Non-galvanic interconnect for planar RF devices
A radio frequency (RF) system including first and second planar RF devices coupled by non-galvanic interconnect. According to various embodiments, a first RF device and a second RF device are separated by a dielectric layer, each of the first and second RF devices including a plurality of pads disposed on surface and surrounded by a common electrode, the common electrode configured as a grounded metal shield, wherein pads of the first RF device and pads of the second RF device face each other to provide capacitive coupling between the pads. The disclosure may reduce complexity and size of the system, and offer more reliable and easily producible interconnection between elements of the RF system.
1. A radio frequency (RF) system comprising:
a first RF device and a second RF device separated by a dielectric layer,
each of the first RF device and the second RF device including a plurality of pads disposed on a surface of the device, the pads being surrounded by a common electrode, the common electrode configured as a grounded metal shield,
wherein pads of the first RF device and pads of the second RF device face each other to provide capacitive coupling between the pads and the common electrodes, and
wherein the RF system is configured to transmit signals between the first RF device and the second RF device through the pads.
2. The radio frequency system according to claim 1 , wherein:
the first RF device comprises a first printed circuit board including a part of an RF path of the radio frequency system,
the part of the RF path part including transmission lines connected to the pads through vias and connected to the common electrode,
the second RF device comprises a second printed circuit board including another part of the RF path of the radio frequency system, and
the other part of the RF path including transmission lines connected to the pads through vias and connected to the common electrode.
3. The radio frequency system according to claim 2 , wherein the first RF device comprises an antenna array, and the second RF device comprises a control radio frequency integrated circuit (RFIC).
4. The radio frequency system according to claim 2 , wherein the vias are shifted relative to a center of the pads.
5. The radio frequency system according to claim 2 , wherein vias of the first RF device are shifted relative to vias of the second RF device.
6. The radio frequency system according to claim 2 , wherein a matching transformer is provided at an end of a transmission line that is in contact with the vias.
7. The radio frequency system according to claim 6 , wherein the matching transformer comprises a quarter-wave transformer configured as a transmission line end section having a width greater than a width of the the transmission line.
8. The radio frequency system according to claim 2 , wherein the transmission line includes at least one of: a symmetrical microstrip line, a non-symmetrical microstrip line, a coaxial line, a substrate integrated waveguide, a waveguide with dielectric filling, a waveguide without dielectric filling, a coplanar line, a grounded coplanar line.
9. The radio frequency system according to claim 1 , wherein pads of the first RF device and pads of the second RF device are aligned with each other.
10. The radio frequency system according to claim 1 , further comprising at least one printed circuit board disposed between the first RF device and the second RF device, the at least one printed circuit board including, on opposite surfaces, pads aligned with pads of the first RF device and the second RF device, respectively, wherein pads on opposite surfaces of the at least one printed circuit board are interconnected by vias and transmission lines.
11. The radio frequency system according to claim 1 , wherein the RF devices are separated from each other by a layer of air, a gap between the RF devices being provided by spacers.
12. The radio frequency system according to claim 11 , wherein the spacers comprise a dielectric.
13. The radio frequency system according to claim 1 , wherein the RF devices are separated from each other by a layer of dielectric material.
14. The radio frequency system according to claim 13 , wherein the dielectric material comprises a solid dielectric material.