Semiconductor device having controller with graphite sheet

1. A semiconductor device, comprising:

a substrate that has a first surface and a second surface on which a plurality of solder balls are provided;

a semiconductor memory on the first surface of the substrate;

a controller on the first surface of the substrate, separated from the semiconductor memory along a first direction, and configured to control the semiconductor memory;

a graphite sheet extending along the first direction above the controller and the semiconductor memory;

a first heat conductive plate between the controller and the graphite sheet;

an insulating sheet between the graphite sheet and the first heat conductive plate;

a first bonding wire connected to the controller;

an insulating film between the controller and the first heat conductive plate; and

a first sealing material that seals the semiconductor memory, the controller, and the graphite sheet, wherein

at least a part of the first bonding wire is between the controller and the first heat conductive plate.

2. The semiconductor device according to claim 1 , further comprising:

a second heat conductive plate on an upper surface of the graphite sheet; and

a second sealing material that seals the graphite sheet and the second heat conductive plate.

3. The semiconductor device according to claim 2 , wherein a surface area of the graphite sheet is substantially the same as a surface area of the insulating sheet.

4. The semiconductor device according to claim 2 , wherein a surface of the second heat conductive plate that contacts the graphite sheet has an area larger than an area of a surface of the first heat conductive plate that contacts the insulating sheet.

5. The semiconductor device according to claim 4 , wherein a surface of the graphite sheet has an area larger than the area of the surface of the second heat conductive plate that contacts the graphite sheet.

6. The semiconductor device according to claim 1 , wherein a surface area of the graphite sheet is smaller than an area of a surface of the first sealing material that extends along the surface of the graphite sheet.

7. The semiconductor device according to claim 1 , wherein the graphite sheet has a surface area that is smaller than an area of the first surface of the substrate.

8. The semiconductor device according to claim 1 , wherein the graphite sheet has a higher heat conductivity in a direction parallel to the substrate than a direction perpendicular to the substrate.

9. The semiconductor device according to claim 1 , wherein the graphite sheet has a same heat conductivity in a direction parallel to the substrate and in a direction perpendicular to the substrate.

10. The semiconductor device according to claim 1 , wherein the semiconductor memory includes a plurality of memories that are stacked such that an upper memory is shifted from a lower memory by a particular distance along the first direction.

11. The semiconductor device according to claim 1 , further comprising:

a temperature sensor arranged on the first surface of the substrate closer to the controller than the semiconductor memory.

12. A semiconductor device, comprising:

a substrate that has a first surface and a second surface on which a plurality of solder balls are provided;

a semiconductor memory on the first surface of the substrate;

a controller on the first surface of the substrate, separated from the semiconductor memory along a first direction, and configured to control the semiconductor memory;

a first heat conductive plate above the controller;

a sealing material that seals the semiconductor memory, the controller, and the first heat conductive plate;

a first bonding wire connected to the controller; and

an insulating film between the controller and the first heat conductive plate, wherein

at least a part of the first bonding wire is between the controller and the first heat conductive plate.

13. The semiconductor device according to claim 12 , wherein an upper surface of the first heat conductive plate is exposed through the sealing material.

14. The semiconductor device according to claim 12 , further comprising:

a second bonding wire connected to an upper surface of the first heat conductive plate, wherein

the sealing portion further seals the second bonding wire.

15. The semiconductor device according to claim 12 , further comprising:

a heat conductive member above an upper surface of the first heat conductive plate.

16. The semiconductor device according to claim 15 , further comprising:

an insulating sheet between the first heat conductive plate and the heat conductive member.

17. The semiconductor device according to claim 12 , wherein the semiconductor memory includes a plurality of memories that are stacked such that an upper memory is shifted from a lower memory by a particular distance along the first direction.

18. A semiconductor device, comprising:

a substrate that has a first surface and a second surface on which a plurality of solder balls are provided;

a semiconductor memory on the first surface of the substrate;

a controller on the first surface of the substrate, separated from the semiconductor memory along a first direction, and configured to control the semiconductor memory;

a graphite sheet extending along the first direction above the controller and the semiconductor memory; and

a first sealing material that seals the semiconductor memory, the controller, and the graphite sheet, wherein

a surface area of the graphite sheet is smaller than an area of a surface of the first sealing material that extends along the surface of the graphite sheet.

19. The semiconductor device according to claim 18 , further comprising:

a first heat conductive plate between the controller and the graphite sheet.

20. The semiconductor device according to claim 18 , further comprising:

a second heat conductive plate on an upper surface of the graphite sheet; and

a second sealing material that seals the graphite sheet and the second heat conductive plate.