Fill-level measuring device
A radar-based fill-level measuring device, comprises the following parts: a semiconductor component for producing electrical high-frequency signals or for determining the fill-level value from the received high-frequency signals; a dielectric waveguide placed in contact with the semiconductor component to couple the high-frequency signals as radar signals into an antenna and/or to couple received radar signals from the antenna as electrical signals into the semiconductor component; a potting encapsulation, which encapsulates at least the waveguide radially such that a defined cavity is formed between the waveguide and the potting encapsulation.
1. A radar-based fill-level measuring device comprising:
a semiconductor component configured to:
to generate or receive high-frequency electrical signals, and
to determine a fill level value on the basis of at least the received high-frequency signals;
a dielectric waveguide that is contacted with the semiconductor component in order to couple the high-frequency signals as radar signals into an antenna or to couple received radar signals from the antenna as electrical signals into the semiconductor component; and
a potting encapsulation that radially encapsulates at least the waveguide in such a way that a defined cavity is formed between the waveguide and the potting encapsulation;
wherein the encapsulation is designed so the cavity between the waveguide and the potting encapsulation has a distance of at least twice the wavelength of the radar signals;
wherein the semiconductor component is designed to generate the high-frequency electrical signals at a frequency of at least 100 GHz or to process corresponding high-frequency electrical signals after reception.
2. The fill-level measuring device of claim 1 , wherein the waveguide is dimensioned with a length of at least 3 cm.
3. The fill-level measuring device of claim 1 , comprising:
a printed circuit board on which the semiconductor component is arranged,
an electromagnetic shielding of the semiconductor component mounted on the printed circuit board inside the potting encapsulation, wherein the shielding fixes the waveguide toward the semiconductor component so the radar signals can be coupled into the waveguide or into the semiconductor component.
4. A fill-level measuring device of claim 3 , wherein the waveguide is designed in two parts so the waveguide is subdivided into a first segment and a second segment in the region of the shielding.
5. A fill-level measuring device of claim 1 , comprising:
a housing enclosing at least the semiconductor component, the waveguide and the potting encapsulation, wherein the antenna is fixed to outside of the housing, and
a grommet in the housing that fixes the waveguide in such a way towards the antenna that the radar signals can be coupled into the antenna or into the waveguide.
6. A fill-level measuring device of claim 1 , wherein the waveguide is made of an insulating material having a dielectric value of greater than 1.
7. A fill-level measuring device of claim 3 , wherein the potting encapsulation encapsulates the surface of the printed circuit board facing away from the semiconductor component.
8. A fill-level measuring device of claim 1 , wherein an outer surface of the potting encapsulation is electromagnetically shielding.