IP Library Granted Patent US 11,799,269
Granted Patent B2
US 11,799,269 · App. 17/147,425 · Granted Oct 24, 2023

Light emitting element

Inventors: Takeshi Minamiru (Kanagawa, JP); Takashi Kondo (Kanagawa, JP); Takafumi Higuchi (Kanagawa, JP)
Assignee: FUJIFILM Business Innovation Corp.
H01S5/18311H01S5/04256H01S5/18361H01S5/423H01S5/18347H01S5/34
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Quick Facts
Patent No.
US 11,799,269
App. No.
17/147,425
Granted
Oct 24, 2023
Kind
B2
Abstract

A light emitting element formed of a laminate having a current constriction layer includes: a semiconductor substrate; a light emitting portion having plural first recess portions having a depth reaching the current constriction layer, and a current constriction structure formed in the current constriction layer and having an oxidized region where the current constriction layer is oxidized and a non-oxidized region surrounded by the oxidized region; an electrode pad disposed between the light emitting portion and an outer edge portion of the semiconductor substrate; and a step portion disposed between the electrode pad and the light emitting portion and formed from an upper surface of the laminate to the current constriction layer, and the current constriction layer in a region surrounded by the step portion is the oxidized region except for the non-oxidized region.

Claims (31)

1. A light emitting element formed of a laminate having a current constriction layer, the element comprising:

a semiconductor substrate;

a light emitting portion having a plurality of first recess portions having a depth reaching the current constriction layer, and a current constriction structure formed in the current constriction layer and having an oxidized region where the current constriction layer is oxidized and a non-oxidized region surrounded by the oxidized region;

an electrode pad disposed between the light emitting portion and an outer edge portion of the semiconductor substrate; and

a step portion disposed between the electrode pad and the light emitting portion and formed from an upper surface of the laminate to the current constriction layer,

wherein the current constriction layer in a region surrounded by the step portion is the oxidized region except for the non-oxidized region, wherein a distance a of the oxidized region from an end portion of the first recess portion in the light emitting portion and a width b of the laminate between the step portion and the first recess portion satisfy a relationship of b<2×a.

2. The light emitting element according to claim 1 ,

wherein a second recess portion formed between the electrode pad and the light emitting portion is further provided, and

the step portion is formed by a side wall of the second recess portion on the light emitting portion side.

3. The light emitting element according to claim 2 ,

wherein a width of the first recess portion and a width of the second recess portion satisfy a relationship of width of first recess portion ≤width of second recess portion.

4. The light emitting element according to claim 1 ,

wherein the step portion has a shape of a straight line in plan view.

5. The light emitting element according to claim 2 ,

wherein the step portion has a shape of a straight line in plan view.

6. The light emitting element according to claim 3 ,

wherein the step portion has a shape of a straight line in plan view.

7. The light emitting element according to claim 1 ,

wherein the step portion has a shape including a straight line and a curved line in plan view.

8. The light emitting element according to claim 2 ,

wherein the step portion has a shape including a straight line and a curved line in plan view.

9. The light emitting element according to claim 3 ,

wherein the step portion has a shape including a straight line and a curved line in plan view.

10. The light emitting element according to claim 1 ,

wherein the light emitting portion is configured as a surface emitting laser including a lower multilayer film reflector formed on the semiconductor substrate, an active layer, and an upper multilayer film reflector, and

the electrode pad is formed above the lower multilayer film reflector via an insulating film.

11. The light emitting element according to claim 1 ,

wherein the light emitting portion is configured as a surface emitting laser including a lower multilayer film reflector formed on the semiconductor substrate, an active layer, and an upper multilayer film reflector, and

the electrode pad is formed above the upper multilayer film reflector via an insulating film.

12. The light emitting element according to claim 1 ,

wherein a plurality of the light emitting portions are provided.

Assignments (2)
CHANGE OF NAME Recorded May 14, 2021
From: FUJI XEROX CO., LTD.
To: FUJIFILM BUSINESS INNOVATION CORP.
Reel/Frame 056237/0177 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 22, 2021
From: MINAMIRU, TAKESHI; KONDO, TAKASHI; HIGUCHI, TAKAFUMI
To: FUJI XEROX CO., LTD.
Reel/Frame 054991/0913 →
Priority Claims (1)
JP 2020-150112 · Sep 7, 2020 · national
Continuity (1)
Related Publication 20220077654A1 · Mar 10, 2022