Sensor substrate and method of producing the sensor substrate
View Patent ↗The present disclosure provides a sensor substrate that detects an analyte of a low concentration with high sensitivity and high reliability. The sensor substrate according to the present disclosure a first substrate having first microprotrusions provided on the surface thereof and covered by a metal film, an adhesive film disposed on the surface of the first substrate and having a slit, and a second substrate that is transparent, disposed on the adhesive film, and having a first through hole and a second through hole, wherein each of the first through hole and the second through hole is in communication with the slit, and the first microprotrusions overlap the slit in a plan view.
1. A sensor substrate comprising:
a first substrate having first microprotrusions provided on the surface thereof and covered by a metal film;
an adhesive film disposed on the surface of the first substrate and having a slit; and
a second substrate that is transparent, disposed on the adhesive film, and having a first through hole and a second through hole,
wherein
each of the first through hole and the second through hole is in communication with the slit, and
the first microprotrusions overlap the slit in a plan view.
2. The sensor substrate according to claim 1 , wherein
the first substrate further has second microprotrusions which has not been covered by the metal film, and
the second microprotrusions are located around the first microprotrusions.
3. The sensor substrate according to claim 1 , wherein
the first microprotrusions are arranged at a regular interval.
4. The sensor substrate according to claim 3 , wherein
the first microprotrusions are arranged in an equilateral triangular lattice.
5. The sensor substrate according to claim 4 , wherein
each of the first microprotrusions has a cylindrical shape.
6. The sensor substrate according to claim 5 , wherein
a pitch between adjacent two of the first microprotrusions is greater than or equal to 300 nm and less than or equal to 500 nm,
the cylindrical shape has a diameter of greater than or equal to 150 nm and less than or equal to 250 nm, and
the cylindrical shape has a height of greater than or equal to 100 nm and less than or equal to 300 nm.
7. The sensor substrate according to claim 1 , wherein
the metal film is formed of any one of gold, silver, and an alloy containing gold or silver as a main component.
8. The sensor substrate according to claim 1 , further comprising:
a first specific binding substance immobilized on the first microprotrusions covered by the metal film, wherein
the first specific binding substance is capable of being specifically bound to an analyte.
9. The sensor substrate according to claim 8 , wherein
the first specific binding substance is a VHH antibody.
10. The sensor substrate according to claim 8 , wherein
the metal film is covered by a linker material, and
the first specific binding substance has been immobilized on the first microprotrusions through a peptide bond with the linker material.
11. The sensor substrate according to claim 10 , wherein
the linker material includes an alkyl chain with greater than or equal to 10 carbon atoms and a polyethylene glycol chain.
12. The sensor substrate according to claim 1 , wherein
the adhesive film includes a silicone adhesive.
13. The sensor substrate according to claim 12 , wherein
the adhesive film has a thickness of greater than or equal to 50 μm and less than or equal to 200 μm.
14. The sensor substrate according to claim 13 , wherein
the adhesive film has a three-layer structure including, in this order, a silicone adhesive layer, a polyimide layer, and a silicone adhesive layer.
15. The sensor substrate according to claim 1 , wherein
the second substrate is formed of polycarbonate.
16. A method of producing a sensor substrate, the method comprising:
forming first microprotrusions on a surface of a first substrate;
forming a metal film on the first microprotrusions; and
attaching the first substrate and a second substrate to each other with an adhesive film in such a manner that the adhesive film is located between the first substrate and the second substrate,
wherein
the adhesive film has a slit,
the second substrate has a first through hole and a second through hole,
each of the first through hole and the second through hole is in communication with the slit, and
the first microprotrusions overlap the slit in a plan view.
17. The method of producing a sensor substrate according to claim 16 , wherein
the attaching is performed at a pressure lower than an atmospheric pressure.
18. The method of producing a sensor substrate according to claim 17 , wherein
the attaching is performed at a pressure greater than or equal to 0.1 kPa and less than or equal to 10 kPa.
19. The method of producing a sensor substrate according to claim 16 , wherein
the metal film is formed by sputtering.