Semiconductor device structure

1. A semiconductor device structure, comprising:

a substrate;

a first fin structure over the substrate; and

a ferroelectric field effect transistor (FeFET) device over a first region of the substrate, the FeFET comprising a first gate stack across the first fin structure;

first gate spacer layers alongside the first gate stack; and

a ferroelectric layer over the first gate stack, wherein at least a portion of the ferroelectric layer is located between upper portions of the first gate spacer layers and is adjacent to the first gate stack.

2. The semiconductor device structure as claimed in claim 1 , further comprising:

a second fin structure over the substrate; and

a logic device over a second region of the substrate, the logic device comprising a second gate stack across the second fin structure;

second gate spacer layers alongside the second gate stack; and

a dielectric capping layer between the second gate spacer layers over the second gate stack, wherein the dielectric capping layer is made of a different material than the ferroelectric layer.

3. The semiconductor device structure as claimed in claim 2 , further comprising:

a first via landing on the ferroelectric layer; and

a second via landing on the second gate stack, and wherein the first via is shorter than the second via.

4. The semiconductor device structure as claimed in claim 2 , wherein the ferroelectric layer covers upper surfaces of the first gate spacer layers, and the dielectric capping layer covers the upper surfaces of the second gate spacer layers.

5. The semiconductor device structure as claimed in claim 1 , wherein the first fin structure includes a set of nanostructures vertically stacked over the substrate.

6. The semiconductor device structure as claimed in claim 1 , wherein a sidewall of the ferroelectric layer is aligned with a sidewall of the first gate stack.

7. The semiconductor device structure as claimed in claim 1 , further comprises:

a dielectric capping layer between the first gate spacer layers over the first gate stack; and

an interlayer dielectric layer over the dielectric capping layer and the first gate spacer layers, wherein the ferroelectric layer passes is embedded in the interlayer dielectric layer and the dielectric capping layer.

8. A semiconductor device structure, comprising:

a first set of nanostructures over a substrate;

a first gate stack wrapping around the first set of nanostructures;

a first ferroelectric layer directly above the first gate stack;

an interlayer dielectric layer surrounding the first gate stack and the first ferroelectric layer; and

a via through the interlayer dielectric layer and coupling to the first ferroelectric layer.

9. The semiconductor device structure as claimed in claim 8 , further comprising:

a second set of nanostructures over a substrate, wherein the second set of nanostructures includes fewer nanostructures than the first set of nanostructures;

a second gate stack wrapping around the second set of nanostructures; and

a second ferroelectric layer directly above the second gate stack, wherein the interlayer dielectric layer surrounds the second gate stack and the second ferroelectric layer.

10. The semiconductor device structure as claimed in claim 8 , further comprising:

a bottom electrode layer between the first ferroelectric layer and the first gate stack; and

a top electrode layer between the first ferroelectric layer and the via.

11. The semiconductor device structure as claimed in claim 10 , wherein the bottom electrode layer is made of TiN, TaN, W, or Ru, the top electrode layer is made of TiN, TaN, or WN, and the first ferroelectric layer is made of HfZrO, HfLaO, HfSiO, or HfAlO.

12. The semiconductor device structure as claimed in claim 10 , wherein the top electrode layer has a U-shape and the via is nested within the top electrode layer.

13. The semiconductor device structure as claimed in claim 8 , wherein a sidewall of the first ferroelectric layer and a sidewall of the via share a continuous surface.

14. A semiconductor device structure, comprising:

a first active region and a second active region over a substrate;

a first gate stack surrounding the first active region and a second gate stack surrounding the second active region;

a first dielectric capping layer over the first gate stack;

a ferroelectric layer over the second gate stack, wherein the first dielectric capping layer and the ferroelectric layer are made of different materials;

a first via through the first dielectric capping layer and on the first gate stack; and

a top electrode layer on the ferroelectric layer.

15. The semiconductor device structure as claimed in claim 14 , further comprising:

a second via on the top electrode layer, wherein an upper surface of the first via is substantially level with an upper surface of the second via.

16. The semiconductor device structure as claimed in claim 14 , further comprising:

a second via nested within the top electrode layer, wherein an upper surface of the second via is substantially level with an upper surface of the top electrode layer.

17. The semiconductor device structure as claimed in claim 14 , wherein the first active region includes a first set of nanostructures vertically stacked and spaced apart from one another, and a second active region includes a second set of nanostructures vertically stacked and spaced apart from one another.

18. The semiconductor device structure as claimed in claim 14 , wherein each of the first gate stack and the second gate stack comprises a gate electrode layer, wherein the first dielectric capping layer is in contact with the gate electrode layer of the first gate stack, and the ferroelectric layer is separated from the gate electrode layer of the second gate stack.

19. The semiconductor device structure as claimed in claim 14 , further comprising:

a second dielectric capping layer over the second gate stack and surrounding the ferroelectric layer, wherein an upper surface of the first dielectric capping layer is substantially level with an upper surface of the second dielectric capping layer.

20. The semiconductor device structure as claimed in claim 14 , further comprising:

a first gate spacer layers interposed by the first gate stack and the first dielectric capping layer; and

a second gate spacer layers interposed by the second gate stack and the ferroelectric layer.