Electronic device and method for manufacturing electronic device
A method for manufacturing an electronic device includes: providing a substrate; forming a plurality of connecting pads and a plurality of conductive portions partially overlapped by the plurality of connecting pads on the substrate; forming a plurality of conductive lines on the substrate, wherein one of the plurality of conductive lines is partially overlapped with one of the plurality of conductive portions, and an insulating layer is disposed between one of the plurality of connecting pads and the one of the plurality of conductive portions; and bonding a plurality of light emitting units to the plurality of connecting pads.
1. A method for manufacturing an electronic device, comprising:
providing a substrate;
forming a plurality of connecting pads and a plurality of conductive portions partially overlapped by the plurality of connecting pads on the substrate;
forming a plurality of conductive lines on the substrate, wherein one of the plurality of conductive lines is partially overlapped with one of the plurality of conductive portions, wherein an insulating layer is disposed between one of the plurality of connecting pads and the one of the plurality of conductive portions; and
bonding a plurality of light emitting units to the plurality of connecting pads.
2. The method for manufacturing the electronic device of claim 1 , wherein the one of the plurality of conductive lines is partially overlapped with at least one of the plurality of light emitting units.
3. The method for manufacturing the electronic device of claim 1 , wherein the one of the plurality of conductive lines is electrically connected to at least one of the plurality of light emitting units.
4. The method for manufacturing the electronic device of claim 1 , further comprising applying a bonding material on the plurality of connecting pads.
5. The method for manufacturing the electronic device of claim 4 , wherein the plurality of light emitting units are bonded to the plurality of connecting pads through the bonding material.
6. The method for manufacturing the electronic device of claim 5 , wherein the bonding material comprises solder material.
7. An electronic device, comprising:
a substrate;
a plurality of connecting pads disposed on the substrate;
a plurality of light emitting units disposed on the plurality of connecting pads;
a plurality of conductive portions partially overlapped with the plurality of connecting pads and disposed on the substrate; and
a plurality of conductive lines disposed on the substrate, wherein one of the plurality of conductive lines is partially overlapped with one of the plurality of conductive portions,
wherein an insulating layer is disposed between one of the plurality of connecting pads and the one of the plurality of conductive portions.
8. The electronic device of claim 7 , wherein the one of the plurality of conductive lines is partially overlapped with at least one of the plurality of light emitting units.
9. The electronic device of claim 7 , wherein the one of the plurality of conductive lines is electrically connected to at least one of the plurality of light emitting units.
10. The electronic device of claim 7 , further comprising a bonding material applied on the plurality of connecting pads.
11. The electronic device of claim 10 , wherein the bonding material are disposed between the plurality of light emitting units and the plurality of connecting pads.
12. The electronic device of claim 10 , wherein the bonding material comprises solder material.