IP Library › Granted Patent US 11,802,980
Granted Patent B2
US 11,802,980 · App. 17/214,003 · Granted Oct 31, 2023

Radiation detector, radiographic imaging apparatus, and manufacturing method

Inventors: Munetaka Kato (Kanagawa, JP); Haruyasu Nakatsugawa (Kanagawa, JP)
Assignee: FUJIFILM Corporation
G01T1/20181A61B6/4283G01T1/20189
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Quick Facts
Patent No.
US 11,802,980
App. No.
17/214,003
Granted
Oct 31, 2023
Kind
B2
Abstract

Provided is a radiation detector including a substrate including a sensor unit layer having a plurality of pixels for accumulating electric charges generated depending on light converted from radiation in a pixel region of a flexible base material; a conversion layer that is provided on a surface side of the base material provided with the pixel region to convert the radiation into light; and a fixing member that is provided closer to the substrate side than the conversion layer to fix the sensor unit layer to the base material.

Claims (47)

1. A radiation detector comprising:

a substrate including a sensor unit layer having a plurality of pixels for accumulating electric charges generated depending on light converted from radiation in a pixel region of a flexible base material;

a conversion layer that is provided on a surface side of the base material provided with the pixel region to convert the radiation into light; and

a fixing member that is provided closer to the substrate side than the conversion layer to fix the sensor unit layer to the base material, wherein

the fixing member fixes the sensor unit layer to the base material at an end part of the sensor unit layer, and

the fixing member fixes the sensor unit layer to the base material by covering a region ranging from at least a portion of a surface of the sensor unit layer on the conversion layer side to at least a portion of a surface of the base material on the sensor unit layer side via an end surface of the sensor unit layer.

2. The radiation detector according to claim 1 ,

wherein the fixing member is configured to contain a resin.

3. The radiation detector according to claim 1 ,

wherein the fixing member fixes the sensor unit layer to the base material by covering a region ranging from an entire surface of the sensor unit layer on the conversion layer side to at least a portion of a surface of the base material on the sensor unit layer side via an end surface of the sensor unit layer.

4. The radiation detector according to claim 3 ,

wherein the base material and the fixing member contain the same material.

5. The radiation detector according to claim 3 ,

wherein a ratio of a coefficient of thermal expansion CTE flex of the base material to a coefficient of thermal expansion CTE sur of the fixing member satisfies 0.5≤CTE sur /CTE flex ≤4.

6. The radiation detector according to claim 1 ,

wherein the base material contains polyimide.

7. The radiation detector according to claim 6 ,

wherein the base material is formed by application.

8. The radiation detector according to claim 6 ,

wherein the fixing member contains polyimide or Parylene (registered trademark).

9. The radiation detector according to claim 1 , further comprising:

a sealing layer that covers the conversion layer,

wherein a material of the fixing member is different from that of the sealing layer.

10. The radiation detector according to claim 1 ,

wherein the conversion layer is formed by direct vapor deposition of a CsI columnar crystal, and

a reinforcing substrate having a higher stiffness than the base material is further provided on a distal end part side of the columnar crystal.

11. The radiation detector according to claim 10 ,

wherein the reinforcing substrate contains a material having a yield point.

12. The radiation detector according to claim 10 ,

wherein the reinforcing substrate is provided in a region wider than a region where the conversion layer is provided.

13. The radiation detector according to claim 10 ,

wherein a reinforcing member having a higher stiffness than the base material is further provided on a surface of the substrate facing a surface provided with the pixel region.

14. A radiographic imaging apparatus comprising:

a radiation detector including:

a substrate including a sensor unit layer having a plurality of pixels for accumulating electric charges generated depending on light converted from radiation in a pixel region of a flexible base material;

a conversion layer that is provided on a surface side of the base material provided with the pixel region to convert the radiation into light; and

a fixing member that is provided closer to the substrate side than the conversion layer to fix the sensor unit layer to the base material;

a control unit that outputs a control signal for reading out electric charges accumulated in the plurality of pixels; and

a circuit unit that is electrically connected to the radiation detector by a flexible wiring line to read out the electric charges from the plurality of pixels according on the control signal, wherein

the fixing member fixes the sensor unit layer to the base material at an end part of the sensor unit layer, and

the fixing member fixes the sensor unit layer to the base material by covering a region ranging from at least a portion of a surface of the sensor unit layer on the conversion layer side to at least a portion of a surface of the base material on the sensor unit layer side via an end surface of the sensor unit layer.

15. A method of manufacturing a radiation detector, comprising:

providing a flexible base material on a support body via a peeling layer and forming a substrate provided with a sensor unit layer having a plurality of pixels for accumulating electric charges generated depending on light converted from radiation, in a pixel region of the base material;

forming a fixing member that fixes the sensor unit layer to the base material;

forming a conversion layer for converting the radiation into light on a surface side of the base material provided with the pixel region; and

bonding a reinforcing substrate having a higher stiffness than the base material to a surface of the conversion layer opposite to a surface facing the substrate side; and

peeling a substrate provided with the conversion layer and the reinforcing substrate off from the support body.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2021
From: KATO, MUNETAKA; NAKATSUGAWA, HARUYASU
To: FUJIFILM CORPORATION
Reel/Frame 055735/0385 →
Priority Claims (1)
JP 2018-182729 · Sep 27, 2018 · national
Continuity (2)
Continuation PCTJP2019037218 · Sep 24, 2019
Related Publication 20210215836A1 · Jul 15, 2021
Cited By (1)
US 12,546,905