Electronic device comprising antenna module
An electronic device, according to one embodiment of the present invention, may comprise: a first dielectric which forms at least a part of the front surface of the electronic device; a second dielectric which forms at least a part of the rear surface of the electronic device; a side surface member which surrounds a space formed between the front surface and the rear surface and of which a part comprises a third dielectric; a display positioned in the space and visually exposed through the first dielectric; and an antenna module positioned in the space. The antenna module comprises: a printed circuit board comprising a first surface which faces, in the space, the third dielectric, and a second surface which is oriented in a direction opposite to that of the first surface; and at least one antenna element which is disposed on the first surface or inside the printed circuit board so as to be adjacent to the first surface, and which forms a beam pattern toward the side surface member. In addition, other various embodiments are possible.
1. A mobile communication device comprising:
a front plate forming at least a portion of a front surface of the mobile communication device;
a rear plate forming at least a portion of a rear surface of the mobile communication device;
a first conductive portion, a second conductive portion, and a non-conductive portion of a side member forming a side surface of the mobile communication device, the non-conductive portion located between the first conductive portion and the second conductive portion;
a printed circuit board (PCB) including a first surface facing the non-conductive portion and a second surface opposite to the first surface;
an antenna array disposed on the first surface of the PCB, facing the non-conductive portion to transmit or receive signals of a millimeter wave frequency band through the non-conductive portion;
a first conductive element located between the front plate and the antenna array;
a second conductive element located between the rear plate and the antenna array; and
a conductive plate located between the front plate and the rear plate, and substantially parallel with the PCB such that the PCB is located between the conductive plate and the side surface and is disposed on the conductive plate,
wherein the second surface of the PCB faces the conductive plate, and
wherein the second conductive element is at least partially separated from the conductive plate.
2. The mobile communication device of claim 1 , wherein the antenna array is fully overlapped with the non-conductive portion when viewed in a direction toward the side surface.
3. The mobile communication device of claim 1 , wherein the first conductive element prevents signals generated by the antenna array from being transmitted through the front plate, and wherein the second conductive element prevents signals generated by the antenna array from being transmitted through the rear plate.
4. The mobile communication device of claim 1 , wherein the second conductive element is substantially symmetric to the first conductive element.
5. The mobile communication device of claim 1 , further comprising a communication circuit configured to transmit or receive the signals through the antenna array, and
wherein the communication circuit is disposed on the second surface.
6. The mobile communication device of claim 1 , wherein the antenna array includes a plurality of patch antennas.
7. The mobile communication device of claim 1 ,
wherein the antenna array includes multiple antenna elements arranged in a third direction which is perpendicular to a first direction from the front plate to the rear plate, and is perpendicular to a second direction toward which the first surface faces.
8. The mobile communication device of claim 1 , wherein the front plate or the rear plate comprises at least one of glass and polymer.
9. A mobile communication device comprising:
a front plate forming at least a portion of a front surface of the mobile communication device;
a rear plate forming at least a portion of a rear surface of the mobile communication device;
a first conductive portion, a second conductive portion, and a non-conductive portion of a side member forming a side surface of the mobile communication device, the non-conductive portion located between the first conductive portion and the second conductive portion;
a printed circuit board (PCB) including a first surface facing the non-conductive portion and a second surface opposite to the first surface;
an antenna array disposed on the first surface of the PCB, facing the non-conductive portion to transmit or receive signals of a millimeter wave frequency band through the non-conductive portion;
a first conductive element located between the front plate and the antenna array;
a second conductive element located between the rear plate and the antenna array and substantially symmetric to the first conductive element; and
a conductive plate located between the front plate and the rear plate, and substantially parallel with the PCB such that the PCB is located between the conductive plate and the side surface and is disposed on the conductive plate,
wherein the second surface of the PCB faces the conductive plate, and
wherein the second conductive element is at least partially separated from the conductive plate.
10. The mobile communication device of claim 9 , wherein the antenna array is fully overlapped with the non-conductive portion when viewed in a direction toward the side surface.
11. The mobile communication device of claim 9 , further comprising a communication circuit configured to transmit or receive the signals through the antenna array, and
wherein the communication circuit is disposed on the second surface.
12. The mobile communication device of claim 9 , wherein the antenna array includes a plurality of patch antennas.
13. The mobile communication device of claim 9 ,
wherein the antenna array includes multiple antenna elements arranged in a third direction which is perpendicular to a first direction from the front plate to the rear plate, and is perpendicular to a second direction toward which the first surface faces.
14. The mobile communication device of claim 9 , wherein the front plate or the rear plate comprises at least one of glass and polymer.
15. A mobile communication device comprising:
a front plate forming at least a portion of a front surface of the mobile communication device;
a rear plate forming at least a portion of a rear surface of the mobile communication device;
a side member including a first conductive portion, a second conductive portion, and a non-conductive portion disposed between the first conductive portion and the second conductive portion, forming a side surface of the mobile communication device;
a printed circuit board (PCB) including a first surface facing the non-conductive portion and a second surface opposite to the first surface;
an antenna array, disposed on the PCB, facing the non-conductive portion of the side member to transmit or receive signals of a millimeter wave frequency band through the non-conductive portion;
a conductive support member located between the front plate and the antenna array;
a conductive element located between the rear plate and the antenna array, and substantially symmetric to the conductive support member; and
a conductive plate located between the front plate and the rear plate, and substantially parallel with the PCB such that the PCB is located between the conductive plate and the side surface and is disposed on the conductive plate,
wherein the second surface of the PCB faces the conductive plate, and
wherein the conductive element is at least partially separated from the conductive plate.
16. The mobile communication device of claim 15 , wherein the antenna array is fully overlapped with the non-conductive portion when viewed in a direction toward the side surface.
17. The mobile communication device of claim 15 , further comprising a communication circuit configured to transmit or receive the signals through the antenna array, and
wherein the communication circuit is disposed on the second surface.
18. The mobile communication device of claim 15 , wherein the antenna array includes a plurality of patch antennas.
19. The mobile communication device of claim 15 ,
wherein the antenna array includes multiple antenna elements arranged in a third direction which is perpendicular to a first direction from the front plate to the rear plate, and is perpendicular to a second direction toward which the first surface faces.
20. The mobile communication device of claim 15 , wherein the front plate or the rear plate comprises at least one of glass and polymer.
21. A mobile communication device comprising:
a front plate forming at least a portion of a front surface of the mobile communication device;
a rear plate forming at least a portion of a rear surface of the mobile communication device;
a first conductive portion, a second conductive portion, and a non-conductive portion of a side member forming a side surface of the mobile communication device, the non-conductive portion located between the first conductive portion and the second conductive portion;
a printed circuit board (PCB) including a first surface facing the non-conductive portion and a second surface opposite to the first surface;
an antenna array disposed on the first surface of the PCB, facing the non-conductive portion to transmit or receive signals of a millimeter wave frequency band through the non-conductive portion;
a first conductive region located between the front plate and the antenna array, the first conductive region configured to prevent signals from the antenna array from being transmitted toward the front plate;
a second conductive region located between the rear plate and the antenna array, the second conductive region configured to prevent signals from the antenna array from being transmitted toward the rear plate; and
a conductive plate located between the front plate and the rear plate, and substantially parallel with the PCB such that the PCB is located between the conductive plate and the side surface and is disposed on the conductive plate,
wherein the second surface of the PCB faces the conductive plate, and
wherein the second conductive region is at least partially separated from the conductive plate.
22. The mobile communication device of claim 21 , wherein the antenna array is fully overlapped with the non-conductive portion when viewed in a direction toward the side surface.
23. The mobile communication device of claim 21 , wherein the first conductive region is substantially symmetric to the second conductive region.
24. The mobile communication device of claim 21 , wherein the antenna array includes a plurality of patch antennas.
25. The mobile communication device of claim 21 , wherein the front plate or the rear plate comprises at least one of glass and polymer.
26. The mobile communication device of claim 21 ,
wherein the antenna array includes multiple antenna elements arranged in a third direction which is perpendicular to a first direction from the front plate to the rear plate, and is perpendicular to a second direction toward which the first surface faces.
27. The mobile communication device of claim 21 , further comprising a communication circuit configured to transmit or receive the signals through the antenna array, and wherein the communication circuit is disposed on the second surface.