Method of monitoring tool

1. A method comprising:

transferring a tool monitoring device to a load port of a tool;

monitoring an environmental parameter of the load port by the tool monitoring device, wherein monitoring the environmental parameter of the load port is performed by mounting a particle counter on a pin arranged on the load port;

after monitoring the environmental parameter of the load port, removing the tool monitoring device from the load port; and

closing a door of the tool in front of the load port, wherein the door of the tool is kept closed during a period from a time of transferring the tool monitoring device to the load port to a time of removing the tool monitoring device from the load port.

2. The method of claim 1 , further comprising:

transferring a wafer pod housing a plurality of wafers to the load port of the tool; and

opening the door of the tool in front of the load port when the wafer pod housing the plurality of wafers is on the load port.

3. The method of claim 1 , wherein no wafer is placed in the tool monitoring device when monitoring the environmental parameter of the load port by the tool monitoring device.

4. The method of claim 1 , further comprising identifying a type of the load port by the tool monitoring device prior to monitoring the environmental parameter of the load port by the tool monitoring device.

5. The method of claim 4 , wherein identifying the type of the load port comprises identifying a height configuration of pins arranged on the load port.

6. The method of claim 1 , further comprising charging the tool monitoring device.

7. A method comprising:

placing a tool monitoring device on a load port of a tool, wherein the tool monitoring device comprises a wafer pod and a monitoring module inside the wafer pod;

identifying a type of the load port by the tool monitoring device, comprising identifying a height configuration of pins arranged on the load port;

monitoring an environment around the load port and outside the wafer pod by using a charge-coupled device (CCD) disposed inside the wafer pod of the tool monitoring device and on the monitoring module of the tool monitoring device; and

determining whether the environment around the load port complies with a predetermined standard based on images obtained by the CCD.

8. The method of claim 7 , further comprising:

when the determination determines that the environment around the load port complies with the predetermined standard, moving the tool monitoring device to a next load port; and

when the determination determines that the environment around the load port does not comply with the predetermined standard, sending an alarm to an external device.

9. The method of claim 7 , further comprising monitoring a contamination level of a pin on the load port by the monitoring module.

10. The method of claim 9 , further comprising amplifying a signal of the contamination level monitored by the monitoring module.

11. The method of claim 7 , further comprising monitoring a leveling state of the load port by the monitoring module.

12. The method of claim 11 , further comprising adjusting the leveling state of the load port according to the leveling state monitored by the monitoring module.

13. The method of claim 7 , further comprising monitoring vibration, temperature, humidity, air, noise, or bio-hazardous particles of the load port by the monitoring module.

14. A method comprising:

transferring a tool monitoring device to a load port of a tool using an automatic material handling system (AMHS);

identifying a type of the load port by the tool monitoring device, comprising identifying a height configuration of pins arranged on the load port;

transferring a wafer pod housing a plurality of wafers using the AMHS;

monitoring an environmental parameter of the load port by the tool monitoring device;

determining whether the environmental parameter complies with a predetermined standard; and

when the determination determines that the environmental parameter does not comply with the predetermined standard, sending an alarm to the AMHS such that the AMHS stops transferring the wafer pod housing the plurality of wafers to the load port of the tool.

15. The method of claim 14 , further comprising informing a user when the determination determines that the environmental parameter does not comply with the predetermined standard.

16. The method of claim 14 , further comprising closing a door of the tool prior to transferring the tool monitoring device to the load port of the tool.

17. The method of claim 16 , wherein the door is kept closed when monitoring the environmental parameter of the load port by the tool monitoring device.

18. The method of claim 14 , wherein the environmental parameter comprises temperature, humidity and degree of contamination.

19. The method of claim 14 , wherein no wafer is placed in the tool monitoring device.

20. The method of claim 14 , wherein monitoring the environmental parameter of the load port is performed by mounting a particle counter on a pin arranged on the load port.