IP Library › Granted Patent US 11,831,063
Granted Patent B2
US 11,831,063 · App. 17/674,572 · Granted Nov 28, 2023

Element having antenna array structure

Inventors: Yasushi Koyama (Kanagawa, JP); Yoshinori Tateishi (Kanagawa, JP)
Assignee: CANON KABUSHIKI KAISHA
H01Q9/0414G01R31/2831G01R31/311H01Q1/38H01Q9/16H01Q21/065H03B5/1212H03B5/1228H03B5/1243H03B5/1265H03B5/1293H03B7/08H03B7/12H03B7/146H03L7/099H03L7/101H03L7/103H03L7/193H03B2200/0084
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,831,063
App. No.
17/674,572
Granted
Nov 28, 2023
Kind
B2
Abstract

An element includes a coupling line in which a first conductor layer, a dielectric layer, and a second conductor layer are stacked in this order, and which is connected to the second conductor layer in order to mutually synchronize a plurality of antennas at a frequency of a terahertz wave; and a bias line connecting a power supply for supplying a bias signal to a semiconductor layer and the second conductor layer. A wiring layer in which the coupling line is formed and a wiring layer in which the bias line is formed are different layers. The bias line is disposed in a layer between the first conductor layer and the second conductor layer.

Claims (56)

1. An element comprising:

an antenna array in which a plurality of antennas are arranged, with each of the antennas including

a first conductor layer,

a semiconductor layer that is electrically connected to the first conductor layer and produces or detects a terahertz wave,

a second conductor layer that is electrically connected to the semiconductor layer and faces the first conductor layer via the semiconductor layer, and

a dielectric layer that is located between the first conductor layer and the second conductor layer;

a coupling line that is connected to the second conductor layer configured to make mutual synchronization between the plurality of antennas at a frequency of the terahertz wave; and

a bias line that connects a power source for supplying a bias signal to the semiconductor layer and the second conductor layer, wherein

a wiring layer in which the coupling line is formed and a wiring layer in which the bias line is formed are different layers, and

the bias line is disposed in a layer between the first conductor layer and the second conductor layer.

2. The element according to claim 1 , wherein the coupling line and the bias line cross each other in plan view.

3. The element according to claim 1 , further comprising a third conductor layer and a fourth conductor layer, wherein

the coupling line is formed of the third conductor layer and the first conductor layer,

the bias line is formed of the fourth conductor layer, and

the third conductor layer and the fourth conductor layer are arranged in different layers.

4. The element according to claim 3 , wherein the third conductor layer and the fourth conductor layer cross each other in plan view.

5. The element according to claim 3 , further comprising:

a fifth conductor layer disposed in a layer between a set of the third conductor layer and the fourth conductor layer, and the first conductor layer; and

a capacitor structure in which the dielectric layer is interposed between the first conductor layer and the fifth conductor layer.

6. The element according to claim 5 , wherein the third conductor layer or the fourth conductor layer, and the fifth conductor layer are electrically connected via a resistor.

7. The element according to claim 3 , wherein the first conductor layer, the fourth conductor layer, and the third conductor layer are stacked in this order.

8. An element comprising:

an antenna array in which a plurality of antennas are arranged, with each of the antennas including

a first conductor layer,

a semiconductor layer that is electrically connected to the first conductor layer and produces or detects a terahertz wave,

a second conductor layer that is electrically connected to the semiconductor layer and faces the first conductor layer via the semiconductor layer, and

a dielectric layer that is located between the first conductor layer and the second conductor layer;

a coupling line that is connected to the second conductor layer configured to make mutual synchronization between the plurality of antennas at a frequency of the terahertz wave; and

a bias line that connects a power source for supplying a bias signal to the semiconductor layer and the second conductor layer, wherein

a wiring layer in which the coupling line is formed and a wiring layer in which the bias line is formed are different layers,

the element further comprising a third conductor layer and a fourth conductor layer, wherein

the coupling line is formed of the third conductor layer and the first conductor layer,

the bias line is formed of the fourth conductor layer,

the third conductor layer and the fourth conductor layer are arranged in different layers, and

the first conductor layer, the third conductor layer, and the fourth conductor layer are stacked in this order.

9. The element according to claim 8 , wherein

a contact hole that penetrates a part of the dielectric layer in a stacking direction is formed,

the second conductor layer and the third conductor layer are connected to each other by formation of a part of the second conductor layer on a surface of the contact hole, and

the semiconductor layer that is in a stacking direction is covered with the dielectric layer.

10. The element according to claim 1 , wherein the bias line is set to have a lower impedance than an impedance of the semiconductor layer in a frequency band lower than the frequency of the terahertz wave.

11. The element according to claim 1 , wherein in the antenna array, the antennas are arranged in a matrix of m×n, where (m≥2, n≥2).

12. The element according to claim 1 , wherein the antennas are arranged at a pitch that is an integral multiple of a wavelength of the terahertz wave.

13. The element according to claim 1 , wherein each of the antennas is a patch antenna.

14. The element according to claim 1 , wherein the semiconductor layer includes a negative resistance element.

15. The element according to claim 14 , wherein the negative resistance element is a resonant tunneling diode.

16. An element comprising:

an antenna array in which a plurality of antennas are arranged, with each of the antennas including

a first conductor layer,

a semiconductor layer that is electrically connected to the first conductor layer and produces or detects a terahertz wave,

a second conductor layer that is electrically connected to the semiconductor layer and faces the first conductor layer via the semiconductor layer, and

a dielectric layer that is located between the first conductor layer and the second conductor layer;

a coupling line that is connected to the second conductor layer configured to make mutual synchronization between the plurality of antennas at a frequency of the terahertz wave; and

a bias line that connects a power source for supplying a bias signal to the semiconductor layer and the second conductor layer, wherein

a wiring layer in which the coupling line is formed and a wiring layer in which the bias line is formed are different layers, and

adjacent antennas in the antenna array are connected to a common bias line disposed between the adjacent antennas.

17. The element according to claim 16 , wherein each of the antennas is connected to the common bias line via a lead wire having a width narrower than a width of the antenna.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 6, 2022
From: KOYAMA, YASUSHI; TATEISHI, YOSHINORI
To: CANON KABUSHIKI KAISHA
Reel/Frame 059331/0386 →
Priority Claims (1)
JP 2019-152828 · Aug 23, 2019 · national
Continuity (2)
Continuation PCTJP2020028567 · Jul 22, 2020
Related Publication 20220173515A1 · Jun 2, 2022
Cited By (4)
US 12,218,441 US 12,388,165 US 12,665,286 US 12,706,381