IP Library › Granted Patent US 11,815,274
Granted Patent B2
US 11,815,274 · App. 16/789,179 · Granted Nov 14, 2023

Line voltage powered thermostat with wireless communication

Inventors: Terry Wayne Alsberg (Capitola, CA); David Diepersloot (Scotts Valley, CA); Brian Alsberg (Santa Cruz, CA)
Assignee: Warmboard, Inc.
F24F11/523F24F11/30F24F11/56F24F11/63F24F11/70F24F11/88G05D23/1917F24F2110/12
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Quick Facts
Patent No.
US 11,815,274
App. No.
16/789,179
Granted
Nov 14, 2023
Kind
B2
Abstract

A thermostat assembly powered by line voltage and capable of wireless communication with a heat source, comprising a first portion and a second portion separated by a barrier. The first portion receives power via internal housing wiring at a first high voltage level and converts the power from the first high voltage level to a second low voltage level. The second portion is removably connected to the first portions to receive power at the second low voltage level, which powers at least a temperature sensor that measures an ambient temperature of an outside environment and a communication chip for wireless communication with a primary heat source. The barrier inhibits dissipation of heat between the first and second portions to reduce an effect of a temperature of the first portion on the temperature sensor, and prevents a user from contacting any high voltage components when the second portion is removed.

Claims (18)

1. A thermostat assembly, comprising:

a first portion comprising:

a power circuit configured to receive power via internal housing line voltage wiring at a first voltage level;

a power conversion circuit configured to convert the power received via the line voltage wiring into power at a second voltage level lower than the line voltage;

a first connector; and

a second portion, comprising:

a second connector configured to removably connect to the first connector and receive power from the first portion at the second voltage level;

a temperature sensor configured to measure an ambient temperature of an outside environment;

a communication chip configured to communicate wirelessly with a primary heat source;

wherein the first and second portions are separated by a barrier located in a frame of the first portion, the barrier comprising a dielectric and thermodynamic insulator that inhibits dissipation of heat from the first portion to the second portion to reduce an effect of a temperature of the first portion on the temperature sensor, and is positioned to block access by a human user to any electrical components of the first portion that receive power at the line voltage level when the second portion is removed from the first portion.

2. The thermostat assembly of claim 1 , wherein the first and second portions are configured to fit inside a junction box (J-box).

3. The thermostat assembly of claim 1 , wherein the line voltage level is 120 vac.

4. The thermostat assembly of claim 1 , wherein the second voltage level is 5 vdc.

5. The thermostat assembly of claim 1 , wherein the communication chip is configured to communicate wirelessly with the primary heat source via RF communication.

6. The thermostat assembly of claim 1 , wherein the barrier comprises a dielectric material or a plastic material.

7. The thermostat assembly of claim 1 , wherein the second portion further comprises a display screen.

8. The thermostat assembly of claim 7 , wherein the display screen comprises a touchscreen.

9. The thermostat assembly of claim 1 , wherein the frame of the first portion is shaped to define an air gap between the barrier and an outer surface of the frame.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2020
From: DIEPERSLOOT, DAVID; ALSBERG, BRIAN
To: WARMBOARD, INC.
Reel/Frame 053879/0034 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 21, 2020
From: ALSBERG, TERRY WAYNE
To: WARMBOARD, INC.
Reel/Frame 053836/0085 →
Continuity (2)
Provisional Application 62806393 · Feb 15, 2019
Related Publication 20200263898A1 · Aug 20, 2020