Reduced resistivity for access lines in a memory array
Methods, systems, and devices for reduced resistivity for access lines in a memory array are described. A first metal layer may be formed above a via that is configured to couple an access line of a memory array with a corresponding driver. The first metal layer may be oxidized, and then a second metal layer may be formed above the oxidized first metal layer. One or more access lines of the memory device may be formed from the second metal layer, the oxidized first metal layer, or both.
1. An apparatus, comprising:
a set of memory cells coupled with an access line that extends in a first direction within the apparatus, the access line comprising a metal;
a via that extends in a second direction different than the first direction through one or more materials within the apparatus and that is coupled with a line of metal oxide, wherein a first portion of the via comprises tungsten and a second portion of the via comprises tungsten oxide; and
the line of metal oxide comprising tungsten oxide and extending in the first direction between the metal and the via.
2. The apparatus of claim 1 , wherein the second portion of the via is in contact with the line of metal oxide.
3. The apparatus of claim 1 , wherein:
the line of metal oxide has a first thickness; and
the metal of the access line has a second thickness that is greater than the first thickness.
4. The apparatus of claim 1 , wherein the line of metal oxide is in contact with the metal of the access line.
5. The apparatus of claim 1 , wherein the access line further comprises the line of metal oxide.
6. The apparatus of claim 1 , wherein the metal of the access line is different than the tungsten oxide of the line of metal oxide.
7. The apparatus of claim 1 , wherein the line of metal oxide has a greater resistivity than the via, the metal of the access line, or both.
8. An apparatus, comprising:
an access line for a set of memory cells, wherein the access line comprises a metal line that extends in a first direction within the apparatus;
a via that extends in a second direction that is different than the first direction and that is coupled with a metal oxide layer, wherein a first portion of the via comprises tungsten and a second portion of the via comprises tungsten oxide; and
a driver for the access line, wherein:
the driver is coupled with the access line through the via; and
the metal oxide layer comprising tungsten oxide and interposed between the metal line and the via.
9. The apparatus of claim 8 , wherein at least a portion of the metal oxide layer is included within a line of metal oxide that extends in the first direction.
10. The apparatus of claim 9 , wherein a portion of the via comprises the metal oxide layer and is in contact with the line of metal oxide.