IP Library › Granted Patent US 11,800,645
Granted Patent B2
US 11,800,645 · App. 17/879,484 · Granted Oct 24, 2023

Methods and apparatuses for interfacing microwave circuits

Inventors: Thomas Petelik (Alexandria, VA); Steven Bode (Alexandria, VA); Matthew Anderson (Hanover, MD)
Assignee: The Government of the United States of America, as represented by the Secretary of the Navy
H05K1/181H01R12/716H05K2201/10189
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Quick Facts
Patent No.
US 11,800,645
App. No.
17/879,484
Granted
Oct 24, 2023
Kind
B2
Abstract

An apparatus for interfacing with an RF/microwave subsystem is provided. The apparatus includes a printed circuit board that includes: a controller, and a connector constructed to provide control signals and power signals to a subsystem in accordance with instructions from the controller, and a mechanical interface constructed to provide a mechanical connection between the subsystem and the printed circuit board.

Claims (23)

1. An apparatus for interfacing with a subsystem, comprising:

a printed circuit board;

a controller disposed on the printed circuit board;

a connector connected to the printed circuit board and constructed to provide control signals and power signals to a subsystem in accordance with instructions from the controller;

an RF/Microwave connector connected to the printed circuit board and constructed to send and receive radio frequency and microwave signals to and from a VPX complaint system; and

a mechanical interface constructed to provide a mechanical connection between the subsystem and the printed circuit board.

2. The apparatus of claim 1 , further comprising:

an interface communicatively connected to the controller and constructed to send and receive instructions and data from another system.

3. The apparatus of claim 2 , wherein the interface is a USB interface.

4. The apparatus of claim 3 , further comprising:

a second interface communicatively connected to the controller and constructed to send and receive instructions and data.

5. The apparatus of claim 4 , wherein the second interface is a multi-pin remote interface.

6. The apparatus of claim 5 , wherein the multi-pin remote interface is communicatively connected to a low voltage differential signaling integrated circuit.

7. The apparatus of claim 6 , further comprising:

a complex programmable logic device disposed on the printed circuit board and communicatively connected to the controller, the complex programmable logic device comprising a plurality of reconfigurable logic gates and a plurality of registers, and

wherein a portion of the low voltage differential signaling integrated circuit is communicatively connected to the complex programmable logic device.

8. The apparatus of claim 7 , wherein the low voltage differential signaling integrated circuit is constructed to transmit a trigger signal directly to the complex programmable logic device, and the complex programmable logic device is configured to perform a firmware configurable function in response to the trigger signal.

9. The apparatus of claim 5 , wherein the multi-pin remote interface is communicatively connected to an RS-485 integrated circuit.

10. The apparatus of claim 1 , wherein the mechanical interface is a plate connected to the printed circuit board.

11. The apparatus of claim 10 , further comprising:

a subsystem component mechanically connected to the plate and electrically connected to the connector.

12. The apparatus of claim 11 , wherein the subsystem component is mechanically fastened to the plate by a fastener connected to a hole of a plurality of holes in the plate.

13. The apparatus of claim 1 , wherein the RF/Microwave connector is a 3U VPX connector comprising P0 connectors, P1A connectors, P1B connectors, and a 3U VPX VITA connector.

Continuity (4)
Continuation 16857129 · Apr 23, 2020
Provisional Application 62966621 · Jan 28, 2020
Provisional Application 62837464 · Apr 23, 2019
Related Publication 20220369465A1 · Nov 17, 2022