Electronic device housing having a radio-frequency transmissive component

1. An electronic device comprising:

a radio-frequency (RF) component; and

an enclosure defining an internal cavity and at least partially surrounding the RF component, the enclosure comprising:

a housing formed from a metal material and defining:

a first exterior surface of the enclosure;

a first surface extending inward from a first portion of the first exterior surface,

a second surface facing the first surface and extending inward from a second portion of the first exterior surface; and

a retention feature extending into the internal cavity; and

a window formed from an RF-transmissive material, positioned over the RF component, adhered to the first and the second surfaces, and engaged with the retention feature, the RF-transmissive material defining a second exterior surface of the enclosure and including a thermoset composite material comprising nano-sized silica particles dispersed within a thermoset matrix.

2. The electronic device of claim 1 , wherein the thermoset composite material has:

a hardness from 70 to 95 on a Shore D hardness scale; and

an impact strength from 50 J/m to 90 J/m.

3. The electronic device of claim 1 , wherein the thermoset composite material has a dielectric constant from 2 to 4 as measured at a frequency of 2.5 GHz.

4. The electronic device of claim 1 , wherein:

the first and the second portions of the first exterior surface and the second exterior surface together define a curved region of the enclosure.

5. The electronic device of claim 1 , wherein the RF component is part of a wireless communication system.

6. The electronic device of claim 1 , wherein the RF component is a wireless receiver component of a wireless charging system.

7. The electronic device of claim 1 , wherein:

the thermoset composite material is a first thermoset composite material;

the thermoset matrix is a first thermoset matrix; and

the window further comprises a second thermoset composite material comprising fibers dispersed within a second thermoset matrix and defining a portion of an interior surface of the enclosure.

8. An electronic device comprising:

an enclosure comprising:

a housing component formed from a metal material and defining:

a first exterior surface of the enclosure;

an opening extending from the first exterior surface of the enclosure to an interior surface of the housing component; and

a retention feature positioned along the interior surface of the housing component; and

a dielectric component positioned within the opening, adhered to the housing component, and interlocked with the retention feature, the dielectric component defining a second exterior surface of the enclosure and including a thermoset composite material comprising an epoxy matrix and nano-sized silica particles dispersed within the epoxy matrix; and

a RF component positioned within the enclosure and below the dielectric component.

9. The electronic device of claim 8 , wherein:

the electronic device further comprises wireless transmission circuitry;

the RF component is an antenna operably coupled to the wireless transmission circuitry; and

the dielectric component defines an RF-transmissive window for the antenna.

10. The electronic device of claim 8 , wherein:

the thermoset composite material has an ultimate tensile strength from 30 MPa to 50 MPa and an elongation from 10% to 15%.

11. The electronic device of claim 8 , wherein:

the opening of the housing component is partially defined by:

a first surface extending from a first portion of the first exterior surface of the enclosure to a first portion of the interior surface of the housing component; and

a second surface facing the first surface and extending from a second portion of the first exterior surface of the enclosure to a second portion of the interior surface of the housing component; and

the dielectric component is adhered to each of the first and the second surfaces.

12. The electronic device of claim 11 , wherein:

the retention feature is a first retention feature; and

the housing component further defines a second retention feature along the first surface and a third retention feature along the second surface.

13. The electronic device of claim 11 , further comprising:

a first anodization layer along the first surface and defining a first set of nano-sized pores; and

a second anodization layer along the second surface and defining a second set of nano-sized pores, the dielectric component extending at least partially into the first set of nano-sized pores and the second set of nano-sized pores.

14. The electronic device of claim 13 , wherein:

the housing component comprises a third anodization layer, different from the first anodization layer, along the first exterior surface of the enclosure.