Electronic device having heat-radiating structure
According to various embodiments, an electronic device may include a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, a middle plate disposed in the space between the first plate and the second plate in parallel with the second plate, a first Printed Circuit Board (PCB) disposed in a space between the second plate and the middle plate, a first electronic component mounted on the first PCB between the first PCB and the middle plate, a first heat transfer structure disposed between the first electronic component and the middle plate, a second electronic component including a first surface disposed in the space and spaced apart from the first PCB, a second surface facing away from the first surface, and a side face substantially perpendicular to the first surface or the second surface, and a second heat transfer structure. The second heat transfer structure may include a first thermal conductive layer including a first portion attached to the first surface or the second surface, and a second portion extending from the first portion toward the middle plate and at least partially having a thermal conductive path between the second electronic component and the middle plate, and a second electrical conductive layer including a third portion attached to the first portion so that the third portion constructs an electromagnetic shielding structure for the second electric component. Other various embodiments may also be possible.
1. An electronic device comprising:
a housing comprising a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate;
a middle plate disposed in the space between the first plate and the second plate in parallel with the second plate;
a first Printed Circuit Board (PCB) disposed in a space between the second plate and the middle plate;
a first electronic component mounted on the first PCB between the first PCB and the middle plate;
a first heat transfer structure disposed between the first electronic component and the middle plate;
a second electronic component comprising a first surface disposed in the space and spaced apart from the first PCB, a second surface facing away from the first surface, and a side face perpendicular to the first surface or the second surface; and
a second heat transfer structure, wherein the second heat transfer structure comprises:
a first thermal conductive layer comprising a first portion attached to the first surface or the second surface, and a second portion extending from the first portion toward the middle plate and having a thermal conductive path between the second electronic component and the middle plate; and
a second electrical conductive layer comprising a third portion attached to the first portion so that the third portion constructs an electromagnetic shielding structure for the second electric component.
2. The electronic device of claim 1 , wherein the second electrical conductive layer comprises a fourth portion attached to at least part of the second portion.
3. The electronic device of claim 2 , wherein the second heat transfer structure comprises a straight portion having a first thickness in the first thermal conductive layer and a curved portion having a second thickness thinner than the first thickness.
4. The electronic device of claim 1 ,
wherein the first surface faces the first plate, and the second surface faces the second plate, and
wherein the first portion is attached to the first surface, and the third portion is disposed between the first portion and the first plate.
5. The electronic device of claim 4 , wherein the first portion surrounds the side face of the second electronic component.
6. The electronic device of claim 1 , wherein the first surface is disposed to be vertical to the first plate to face a direction facing away from the side member, and the second face is disposed to face the side member.
7. The electronic device of claim 6 ,
wherein the first portion is attached to the first surface, and the third portion is disposed between the first portion and the first PCB, and
wherein the third portion surrounds the side face of the second electronic component.
8. The electronic device of claim 1 , wherein the first thermal conductive layer has a plurality of graphite films stacked by means of a double-sided tape or a conductive adhesive.
9. The electronic device of claim 8 , further comprising an insulating layer disposed to surround the first thermal conductive layer.
10. The electronic device of claim 8 ,
wherein the second heat transfer structure comprises a straight portion having a first thickness in the first thermal conductive layer and a curved portion having a second thickness thinner than the first thickness, and
wherein the plurality of graphite films are constructed in the curved portion to have a lower step portion than a periphery region.
11. The electronic device of claim 1 ,
wherein the second heat transfer structure comprises a straight portion and a curved portion in the first thermal conductive layer, and
wherein the curved portion comprises at least one slit.
12. The electronic device of claim 1 ,
wherein the second heat transfer structure comprises a straight portion and a curved portion in the first thermal conductive layer, and
wherein the curved portion is constructed to have a narrower width than the straight portion.
13. The electronic device of claim 1 ,
wherein the second heat transfer structure comprises a straight portion and a curved portion in the first thermal conductive layer, and
wherein the curved portion comprises a bent portion which is bent multiple times in an opposite direction up to the straight portion.
14. The electronic device of claim 1 , further comprising a second PCB disposed in a space between the first PCB and the second plate,
wherein the second electronic component is mounted on the second PCB, and
wherein at least part of a first portion and third portion of the second heat transfer structure is attached to the second PCB by surrounding the second electronic component.
15. The electronic device of claim 1 , wherein at least part of the second heat transfer structure is disposed between the first electronic component and the first heat transfer structure.