Silicon carbide semiconductor device
A silicon carbide semiconductor device includes silicon carbide semiconductor substrate of a first conductivity type, a first semiconductor layer of the first conductivity type, a second semiconductor layer of the first conductivity type, a third semiconductor layer of a second conductivity type, a first semiconductor region of the first conductivity type, a trench, a gate insulating film, a gate electrode, and an interlayer insulating film. The first semiconductor layer and the second semiconductor layer constitute a first-conductivity-type semiconductor layer and in a deep region of the first-conductivity-type semiconductor layer at least 1 μm from an interface with the third semiconductor layer, a maximum value of a concentration of aluminum is less than 3.0×10 13 /cm 3 . In the deep region of the first-conductivity-type semiconductor layer, a maximum value of a concentration of boron is less than 1.0×10 14 /cm 3 .
1. A silicon carbide semiconductor device, comprising:
a silicon carbide semiconductor substrate of a first conductivity type, having a first main surface and a second main surface opposite to each other;
a first semiconductor layer of the first conductivity type, provided on the first main surface of the silicon carbide semiconductor substrate, the first semiconductor layer having an impurity concentration lower than an impurity concentration of the silicon carbide semiconductor substrate and a first surface and a second surface opposite to each other, the second surface of the first semiconductor layer facing the silicon carbide semiconductor substrate;
a second semiconductor layer of the first conductivity type, provided on the first surface of the first semiconductor layer, the second semiconductor layer having a first surface and a second surface opposite to each other, the second surface of the second semiconductor layer facing the silicon carbide semiconductor substrate;
a third semiconductor layer of a second conductivity type, provided on the first surface of the second semiconductor layer, the third semiconductor layer having a first surface and a second surface opposite to each other, the second surface of the third semiconductor layer facing the silicon carbide semiconductor substrate;
a first semiconductor region of the first conductivity type, selectively provided in the third semiconductor layer, at the first surface of the third semiconductor layer;
a gate electrode provided, via a gate insulating film, in at least a portion of a surface of the third semiconductor layer positioned between the first semiconductor region and the second semiconductor layer;
a first electrode provided on the first surface of the third semiconductor layer and a surface of the first semiconductor region; and
a second electrode provided on the second main surface of the silicon carbide semiconductor substrate, wherein
the first semiconductor layer and the second semiconductor layer constitute a first-conductivity-type semiconductor layer,
in a deep region of the first-conductivity-type semiconductor layer at least 1 μm from an interface between the first-conductivity-type semiconductor layer and the third semiconductor layer, a maximum value of a concentration of aluminum is less than 3.0×10 13 /cm 3 , and a minimum value of the concentration of aluminum is equal to or higher than 9.5×10 12 /cm 3 , and
in the deep region of the first-conductivity-type semiconductor layer, a maximum value of a concentration of boron is less than 1.0×10 14 /cm 3 , and a minimum value of the concentration of boron is equal to or higher than 4.2×10 12 /cm 3 .
2. The silicon carbide semiconductor device according to claim 1 , wherein
in the deep region of the first-conductivity-type semiconductor layer, the maximum value of the concentration of aluminum is less than 2.0×10 13 /cm 3 .
3. The silicon carbide semiconductor device according to claim 1 , wherein
in the deep region of the first-conductivity-type semiconductor layer, a difference of the maximum value of the concentration of aluminum minus the minimum value of the concentration of aluminum is less than 3.0×10 13 /cm 3 , and
in the deep region of the first-conductivity-type semiconductor layer, a difference of the maximum value of the concentration of boron minus the minimum value of the concentration of boron is less than 3.0×10 13 /cm 3 .
4. A silicon carbide semiconductor device, comprising:
a silicon carbide semiconductor substrate of a first conductivity type, having a first main surface and a second main surface opposite to each other;
a first semiconductor layer of the first conductivity type, provided on the first main surface of the silicon carbide semiconductor substrate, the first semiconductor layer having an impurity concentration lower than an impurity concentration of the silicon carbide semiconductor substrate and a first surface and a second surface opposite to each other, the second surface of the first semiconductor layer facing the silicon carbide semiconductor substrate;
a second semiconductor layer of the first conductivity type, provided on the first surface of the first semiconductor layer, the second semiconductor layer having a first surface and a second surface opposite to each other, the second surface of the second semiconductor layer facing the silicon carbide semiconductor substrate;
a third semiconductor layer of a second conductivity type, provided on the first surface of the second semiconductor layer, the third semiconductor layer having a first surface and a second surface opposite to each other, the second surface of the third semiconductor layer facing the silicon carbide semiconductor substrate;
a fourth semiconductor layer of the first conductivity type, provided on the first surface of the first semiconductor layer, the fourth semiconductor layer having an impurity concentration higher than the impurity concentration of first semiconductor layer,
a first semiconductor region of the first conductivity type, selectively provided in the third semiconductor layer, at the first surface of the third semiconductor layer;
a gate electrode provided, via a gate insulating film, in at least a portion of a surface of the third semiconductor layer positioned between the first semiconductor region and the second semiconductor layer;
a first electrode provided on the first surface of the third semiconductor layer and a surface of the first semiconductor region; and
a second electrode provided on the second main surface of the silicon carbide semiconductor substrate, wherein
the first semiconductor layer and the second semiconductor layer constitute a first-conductivity-type semiconductor layer, and in a deep region of the first-conductivity-type semiconductor layer at least 1 μm from an interface between the first-conductivity-type semiconductor layer and the third semiconductor layer, a maximum value of a concentration of aluminum is less than 3.0×10 13 /cm 3 , and
in the deep region of the first-conductivity-type semiconductor layer, a maximum value of a concentration of boron is less than 1.0×10 14 /cm 3 .
5. The silicon carbide semiconductor device according to claim 4 , wherein
the impurity concentration of the fourth semiconductor layer is at least 3 times the impurity concentration of the first semiconductor layer, and
the fourth semiconductor layer has a film thickness at least 3 times a film thickness of the first semiconductor layer.