Metal gate structure cutting process
Methods for cutting (e.g., dividing) metal gate structures in semiconductor device structures are provided. A dual layer structure can form sub-metal gate structures in a replacement gate manufacturing processes, in some examples. In an example, a semiconductor device includes a plurality of metal gate structures disposed in an interlayer dielectric (ILD) layer disposed on a substrate, an isolation structure disposed between the metal gate structures, wherein the ILD layer circumscribes a perimeter of the isolation structure, and a dielectric structure disposed between the ILD layer and the isolation structure.
1. A semiconductor device, comprising:
a semiconductor substrate;
an isolation layer disposed on the semiconductor substrate;
a first active region and a second active region disposed at least partially above the isolation layer, wherein the first active region and the second active region each comprise a long axis and a short axis, wherein the long axes of the first and second active regions are substantially parallel and extend in a first direction;
a first gate structure and a second gate structure disposed on the isolation layer, the first active region, and the second active region, wherein the first gate structure and the second gate structure each comprise a long axis and a short axis, wherein the long axes of the first and second gate structures are substantially parallel and extend in a second direction, wherein the second direction is substantially perpendicular to the first direction; and
an isolation structure disposed on the isolation layer between the first and second active regions, the isolation structure being between and in contact with the first and second gate structures, wherein a thickness of the isolation structure varies.
2. The semiconductor device of claim 1 , wherein a long axis of the isolation structure is parallel to the long axis of the first active region and the long axis of the second active region.
3. The semiconductor device of claim 1 , further comprising an interlayer dielectric interposed between the first gate structure and the second gate structure, wherein the isolation structure extends from the isolation layer to an upper surface of the interlayer dielectric.
4. The semiconductor device of claim 3 , wherein the isolation structure extends into the isolation layer.
5. The semiconductor device of claim 1 , wherein an upper surface of the isolation structure is level with an upper surface of the first gate structure.
6. The semiconductor device of claim 5 , wherein at least a portion of a lower surface of the isolation structure is higher than an upper surface of the isolation layer.
7. A semiconductor device, comprising:
a first fin and a second fin protruding from a substrate, wherein the first fin is parallel to the second fin;
a first gate structure and a second gate structure, wherein the first gate structure extends over the first fin, wherein the second gate structure extends over the second fin, wherein the first gate structure is parallel to the second gate structure, wherein each of the first gate structure and the second gate structure comprises a gate dielectric, a gate electrode, and a gate spacer;
an interlayer dielectric (ILD) layer disposed along opposing sides of the first gate structure and the second gate structure; and
an isolation feature extending from the first gate structure to the second gate structure, wherein the isolation feature directly contacts the gate spacer of the first gate structure, wherein a width of the isolation feature varies in cross-sectional view.
8. The semiconductor device of claim 7 , wherein the isolation feature directly contacts the gate dielectric of the first gate structure.
9. The semiconductor device of claim 7 , wherein the isolation feature directly contacts the gate electrode of the first gate structure.
10. The semiconductor device of claim 7 , wherein the isolation feature extends completely through the first gate structure in a plan view.
11. The semiconductor device of claim 10 , wherein the isolation feature extends completely through the second gate structure in the plan view.
12. The semiconductor device of claim 7 , wherein the isolation feature comprises:
an isolation structure; and
a dielectric structure disposed between the ILD layer and the isolation structure, wherein a bottom surface of the isolation structure is closer to the substrate than a bottom surface of the dielectric structure.
13. The semiconductor device of claim 7 , wherein the ILD layer circumscribes a perimeter of the isolation feature.
14. The semiconductor device of claim 7 , wherein the isolation feature is interposed between contacts to the first fin and the second fin.
15. A semiconductor device, comprising:
a first transistor including a first source/drain region, a second source/drain region, and a first gate structure extending along sidewalls of a first fin, the first gate structure extending over a first shallow trench isolation;
a second transistor including a third source/drain region, a fourth source/drain region, and a second gate structure extending along sidewalls of a second fin, the second gate structure extending over the first shallow trench isolation, a long axis of the first gate structure being parallel to a long axis of the second gate structure, a long axis of the first fin being parallel to a long axis of the second fin;
a first isolation structure contacting the first gate structure and the second gate structure, wherein a width of the first isolation structure varies in a cross-sectional view between the first source/drain region and the third source/drain region and parallel to the first gate structure, wherein a height of the first isolation structure varies in the cross-sectional view, wherein the first isolation structure does not contact the first source/drain region or the third source/drain region; and
a second isolation structure over the first source/drain region and the third source/drain region, the second isolation structure extending along a side of the first source/drain region opposite the first isolation structure, the second isolation structure extending along a side of the third source/drain region opposite the first isolation structure.
16. The semiconductor device of claim 15 , wherein the first isolation structure comprises:
a first isolation layer; and
a second isolation layer interposed between the first isolation structure and the first source/drain region and between the first isolation structure and the third source/drain region, the second isolation structure extending along a sidewall of the first isolation structure, the sidewalls of the first isolation structure being parallel to current flow between the first source/drain region and the second source/drain region.
17. The semiconductor device of claim 16 , wherein the first isolation layer extends lower than the second isolation layer.
18. The semiconductor device of claim 16 , wherein the second isolation layer completely separates the first isolation layer from the first shallow trench isolation.
19. The semiconductor device of claim 15 , wherein the second isolation structure extends between the first isolation structure and the first source/drain region.