Electronic component surface-mountable on circuit board

1. A method of manufacturing an electronic component, comprising:

preparing a wafer, the wafer including:

a first unit internal conductor;

a second unit internal conductor spaced at a distance from the first unit internal conductor;

a first conductor layer provided on the first unit internal conductor;

a second conductor layer provided on the second unit internal conductor; and

a connection conductor layer connecting between the first conductor layer and the second conductor layer;

cutting the wafer at a position of the connection conductor layer, so as to obtain a unit device including the first unit internal conductor and the first conductor layer;

curving a burr formed on the first conductor layer, so as to form a protruding portion; and

forming an external electrode on the first conductor layer of the first unit internal conductor so as to cover the protruding portion.

2. The method according to claim 1 , wherein the wafer is cut using a blade having a blade width larger than the distance between the first unit internal conductor and the second unit internal conductor.

3. The method according to claim 2 , wherein the burr is formed by the blade contacting the first conductor layer.

4. The method according to claim 2 , wherein the blade width is 0.1 to 10 percent larger than the distance between the first unit internal conductor and the second unit internal conductor.

5. The method according to claim 2 , wherein a burr is formed at an end portion of the second conductor layer by the blade contacting the second conductor layer.

6. The method according to claim 1 , wherein the burr is formed at an end portion of the first conductor layer.

7. The method according to claim 1 , wherein the burr is curved toward the first unit internal conductor.

8. The method according to claim 1 , wherein the burr is curved by barrel processing.

9. The method according to claim 1 , wherein the first conductor layer, the second conductor layer, and the connection conductor layer are recessed from a surface of the wafer toward an interior of the wafer.

10. The method according to claim 1 , wherein the burr protrudes from a surface of the wafer.

11. A method of manufacturing an electronic component surface-mountable on a circuit board by cutting a wafer,

wherein the electronic component includes:

an insulating base member having a mounting surface and first and second end surfaces, the electronic component being surface-mountable on the circuit board such that the mounting surface faces the circuit board, the first and second end surfaces being opposed to each other and connected with each other via the mounting surface;

an internal conductor provided in the base member;

a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and

a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor,

wherein the first external electrode has a first protrusion formed thereon, and the second external electrode has a second protrusion formed thereon,

wherein the first external electrode includes a first electrode portion and a second electrode portion, the first electrode portion being flush with the mounting surface of the base member, the second electrode portion being provided on the first end surface of the base member,

wherein the second external electrode includes a third electrode portion and a fourth electrode portion, the third electrode portion being flush with the mounting surface of the base member, the fourth electrode portion being provided on the second end surface of the base member, and

wherein the first protrusion is formed on the first electrode portion of the first external electrode, and the second protrusion is formed on the third electrode portion of the second external electrode.