IP Library › Granted Patent US 11,815,422
Granted Patent B2
US 11,815,422 · App. 17/418,720 · Granted Nov 14, 2023

Optical test circuit

Inventors: Hiroshi Fukuda (Tokyo, JP); Toru Miura (Tokyo, JP); Yoshiho Maeda (Tokyo, JP)
Assignee: Nippon Telegraph and Telephone Corporation
G01M11/33G02B6/12007H01L31/028H01L31/02327H01L33/34G02B2006/12061G02B2006/12123G02B2006/12126
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Quick Facts
Patent No.
US 11,815,422
App. No.
17/418,720
Granted
Nov 14, 2023
Kind
B2
Abstract

An embodiment optical test circuit includes a first optical circuit and a second optical circuit formed on a substrate, an input optical waveguide optically connected to the first optical circuit and the second optical circuit, and an output optical waveguide optically connected to the first optical circuit and the second optical circuit. The optical test circuit also includes a light emitting diode optically connected to the input optical waveguide, and a photodiode optically connected to the output optical waveguide.

Claims (28)

1. An optical test circuit comprising:

an optical circuit including a first optical waveguide on a substrate and having a core made of silicon;

a second optical waveguide having a core made of silicon and being optically connected to the optical circuit;

a first silicon layer on the substrate and continuous with the core of the second optical waveguide;

a third optical waveguide having a core made of silicon and being optically connected to the optical circuit;

a light emitting diode optically connected to the second optical waveguide and having an active layer comprising germanium, wherein the active layer is on the first silicon layer, and wherein the light emitting diode further comprises:

a first region of a first conductivity type in the first silicon layer; and

a first semiconductor layer comprising germanium of a second conductivity type on the active layer, wherein the active layer is on the first region; and

a photodiode optically connected to the third optical waveguide and having an optical absorption layer comprising germanium.

2. The optical test circuit according to claim 1 , further comprising a second silicon layer on the substrate and continuous with the core of the third optical waveguide, wherein the optical absorption layer is on the second silicon layer.

3. The optical test circuit according to claim 2 , wherein the photodiode further comprises:

a second region of the first conductivity type in the second silicon layer; and

a second semiconductor layer of the second conductivity type on the optical absorption layer, wherein the optical absorption layer is on the second region.

4. The optical test circuit according to claim 3 , wherein the second semiconductor layer comprises germanium of the second conductivity type.

5. A method of providing an optical test circuit, the method comprising:

providing an optical circuit including a first optical waveguide on a substrate, the first optical waveguide having a core made of silicon;

optically connecting a second optical waveguide having a core made of silicon to the optical circuit;

forming a first silicon layer on the substrate continuous with the core of the second optical waveguide;

optically connecting a third optical waveguide having a core made of silicon to the optical circuit;

optically connecting a light emitting diode to the second optical waveguide, the light emitting diode having an active layer comprising germanium, wherein the active layer is formed on the first silicon layer, and wherein the light emitting diode further comprises:

a first region of a first conductivity type formed in the first silicon layer; and

a first semiconductor layer comprising germanium of a second conductivity type formed on the active layer, wherein the active layer is formed on the first region; and

optically connecting a photodiode to the third optical waveguide, the photodiode having an optical absorption layer comprising germanium.

6. The method according to claim 5 , further comprising forming a second silicon layer on the substrate continuous with the core of the third optical waveguide, wherein the optical absorption layer is formed on the second silicon layer.

7. The method according to claim 6 , wherein the photodiode further comprises:

a second region of the first conductivity type formed in the second silicon layer; and

a second semiconductor layer of the second conductivity type formed on the optical absorption layer, wherein the optical absorption layer is formed on the second region.

8. The method according to claim 7 , wherein the second semiconductor layer comprises germanium of the second conductivity type.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 28, 2021
From: FUKUDA, HIROSHI; MIURA, TORU; MAEDA, YOSHIHO
To: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
Reel/Frame 056685/0098 →
Priority Claims (1)
JP 2018-247270 · Dec 28, 2018 · national
Continuity (1)
Related Publication 20220042877A1 · Feb 10, 2022