IP Library › Granted Patent US 11,837,845
Granted Patent B2
US 11,837,845 · App. 18/146,070 · Granted Dec 5, 2023

Light emitting device

Inventors: Shota Murakami (Anan, JP); Soichiro Miura (Tokushima, JP)
Assignee: NICHIA CORPORATION
H01S5/022H01S5/0262H01S5/02461
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Quick Facts
Patent No.
US 11,837,845
App. No.
18/146,070
Granted
Dec 5, 2023
Kind
B2
Abstract

A light emitting device includes: a base having a bottom face and a lateral part surrounding the bottom face and extending upwards from the bottom face, wherein the lateral part comprises a first stepped portion and a second stepped portion facing the first stepped portion; a first semiconductor laser element disposed on the bottom face and located between the first stepped portion and the second stepped portion in a top view, wherein the first semiconductor laser element is configured to emit light towards the second stepped portion; a first wiring region located on the first stepped portion; and one or more first wires, each having a first end that is connected to the first wiring region. At least one of the one or more first wires is electrically connected to the first semiconductor laser element.

Claims (50)

1. A light emitting device comprising:

a base having a bottom face and a lateral part surrounding the bottom face and extending upwards from the bottom face, wherein the lateral part has an uppermost face and comprises a first stepped portion including a first upper face and a second stepped portion including a second upper face and facing the first stepped portion, wherein the first upper face and the second upper face are disposed below the uppermost face, wherein the first upper face and the second upper face are disposed inward of the uppermost face in a top view, and wherein a height of the first stepped portion from the bottom face is different from a height of the second stepped portion from the bottom face;

a first semiconductor laser element disposed on the bottom face and located between the first stepped portion and the second stepped portion in a top view, wherein the first semiconductor laser element is configured to emit light towards the second stepped portion;

a first wiring region located on the first stepped portion; and

one or more first wires, each having a first end that is connected to the first wiring region, wherein:

at least one of the one or more first wires is electrically connected to the first semiconductor laser element.

2. The light emitting device according to claim 1 , wherein

the height of the second stepped portion from the bottom face is greater than the height of the first stepped portion from the bottom face.

3. The light emitting device according to claim 1 , further comprising:

a second semiconductor laser element disposed on the bottom face and located between the first stepped portion and the second stepped portion in the top view, wherein the second semiconductor laser element is configured to emit light towards the second stepped portion, wherein:

the one or more first wires comprise a plurality of first wires, and

at least one of the plurality of first wires is electrically connected to the second semiconductor laser element.

4. The light emitting device according to claim 3 , further comprising:

a third semiconductor laser element disposed on the bottom face and located between the first stepped portion and the second stepped portion in the top view, wherein the third semiconductor laser element is configured to emit light towards the second stepped portion, wherein:

the one or more first wires comprise a plurality of first wires, and

at least one of the plurality of first wires is electrically connected to the third semiconductor laser element.

5. The light emitting device according to claim 1 , further comprising:

a light reflective member located between the first semiconductor laser element and the second stepped portion in the top view, wherein the light reflective member is configured to reflect the light emitted from the first semiconductor laser element.

6. The light emitting device according to claim 5 , wherein:

the light reflective member is an electronic member.

7. The light emitting device according to claim 6 , further comprising:

a second wiring region located on the second stepped portion; and

one or more second wires, each having a first end that is connected to the second wiring region, wherein:

the one or more second wires are electrically connected to the light reflective member.

8. A light emitting device comprising:

a base having a bottom face and a lateral part surrounding the bottom face and extending upwards from the bottom face, wherein the lateral part comprises a first stepped portion and a second stepped portion, and wherein a height of the first stepped portion from the bottom face is different from a height of the second stepped portion from the bottom face;

a first semiconductor laser element disposed on the bottom face and configured to emit light from an emission face towards the second stepped portion, wherein the first semiconductor laser element has a lateral face that meets the emission face of the first semiconductor laser element and faces the first stepped portion;

a first wiring region located on the first stepped portion; and

one or more first wires, each having a first end that is connected to the first wiring region, wherein:

at least one of the one or more first wires is electrically connected to the first semiconductor laser element, and

a length of the first stepped portion in a first direction parallel to the lateral face is longer than a length of the second stepped portion in a second direction parallel to the emission face in a top view.

9. The light emitting device according to claim 8 , wherein:

the height of the second stepped portion from the bottom face is greater than the height of the first stepped portion from the bottom face.

10. The light emitting device according to claim 8 , further comprising:

a second semiconductor laser element disposed on the bottom face and configured to emit light from an emission face towards the second stepped portion, wherein the second semiconductor laser element has a lateral face that meets the emission face of the second semiconductor laser element and faces the first stepped portion, wherein:

at least one of the plurality of first wires is electrically connected to the second semiconductor laser element.

11. The light emitting device according to claim 10 , further comprising:

a third semiconductor laser element disposed on the bottom face and configured to emit light from an emission face towards the second stepped portion, wherein the third semiconductor laser element has a lateral face that meets the emission face of the third semiconductor laser element and faces the first stepped portion, wherein:

at least one of the plurality of first wires is electrically connected to the third semiconductor laser element.

12. The light emitting device according to claim 8 , further comprising:

a light reflective member located between the first semiconductor laser element and the second stepped portion in the top view, wherein the light reflective member is configured to

reflect the light emitted from the first semiconductor laser element.

13. The light emitting device according to claim 12 , wherein:

the light reflective member is an electronic member.

14. The light emitting device according to claim 13 , further comprising:

a second wiring region located on the second stepped portion; and

one or more second wires, each having a first end that is connected to the second wiring region, wherein:

the one or more second wires are electrically connected to the light reflective member.

15. The light emitting device according to claim 8 , wherein:

the length of the first stepped portion in the first direction is longer than a length of the second stepped portion in the first direction in the top view.

Priority Claims (1)
JP 2019-220036 · Dec 5, 2019 · national
Continuity (2)
Continuation 17111194 · Dec 3, 2020
Related Publication 20230125799A1 · Apr 27, 2023
Cited By (1)
US 12,683,352