IP Library › Granted Patent US 11,835,713
Granted Patent B2
US 11,835,713 · App. 17/111,518 · Granted Dec 5, 2023

Optical scanning apparatus, three-dimensional measurement apparatus, and robot system

Inventors: Kei Kamakura (Suwa-Gun Hara-Mura, JP); Hirokazu Yamaga (Chino, JP); Takeshi Shimizu (Chino, JP)
Assignee: SEIKO EPSON CORPORATION
G02B26/105G02B26/0833G05D1/0251
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Quick Facts
Patent No.
US 11,835,713
App. No.
17/111,518
Granted
Dec 5, 2023
Kind
B2
Abstract

An optical scanning apparatus includes a MEMS substrate, a substrate fixing section to which the MEMS substrate is fixed, and an environment detection sensor that detects an environment factor associated with the mirror. The environment detection sensor is disposed in a position where the environment detection sensor overlaps with or is adjacent to the substrate fixing section but does not overlap with the MEMS substrate in a plan view viewed in a direction perpendicular to a surface of the MEMS substrate.

Claims (39)

1. An optical scanning apparatus that projects patterned light formed of laser light, the optical scanning apparatus comprising:

a MEMS substrate including a mirror that swings around a swing axis;

a substrate fixing section to which the MEMS substrate is fixed; and

an environment detection sensor that detects an environment factor associated with the mirror,

wherein the environment detection sensor is disposed in a position where the environment detection sensor overlaps with or is adjacent to the substrate fixing section but does not overlap with the MEMS substrate in a plan view viewed in a direction perpendicular to a surface of the MEMS substrate.

2. The optical scanning apparatus according to claim 1 ,

wherein the environment detection sensor is disposed in a position where the environment detection sensor does not overlap with the MEMS substrate in a side view viewed in a direction parallel to the surface of the MEMS substrate and perpendicular to the swing axis.

3. The optical scanning apparatus according to claim 1 ,

wherein assuming a mirror range that represents a segment extending between opposite ends of the mirror along the swing axis but shifted in a direction perpendicular to the swing axis in the plan view, the environment detection sensor is disposed in a position where the environment detection sensor overlaps with the mirror range.

4. The optical scanning apparatus according to claim 1 ,

further comprising a wiring substrate including wiring for the environment detection sensor,

part of the wiring substrate overlaps with the substrate fixing section in the plan view, and

the environment detection sensor is disposed in a position where the environment detection sensor overlaps with the part in the plan view.

5. The optical scanning apparatus according to claim 1 ,

wherein the mirror is provided with a permanent magnet disposed on a rear surface of the mirror that is a surface opposite a light reflection surface,

the substrate fixing section has a first surface on which the MEMS substrate is disposed and a second surface opposite the first surface,

the optical scanning apparatus further comprises an electromagnetic coil that is so disposed as to face the rear surface of the mirror and causes the mirror to swing, and

the environment detection sensor is be provided on the second surface of the substate fixing section.

6. The optical scanning apparatus according to claim 1 ,

wherein the environment detection sensor includes at least one of a temperature sensor, an inertia sensor, a pressure sensor, and a magnetism sensor.

7. A three-dimensional measurement apparatus that three-dimensionally measures a target object by using laser light, the three-dimensional measurement apparatus comprising:

a projection section that includes a laser light source that outputs the laser light and an optical scanning apparatus that projects patterned light formed of the laser light on a region containing the target object;

an imaging section that captures an image of the region containing the target object irradiated with the laser light to acquire image data; and

a measurement section that three-dimensionally measures the region containing the target object based on the image data,

wherein the optical scanning apparatus includes

a MEMS substrate including a mirror that swings around a swing axis,

a substrate fixing section to which the MEMS substrate is fixed, and

an environment detection sensor that detects an environment factor associated with the mirror, and

the environment detection sensor is disposed in a position where the environment detection sensor overlaps with or is adjacent to the substrate fixing section but does not overlap with the MEMS substrate in a plan view viewed in a direction perpendicular to a surface of the MEMS substrate.

8. A robot system comprising a robot including a robot arm; a three-dimensional measurement apparatus that is installed on the robot arm and three-dimensionally measures a target object by using laser light; and a robot control apparatus that controls operation of driving the robot based on a result of the measurement performed by the three-dimensional measurement apparatus,

wherein the three-dimensional measurement apparatus includes

a projection section that includes a laser light source that outputs the laser light and an optical scanning apparatus that projects patterned light formed of the laser light on a region containing the target object,

an imaging section that captures an image of the region containing the target object irradiated with the laser light to acquire image data, and

a measurement section that three-dimensionally measures the region containing the target object based on the image data,

the optical scanning apparatus includes

a MEMS substrate including a mirror that swings around a swing axis,

a substrate fixing section to which the MEMS substrate is fixed, and

an environment detection sensor that detects an environment factor associated with the mirror, and

the environment detection sensor is disposed in a position where the environment detection sensor overlaps with or is adjacent to the substrate fixing section but does not overlap with the MEMS substrate in a plan view viewed in a direction perpendicular to a surface of the MEMS substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 4, 2020
From: KAMAKURA, KEI; YAMAGA, HIROKAZU; SHIMIZU, TAKESHI
To: SEIKO EPSON CORPORATION
Reel/Frame 054540/0522 →
Priority Claims (1)
JP 2019-221054 · Dec 6, 2019 · national
Continuity (1)
Related Publication 20210173200A1 · Jun 10, 2021
Cited By (1)
US 12,746,459