IP Library › Granted Patent US 11,796,260
Granted Patent B2
US 11,796,260 · App. 16/849,651 · Granted Oct 24, 2023

System for thermal management in multiple operating conditions

Inventor: Tianyi Gao (San Jose, CA)
Assignee: BAIDU USA LLC
F28D20/028F28D2020/0078
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Quick Facts
Patent No.
US 11,796,260
App. No.
16/849,651
Granted
Oct 24, 2023
Kind
B2
Abstract

Embodiments are disclosed of an apparatus including a cooling loop and a heating loop. The cooling loop includes a temperature control plate having a fluid inlet and a fluid outlet, the temperature control plate being adapted to be thermally coupled to one or more heat-generating electronic components. An inlet control is fluidly coupled to the fluid inlet of the temperature control plate and an outlet control fluidly coupled to the fluid outlet of the temperature control plate. A cooling fluid source is fluidly coupled the inlet control and a cooling fluid return fluidly coupled to the outlet control. The heating loop contains less fluid than the cooling loop and includes a heating fluid source fluidly coupled the inlet control and a heating fluid return fluidly coupled to the outlet control. A pump can circulate heating fluid through at least the heating fluid supply, the temperature control plate, and the heating fluid return.

Claims (54)

1. An apparatus comprising:

a cooling loop to circulate a working fluid, the cooling loop including:

at least one temperature control plate having a fluid inlet and a fluid outlet, the temperature control plate adapted to be thermally coupled to one or more heat-generating electronic components,

an inlet control fluidly coupled to the fluid inlet of the at least one temperature control plate and an outlet control fluidly coupled to the fluid outlet of the at least one temperature control plate, and

a cooling fluid source fluidly coupled the inlet control and a cooling fluid return fluidly coupled to the outlet control; and

at least one heating loop to circulate the working fluid, the at least one heating loop being shorter than the cooling loop and including:

a heating fluid source fluidly coupled the inlet control and a heating fluid return fluidly coupled to the outlet control, and

a pump to circulate heating fluid through at least the heating fluid source, the temperature control plate, and the heating fluid return.

2. The apparatus of claim 1 wherein the inlet control, the outlet control, or both, are three-way valves.

3. The apparatus of claim 1 wherein the temperature control plate includes a heater to heat fluid circulating through the temperature control plate.

4. The apparatus of claim 1 wherein the temperature control plate is a cooling plate and the heating loop further includes at least one heating plate separate from the cooling plate to heat the working fluid circulating through the heating loop.

5. The apparatus of claim 4 wherein:

the cooling loop includes two or more cooling plates;

the heating loop includes two or more heating plates; or

the cooling loop includes two or more cooling plates and the heating loop includes two or more heating plates.

6. The apparatus of claim 4 wherein the heating plate comprises:

a first module comprising:

a thermally conductive first base having at least one heater positioned therein, and

a plurality of first fins thermally coupled to an interior side of the first base and projecting therefrom;

a second module comprising:

a thermally conductive second base having at least one heater positioned therein,

a sidewall around the perimeter of an interior side of the second base,

a plurality of second fins thermally coupled to the interior side of the second base and projecting therefrom, and

a fluid port on an exterior side of the second base, the fluid port including an inlet and an outlet;

wherein the first module is joined to the second module so that the first base, the second base, and the sidewall form a sealed interior cavity, wherein the sealed interior cavity is fluidly coupled to the fluid port so that a working fluid can enter and exit the sealed interior cavity through the fluid port.

7. The apparatus of claim 1 wherein the cooling loop is an open loop.

8. An apparatus comprising:

a cooling loop to circulate a working fluid, the cooling loop including:

at least one temperature control plate having a fluid inlet and a fluid outlet, the temperature control plate adapted to be thermally coupled to one or more heat-generating electronic components,

an inlet control fluidly coupled to the fluid inlet of the at least one temperature control plate and an outlet control fluidly coupled to the fluid outlet of the temperature control plate,

a cooling fluid source fluidly coupled the inlet control and a cooling fluid return fluidly coupled to the outlet control, and

a heat exchanger fluidly coupled between the cooling fluid source and the cooling fluid return, wherein the heat exchanger extracts heat from the working fluid received from the cooling fluid return and directs the working fluid into the cooling fluid source; and

at least one heating loop to circulate the working fluid, the at least one heating loop being shorter than the cooling loop and including:

a heating fluid source fluidly coupled the inlet control and a heating fluid return fluidly coupled to the outlet control, and

a pump to circulate heating fluid through at least the heating fluid source, the temperature control plate, and the heating fluid return.

9. The apparatus of claim 8 wherein the inlet control, the outlet control, or both, are three-way valves.

10. The apparatus of claim 8 wherein the temperature control plate includes a heater to heat fluid circulating through the temperature control plate.

11. The apparatus of claim 8 wherein the temperature control plate is a cold plate and the heating loop further includes a heating plate separate from the cooling plate to heat the working fluid circulating through the heating loop.

12. The apparatus of claim 11 wherein:

the cooling loop includes two or more cooling plates;

the heating loop includes two or more heating plates; or

the cooling loop includes two or more cooling plates and the heating loop includes two or more heating plates.

13. The apparatus of claim 11 wherein the heating plate comprises:

a first module comprising:

a thermally conductive first base having at least one heater positioned therein, and

a plurality of first fins thermally coupled to an interior side of the first base and projecting therefrom;

a second module comprising:

a thermally conductive second base having at least one heater positioned therein,

a sidewall around the perimeter of an interior side of the second base,

a plurality of second fins thermally coupled to the interior side of the second base and projecting therefrom, and

a fluid port on an exterior side of the second base, the fluid port including an inlet and an outlet;

wherein the first module is joined to the second module so that the first base, the second base, and the sidewall form a sealed interior cavity, wherein the sealed interior cavity is fluidly coupled to the fluid port so that a working fluid can enter and exit the sealed interior cavity through the fluid port.

14. The apparatus of claim 8 wherein the cooling loop further comprises a pump to circulate working fluid through the cooling loop.

15. The apparatus of claim 8 , further comprising a fan to force air convection through the heat exchanger.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE OF THE CONVEYING PARTY AND THE APPLICATION FILING DATE ON THE FIRST PAGE OF THE ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED AT REEL: 052512 FRAME: 0982. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Aug 1, 2023
From: GAO, TIANYI
To: BAIDU USA LLC
Reel/Frame 064462/0578 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 28, 2020
From: GAO, TIANYI
To: BAIDU USA LLC
Reel/Frame 052512/0892 →
Continuity (1)
Related Publication 20210325126A1 · Oct 21, 2021
Cited By (1)
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