Placement table, testing device, and testing method
There is provided a placement table having an upper surface on which a device to be processed is placed. The placement table comprises: a top plate having a placement surface for the device; a heating unit configured to heat the top plate; a plurality of temperature sensors configured to acquire temperature of the top plate at desired measurement positions in a plan view; and a positioning unit electrically connected to the temperature sensors and configured to position the temperature sensors at the measurement positions in a plan view. The positioning unit is formed of a flexible substrate having flexibility.
1. A placement table having an upper surface on which a device to be tested is placed, the placement table comprising:
a top plate having a placement surface for the device;
a heating unit configured to heat the top plate;
a plurality of temperature sensors configured to acquire temperature of the top plate at desired measurement positions in a plan view; and
a positioning unit electrically connected to the temperature sensors and configured to position the temperature sensors at the measurement positions in a plan view,
wherein the positioning unit is formed of a flexible substrate having flexibility,
wherein the placement table comprises a controller for heating the top plate to a desired temperature by the heating unit; acquiring a temperature of the top plate by the temperature sensors; and calculating a temperature of the device to be tested from the measured temperature of the top plate,
wherein the controller is configured to select the temperature sensor, which is closest from a center of the device in a plan view, among the plurality of temperature sensors; and to calculate the temperature of the device based on the temperature of the top plate measured by the selected temperature sensor.
2. The placement table of claim 1 , wherein a recessed portion is formed in a rear surface of the top plate, at least a part of the temperature sensors and the positioning unit is arranged inside the recessed portion.
3. The placement table of claim 2 , wherein the positioning unit includes convex portions protruding toward the placement surface of the top plate in a state of being arranged inside the recessed portion at a position corresponding to the measurement position in a plan view, and
the temperature sensors are connected to the convex portions of the positioning unit.
4. The placement table of claim 1 , wherein the positioning unit includes:
a plurality of sensor connection members to which the temperature sensors are connected;
a connector member electrically connected to outside the placement table; and
a relay member electrically connecting the plurality of sensor connection members and the connector member to each other.
5. The placement table of claim 4 , wherein each of the plurality of temperature sensors is connected to each of the plurality of sensor connection members.
6. The placement table of claim 1 , wherein the plurality of temperature sensors are arranged in a circumferential direction of the top plate in a plan view.
7. The placement table of claim 1 , wherein the temperature sensors include at least one of a platinum resistance sensor and a transistor sensor.
8. The placement table of claim 7 , wherein the platinum resistance sensor is disposed at a center portion of the top plate in a plan view, and
the transistor sensors are arranged in a circumferential direction of the top plate in a plan view.
9. The placement table of claim 1 , further comprising a cooling unit configured to cool the top plate,
wherein the top plate, the cooling unit, and the heating unit are stacked and arranged in this order from above.
10. A testing device for testing a device to be tested, the testing device comprising:
a probe that is pressed against the device with a predetermined load when the device is tested; and
a placement table having an upper surface on which the device to be tested is placed, the placement table comprising:
a top plate having a placement surface for the device;
a heating unit configured to heat the top plate;
a plurality of temperature sensors configured to acquire temperature of the top plate at desired measurement positions in a plan view; and
a positioning unit electrically connected to the temperature sensors and configured to position the temperature sensors at the measurement positions in a plan view,
wherein the positioning unit is formed of a flexible substrate having flexibility,
wherein the placement table comprises a controller for heating the top plate to a desired temperature by the heating unit; acquiring a temperature of the top plate by the temperature sensors; and calculating a temperature of the device to be tested from the measured temperature of the top plate,
wherein the controller is configured to select the temperature sensor, which is closest from a center of the device in a plan view, among the plurality of temperature sensors; and to calculate the temperature of the device based on the temperature of the top plate measured by the selected temperature sensor.
11. A testing method of bringing a plurality of devices to be tested into contact with a probe to test the plurality of devices using a testing device, the testing device comprising:
a top plate having a placement surface for the device;
a heating unit configured to heat the top plate;
a plurality of temperature sensors configured to acquire temperature of the top plate at desired measurement positions in a plan view; and
a positioning unit electrically connected to the temperature sensors and configured to position the temperature sensors at the measurement positions in a plan view,
wherein the positioning unit is formed of a flexible substrate having flexibility, and
the testing method comprising:
heating the top plate to a desired temperature by the heating unit;
acquiring a temperature of the top plate by the temperature sensors; and
calculating a temperature of the device to be tested from the measured temperature of the top plate,
wherein said calculating the temperature of the device to be tested from the measured temperature of the top plate comprises:
selecting the temperature sensor, which is closest from a center of the device in a plan view, among the plurality of temperature sensors; and
calculating the temperature of the device based on the temperature of the top plate measured by the selected temperature sensor.
12. The testing method of claim 11 , wherein, in said selecting, another temperature sensor is further selected, and
in said calculating the temperature of the device based on the temperature of the top plate measured by the selected temperature sensor, the calculated temperature of the device is complemented based on a temperature measured by said another temperature sensor.