IP Library › Granted Patent US 11,794,679
Granted Patent B2
US 11,794,679 · App. 17/337,464 · Granted Oct 24, 2023

Occupant protection device

Inventors: Shunpei Yamazaki (Setagaya, JP); Takayuki Ikeda (Atsugi, JP); Yoshiyuki Kurokawa (Sagamihara, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
B60R21/0134B60R21/00G06V20/56B60R21/013B60R2021/01013B60R2021/01211G06T2207/30252
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Quick Facts
Patent No.
US 11,794,679
App. No.
17/337,464
Granted
Oct 24, 2023
Kind
B2
Abstract

An occupant protection device which can protect an occupant without delay is provided. An image taken by an imaging device is analyzed to judge whether there is an object approaching the subject car. In the case where a collision between the object and the subject car is judged to be inevitable, an airbag device is activated before the collision, whereby the occupant can be protected without delay. By using selenium for a light-receiving element of the imaging device, an accurate image can be obtained even under low illuminance. Imaging in a global shutter system leads to an accurate image with little distortion. This enables more accurate image analysis.

Claims (30)

1. An imaging device comprising:

a pixel portion comprising a plurality of pixels arranged in a matrix; and

a driver circuit configured to convert an analog signal read from the plurality of pixels to a digital signal,

wherein each of the plurality of pixels comprises a light-receiving element, a first transistor, and a capacitor which is electrically connected to a cathode of the light-receiving element through the first transistor,

wherein the driver circuit comprises a second transistor,

wherein the second transistor is provided on a different layer from the first transistor, the capacitor, and the light-receiving element, and

wherein the first transistor and the capacitor are overlapped with an anode of the light-receiving element.

2. The imaging device according to claim 1 ,

wherein a first electrode of the capacitor is electrically connected to the cathode of the light-receiving element through the first transistor, and

wherein a second electrode of the capacitor is electrically connected to the anode of the light-receiving element.

3. The imaging device according to claim 1 , wherein the first transistor comprises an oxide semiconductor in a channel formation region.

4. The imaging device according to claim 1 , wherein the light-receiving element comprises selenium.

5. The imaging device according to claim 1 , wherein the imaging device is configured to operate in a global shutter system.

6. The imaging device according to claim 1 , further comprising a wiring including copper,

wherein the wiring is electrically connected to the first transistor.

7. An imaging device comprising:

a pixel portion comprising a plurality of pixels arranged in a matrix; and

a driver circuit configured to convert an analog signal read from the plurality of pixels to a digital signal,

wherein each of the plurality of pixels comprises a light-receiving element, a first transistor, and a capacitor which is electrically connected to a cathode of the light-receiving element through the first transistor,

wherein the driver circuit comprises a second transistor,

wherein the second transistor is provided on a different layer from the first transistor, the capacitor, and the light-receiving element,

wherein the first transistor and the capacitor are overlapped with an anode of the light-receiving element,

wherein a first electrode of the capacitor is provided on the same layer as a first conductive layer which is electrically connected to a source or drain of the first transistor, and

wherein a second electrode of the capacitor is provided on the same layer as a second conductive layer as a gate of the first transistor.

8. The imaging device according to claim 7 , wherein the first electrode of the capacitor is electrically connected to the cathode of the light-receiving element through the first transistor.

9. The imaging device according to claim 7 , wherein the first transistor comprises an oxide semiconductor in a channel formation region.

10. The imaging device according to claim 7 , wherein the light-receiving element comprises selenium.

11. The imaging device according to claim 7 , wherein the imaging device is configured to operate in a global shutter system.

12. The imaging device according to claim 7 , further comprising a wiring including copper,

wherein the wiring is electrically connected to the first transistor.

Priority Claims (1)
JP 2015-012880 · Jan 27, 2015 · national
Continuity (2)
Continuation 15544087
Related Publication 20210291771A1 · Sep 23, 2021