Inductor component
An inductor component comprising a first magnetic layer and a second magnetic layer containing a resin, a substrate of a sintered body having a first principal surface in close contact with the first magnetic layer and a second principal surface above which the second magnetic layer is disposed, and a spiral wiring disposed between the second magnetic layer and the substrate.
1. An inductor component comprising:
a first magnetic layer and a second magnetic layer containing a resin;
a substrate of a sintered body having a first principal surface in close contact with the first magnetic layer and a second principal surface above which the second magnetic layer is disposed;
a spiral wiring disposed between the second magnetic layer and the substrate;
an insulating layer that directly contacts the sub state and separates the spiral winding from the substrate; and
a second insulating layer disposed on the insulating layer,
wherein
the spiral wiring includes a spiral-shaped first conductor layer and a second conductor layer disposed on the first conductor layer and shaped along the first conductor layer, and a width of a bottom of the first conductor layer is larger than a width of the second conductor layer,
a taper angle of a side surface of the first conductor layer is larger than a taper angle of a side surface of the second conductor layer, and
the spiral wiring is covered with the second insulating layer, and the side surfaces of the first and second conductor layers are external side surfaces that directly contact the second insulating layer.
2. The inductor component according to claim 1 , wherein the substrate is a magnetic substance.
3. The inductor component according to claim 1 , wherein the first magnetic layer and the second magnetic layer contain a metal magnetic powder contained in the resin, and wherein the substrate is a sintered body of ferrite.
4. The inductor component according to claim 3 , wherein the first magnetic layer and the second magnetic layer further contain a ferrite powder.
5. The inductor component according to claim 1 , wherein a sum of the thickness of the first magnetic layer and the thickness of the second magnetic layer is larger than the thickness of the substrate.
6. The inductor component according to claim 5 , wherein the thickness of the first magnetic layer and the thickness of the second magnetic layer are both larger than the thickness of the substrate.
7. The inductor component according to claim 1 , wherein the electrical resistivity of the first magnetic layer and the electrical resistivity of the second magnetic layer are higher than the electrical resistivity of the substrate.
8. The inductor component according to claim 1 , wherein a side surface connecting the first principal surface and the second principal surface of the substrate is at least partially covered with the first magnetic layer or the second magnetic layer.
9. The inductor component according to claim 1 , wherein the substrate has a crack portion.
10. The inductor component according to claim 1 , wherein
the insulating layer is disposed on the second principal surface of the substrate, wherein
the spiral wiring is formed on the insulating layer.
11. The inductor component according to claim 1 , wherein the spiral wiring is disposed on the second principal surface of the substrate.
12. The inductor component according to claim 1 , wherein
the first conductor layer has a thickness of 0.5 μm or more.
13. The inductor component according to claim 1 , wherein
the first conductor layer has a Ni content percentage of 5.0 wt % or less.
14. The inductor component according to claim 1 , wherein
the spiral wiring is one of a plurality of spiral wirings arranged in a lamination direction, and wherein the plurality of spiral wirings is connected in series.
15. The inductor component according to claim 1 , wherein
the spiral wiring is one of a plurality of spiral wirings disposed on the same plane, and wherein
the spiral wirings adjacent to each other on the same plane include side surfaces facing each other, wherein the side surfaces are at least partially in contact with the second magnetic layer, and wherein
an insulating layer is disposed between the spiral wirings adjacent to each other.
16. The inductor component according to claim 1 , wherein the spiral wiring includes an exposed portion exposed to the outside from a side surface parallel to the lamination direction of the inductor component.
17. The inductor component according to claim 16 , wherein a thickness of an exposed surface of the exposed portion is equal to or less than the thickness of the spiral wiring and is 45 μm or more.
18. The inductor component according to claim 17 , wherein the exposed surface is an oxide film.