mask layer; and
forming a second work function adjustment material layer over the adhesion enhancement layer.
5. The method of claim 1 , wherein the adhesion enhancement layer includes SiN.
6. The method of claim 5 , further comprising:
removing the mask layer;
removing the adhesion enhancement layer; and
forming a second work function adjustment material layer over the first work function adjustment material layer.
7. The method of claim 2 , wherein the adhesion enhancement layer is formed by nitridation of a surface region of the first work function adjustment material layer.
8. The method of claim 1 , wherein a thickness of the adhesion enhancement layer is in a range from 0.2 nm to 2 nm.
9. The method of claim 1 , wherein the adhesion enhancement layer includes AlN.
10. The method of claim 1 , wherein the adhesion enhancement layer includes TiSiN.
11. A method of manufacturing a semiconductor device, comprising:
forming a gate dielectric layer over a channel region made of a semiconductor material;
forming a first work function adjustment material layer over the gate dielectric layer;
forming an adhesion enhancement layer on the first work function adjustment material layer;
forming a mask layer on the adhesion enhancement layer, the mask layer including an antireflective organic material layer; and
patterning the adhesion enhancement layer and the first work function adjustment material layer by using the mask layer as an etching mask,
wherein the adhesion enhancement layer contains nitrogen in a range from 55 atomic % to 75 atomic %, and
a nitrogen concentration of the adhesion enhancement layer is higher than a nitrogen concentration of the first work function adjustment material layer.
12. The method of claim 11 , wherein the first work function adjustment material layer is nitrogen free.
13. The method of claim 11 , wherein the adhesion enhancement layer includes one or more of TiN X , where x is 1.1 to 1.5, TiSiN or AlN.
14. The method of claim 13 , further comprising:
removing the mask layer; and
forming a second work function adjustment material layer over the adhesion enhancement layer.
15. The method of claim 11 , wherein the adhesion enhancement layer includes SiN.
16. The method of claim 15 , further comprising:
removing the mask layer;
removing the adhesion enhancement layer; and
forming a second work function adjustment material layer over the first work function adjustment material layer.
17. The method of claim 12 , wherein the adhesion enhancement layer is formed by nitridation of a surface region of the first work function adjustment material layer.
18. The method of claim 11 , wherein a thickness of the adhesion enhancement layer is in a range from 0.2 nm to 2 nm.
19. The method of claim 11 , wherein the adhesion enhancement layer includes TiN X , where x is 1.1 to 1.5.
20. The method of claim 11 , wherein the adhesion enhancement layer includes TiSiN.