Fused filament fabrication of high entropy alloys

1. A method comprising:

depositing, via a filament delivery device, a filament onto a surface of a substrate, wherein the filament includes a binder and a powder including at least one high entropy alloy;

sacrificing the binder to form a preform; and

sintering the preform to form a component including the at least one high entropy alloy,

wherein the filament comprises at least about 80 volume percent (vol. %) of the powder including the at least one high entropy alloy,

wherein the powder including the at least one high entropy alloy comprises a plurality of primary constituent elements, each primary constituent element between 5 atom percent (at. %) and 35 at. % of the at least one high entropy alloy, and

wherein the powder including the at least one high entropy alloy comprises a composition selected from the group consisting of Nb 25 Mo 25 Ta 25 W 25 , V 20 Nb 20 Mo 20 Ta 20 W 20 , CaMgZnSrYb, AlBCoCrCuFeNi, AlCoCrFeNiSi, Co 1.5 CrFeNi 1.5 Tio 0.5 Mo x , AlCu 0.5 CoCrFeNiSi, and combinations thereof.

2. The method of claim 1 , wherein the powder including the at least one high entropy alloy comprises at least one additional element that constitutes less than 5 at. % of the high entropy alloy.

3. The method of claim 1 , wherein the powder including the at least one high entropy alloy comprises at least five elements selected from the group consisting of Al, Cr, Co, W, Ta, Nb, V, Mo, Hf, Fe, Cu, Ni, Mn, Ti, Ca, Mg, Zn, Zr, B, and Si.

4. The method of claim 1 , wherein the binder comprises a polymer selected from the group consisting of a thermoplastic, a curable polymer, polyvinyl alcohols, polyolefins, polystyrenes, acrylonitrile butadiene styrene, polylactic acids, thermoplastic polyurethanes, and aliphatic polyamides.

5. The method of claim 1 , wherein the depositing the filament comprises:

positioning the substrate defining the surface adjacent to a build position;

heating the filament to a softening temperature or a melting temperature of the binder to soften the filament; and

depositing a plurality of roads of the softened filament on the surface to define a layer.

6. The method of claim 1 , wherein sacrificing the binder comprises delivering energy from an energy source to the filament in an amount sufficient to cause the binder to be substantially oxidized, incinerated, carbonized, charred, decomposed, or removed from the filament to form the presintered perform.

7. The method of claim 1 , further comprising:

controlling, by a computing device, the filament delivery device to deposit the filament onto the surface of the substrate.

8. The method of claim 1 , further comprising:

controlling, by a computing device, an environment within an enclosure enclosing the substrate.

9. The method of claim 1 , wherein the filament is a first filament, and wherein the method further comprises depositing a second filament onto the surface of the substrate, wherein the first filament has a different composition than the second filament.

10. A method comprising:

depositing, via a filament delivery device, a filament onto a surface of a substrate, wherein the filament includes a binder and a powder including at least one high entropy alloy;

sacrificing the binder to form a preform; and

sintering the preform to form a component including the at least one high entropy alloy,

wherein the filament comprises at least about 80 volume percent (vol. %) of the powder including the at least one high entropy alloy,

wherein the powder including the at least one high entropy alloy comprises a plurality of primary constituent elements, each primary constituent element between 5 atom percent (at. %) and 35 at. % of the at least one high entropy alloy, and

wherein the powder further comprises an oxide-dispersion strengthened (ODS) alloy which includes a fine dispersion of oxide particles.

11. The method of claim 10 , wherein the oxide particles are oxide nanoparticles.

12. The method of claim 10 , wherein the oxide particles comprise at least one of yttria, nickel chromium, thoria, nickel aluminide, iron aluminide, iron chromium aluminide, alumina, hafnia, zirconia, beryllia, magnesia, titanium dioxide, or a carbide.