Assembly structure and package structure
An assembly structure includes a core-computing section and a sub-computing section. The core-computing section has a first surface and a second surface opposite to the first surface. The core-computing section includes at least one conductive via electrically connecting the first surface and the second surface. The sub-computing section has a first surface stacked on the first surface of the core-computing section and a second surface opposite to the first surface. The sub-computing section includes at least one conductive via electrically connecting the first surface and the second surface. The assembly structure includes a first signal transmission path and a second signal transmission path. The first signal transmission path is between the at least one conductive via of the sub-computing section and the at least one conductive via of the core-computing section. The second signal transmission path is between the second surface of the sub-computing section and the at least one conductive via of the sub-computing section.
1. An assembly structure, comprising:
a core-computing section; and
a sub-computing section stacked on the core-computing section;
wherein the assembly structure includes a first signal transmission path and an interconnection signal transmission path between the core-computing section and the sub-computing section, the first signal transmission path passes through the sub-computing section, and a signal transmission speed in the interconnection signal transmission path is greater than a signal transmission speed in the first signal transmission path.
2. The assembly structure of claim 1 , further comprising a plurality of conductive vias disposed adjacent to a lateral surface of a memory component of the sub-computing section.
3. The assembly structure of claim 2 , wherein the conductive vias extend through a package body encapsulating the sub-computing section.
4. The assembly structure of claim 2 , wherein the conductive vias extend through a signal transmission component of the sub-computing section.
5. The assembly structure of claim 2 , wherein the assembly structure further includes a power path between a lower substrate and a top surface of the core-computing section.
6. The assembly structure of claim 5 , wherein the sub-computing section includes a memory component, and the assembly structure further includes a fourth signal transmission path between the memory component and a wiring structure.