Nested architectures for enhanced heterogeneous integration

1. An electronic package, comprising:

a base substrate, the base substrate having a first plurality of through substrate vias and a second plurality of through substrate vias;

a first die over the first plurality of through substrate vias of the base substrate;

a second die over the second plurality of through substrate vias of the base substrate, the second die laterally spaced apart from the first die;

a first cavity into the base substrate, wherein the first cavity is at least partially within a footprint of the first die and at least partially within a footprint of the second die;

a first component in the first cavity; and

a plurality of redistribution layers on the base substrate, wherein the plurality of redistribution layers is vertically over the first plurality of through substrate vias and vertically over the second plurality of through substrate vias and vertically over the first component, wherein the first die is coupled to the plurality of redistribution layers by a first plurality of interconnects, and wherein the second die is coupled to the plurality of redistribution layers by a second plurality of interconnects.

2. The electronic package of claim 1 , wherein the first component is a third die.

3. The electronic package of claim 2 , wherein the third die comprises through substrate vias.

4. The electronic package of claim 2 , wherein an active surface of the third die faces an active surface of the first die and faces an active surface of the second die.

5. The electronic package of claim 2 , wherein an active surface of the third die faces away from an active surface of the first die.

6. The electronic package of claim 1 , wherein the first component is a passive electrical component.

7. The electronic package of claim 1 , wherein the first component is a thermoelectric cooling (TEC) module.

8. The electronic package of claim 1 , wherein the first component electrically couples the first die to the second die.

9. The electronic package of claim 1 , further comprising:

a second cavity into the base substrate, wherein the second cavity is entirely within the footprint of the first die.

10. The electronic package of claim 9 , further comprising:

a second component in the second cavity.

11. The electronic package of claim 1 , wherein the first die is electrically coupled to the second die by one or more traces on the base substrate.

12. The electronic package of claim 1 , wherein the base substrate is a passive substrate.

13. The electronic package of claim 1 , wherein the base substrate is an active substrate.

14. A method of forming an electronic package, comprising:

forming through substrate vias (TSVs) partially through a base substrate;

thinning the base substrate, wherein the TSVs are not exposed;

attaching a carrier to the base substrate;

forming a cavity into the base substrate, wherein the cavity exposes a plurality of pads;

attaching a component to the plurality of pads;

embedding the component within a mold layer;

planarizing the base substrate, wherein the planarizing exposes the TSVs;

removing the carrier;

forming a plurality of redistribution layers on the base substrate, wherein the plurality of redistribution layers is vertically over the TSVs and vertically over the component;

attaching a first die to the plurality of redistribution layers by a first plurality of interconnects, the first die over a first plurality of the TSVs and over a first portion of the component; and

attaching a second die to the plurality of redistribution layers by a second plurality of interconnects, the second die laterally spaced apart from the first die, and the second die over a second plurality of the TSVs and over a second portion of the component.

15. The method of claim 14 , wherein an active surface of the component faces an active surface of the first die and faces an active surface of the second die.

16. The method of claim 14 , wherein the component is a third die.

17. The method of claim 16 , wherein the third die comprises through substrate vias.

18. An electronic system, comprising:

a board;

an electronic package coupled to the board, wherein the electronic package comprises:

a base substrate, wherein the base substrate comprises a first plurality of through substrate vias (TSVs) and a second plurality of TSVs, and wherein the base substrate comprises silicon;

a first die over the first plurality of TSVs of the base substrate;

a second die over the second plurality of TSVs of the base substrate, the second die laterally spaced apart from the first die;

a first cavity into the base substrate, wherein the first cavity is at least partially within a footprint of the first die and at least partially within a footprint of the second die;

a first component in the first cavity;

a second cavity into the base substrate;

a second component in the second cavity; and

a plurality of redistribution layers on the base substrate, wherein the plurality of redistribution layers is vertically over the first plurality of TSVs and vertically over the second plurality of TSVs and vertically over the first component and vertically over the second component, wherein the first die is coupled to the plurality of redistribution layers by a first plurality of interconnects, and wherein the second die is coupled to the plurality of redistribution layers by a second plurality of interconnects.

19. The electronic system of claim 18 , wherein the first component electrically couples the first die to the second die.

20. The electronic system of claim 18 , wherein the at least one of the first component and the second component comprises through substrate vias.

21. The electronic system of claim 18 , wherein an active surface of the first die faces an active surface of the first component.