Die bonding system with wafer lift and level assembly

1. A wafer lift and level assembly comprising:

a wafer frame;

at least three guide clevises;

a levelling pedestal comprising levelling pedestal wafer retainers disposed in a top portion of the levelling pedestal,

wherein the wafer frame comprises tabs configured to be slidably retained in the guide clevises, allowing for vertical movement of the wafer frame therein, and wafer frame wafer retainers configured to securely hold a wafer thereto,

wherein the levelling pedestal and guide clevises are configured for vertical motion relative to one another, allowing a wafer disposed in the wafer frame to be brought into contact with the levelling pedestal wafer retainers disposed in the top portion of the levelling pedestal,

and wherein the levelling pedestal wafer retainers are configured to allow a wafer to be secured to the levelling pedestal.

2. The wafer lift and level assembly of claim 1 wherein the guide clevises comprise an open top portion, allowing the wafer frame to be inserted therein.

3. The wafer lift and level assembly of claim 1 wherein each of the guide clevises comprises at least one dashpot configured to be disposed between one of the tabs of the wafer frame and the guide clevis.

4. The wafer lift and level assembly of claim 3 wherein the dashpots are pneumatic dashpots.

5. The wafer lift and level assembly of claim 1 wherein the wafer frame wafer retainers are suction cups.

6. The wafer lift and level assembly of claim 1 wherein the wafer frame wafer retainers are vacuum ports in communication with a vacuum source.

7. The wafer lift and level assembly of claim 1 wherein the levelling pedestal further comprises a heater assembly.

8. The wafer lift and level assembly of claim 7 wherein the heater assembly further comprises an aperture.

9. The wafer lift and level assembly of claim 8 further comprising a focused energy source configured to heat a wafer held by the wafer frame when disposed in the guide devises through the aperture disposed in the heater assembly.

10. The wafer lift and level assembly of claim 9 wherein the focused energy source is a laser.

11. The wafer lift and level assembly of claim 10 wherein the heater assembly is configured to be controllably raised and lowered within the levelling pedestal, thereby bringing it into and out of contact with a wafer disposed on the levelling pedestal.

12. A method of planarizing a wafer, the method comprising:

providing a wafer lift and level assembly comprising:

a wafer frame;

at least three guide clevises;

a levelling pedestal comprising levelling pedestal wafer retainers disposed in a top portion of the levelling pedestal,

wherein the wafer frame comprises tabs configured to be slidably retained in the guide clevises, allowing for vertical movement of the wafer frame therein, and wafer frame wafer retainers configured to securely hold a wafer thereto,

wherein the levelling pedestal and guide clevises are configured for vertical motion relative to one another, allowing a wafer disposed in the wafer frame to be brought into contact with the levelling pedestal wafer retainers disposed in the top portion of the levelling pedestal,

and wherein the levelling pedestal wafer retainers are configured to allow a wafer to be secured to the levelling pedestal

attaching a wafer to the wafer frame;

disposing the wafer frame tabs in the guide clevises; and

raising the levelling pedestal until a bottom portion of the wafer frame tabs ceases to contact a bottom portion of the guide clevises.

13. The method of claim 12 wherein the method further comprises activating the levelling pedestal wafer retainers once the levelling pedestal contacts the wafer.

14. The method of claim 12 wherein the levelling pedestal further comprises a heater, the method further comprising activating the heater during die bonding operations.

15. The method of claim 14 wherein the heater slidably disposed within the levelling pedestal, the method further comprising raising and lowering the heater during die bonding operations.

16. The method of claim 14 wherein the heater further comprises a central aperture and the levelling pedestal further comprises a focused energy source aimed through the central aperture, the method further comprising activating the focused energy source during a die bonding operation.

17. A wafer lift and level assembly comprising:

a wafer frame;

at least three guide clevises;

a levelling pedestal comprising levelling pedestal wafer retainers disposed in a top portion of the levelling pedestal,

wherein the wafer frame comprises tabs configured to be slidably retained in the guide clevises, allowing for vertical movement of the wafer frame therein, and wafer frame wafer retainers configured to securely hold a wafer thereto,

wherein the levelling pedestal and guide clevises are configured for vertical motion relative to one another, allowing a wafer disposed in the wafer frame to be brought into contact with the levelling pedestal wafer retainers disposed in the top portion of the levelling pedestal,

wherein the levelling pedestal wafer retainers are configured to allow a wafer to be secured to the levelling pedestal,

wherein the guide clevises comprise an open top portion, allowing the wafer frame to be inserted therein,

wherein each of the guide clevises comprises at least one dashpot configured to be disposed between a tab of the wafer frame and the guide clevis,

wherein the wafer frame wafer retainers are vacuum ports in communication with a vacuum source,

wherein the levelling pedestal further comprises a heater assembly comprising an aperture and the levelling pedestal further comprises a focused energy source configured to heat a wafer held by the wafer frame when disposed in the guide clevises through the aperture disposed in the heater assembly, and

wherein the heater assembly is configured to be controllably raised and lowered within the levelling pedestal, thereby bringing it into and out of contact with a wafer disposed on the levelling pedestal.