IP Library › Granted Patent US 11,842,842
Granted Patent B2
US 11,842,842 · App. 17/174,276 · Granted Dec 12, 2023

Inductor component and manufacturing method of inductor component

Inventors: Yoshimasa Yoshioka (Nagaokakyo, JP); Hiroki Imaeda (Nagaokakyo, JP); Shinji Otani (Nagaokakyo, JP)
Assignee: Murata Manufacturing Co., Ltd.
H01F27/2804H01F27/255H01F27/29H01F41/0206H01F41/043H01F2027/2809
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Quick Facts
Patent No.
US 11,842,842
App. No.
17/174,276
Granted
Dec 12, 2023
Kind
B2
Abstract

An inductor component including a magnetic layer in which a magnetic metal powder is dispersedly present in a base material made of an insulation material and an inductor wiring line laminated on a surface of the magnetic layer. The inductor wiring line includes an anchor portion extending from a main face of the inductor wiring line on a side of the magnetic layer and covering a surface of the magnetic metal powder in the magnetic layer.

Claims (49)

1. An inductor component, comprising:

a magnetic layer in which a magnetic metal powder is dispersedly present in a base material made of an insulation material; and

an inductor wiring line laminated on a surface of the magnetic layer, the inductor wiring line including an anchor portion extending from a main face of the inductor wiring line on a side of the magnetic layer and covering a surface of the magnetic metal powder in the magnetic layer,

wherein

a second magnetic layer made of a magnetic material is laminated on a face of the inductor wiring line on a side opposite to the magnetic layer, and

a covering layer made of an insulation material is laminated on a face of the second magnetic layer on a side opposite to the inductor wiring line,

a vertical wiring line penetrating through the second magnetic layer in a direction perpendicular to the main face is connected to the inductor wiring line,

the vertical wiring line is exposed from the covering layer, and

an outer electrode is connected to a portion in the vertical wiring line exposed from the covering layer.

2. The inductor component according to claim 1 , wherein

the magnetic metal powder covered by the anchor portion includes a cross section in which equal to or larger than one-third of the surface of the magnetic metal powder is covered by the anchor portion when the magnetic metal powder is viewed in a cross section.

3. The inductor component according to claim 1 , wherein

the inductor wiring line includes a first wiring line layer and a second wiring line layer laminated on the first wiring line layer on a side opposite to the magnetic layer, and

a face of the first wiring line layer on a side of the magnetic layer constitutes the main face.

4. The inductor component according to claim 3 , wherein

a material of the magnetic metal powder includes a metal having a higher ionization tendency than an ionization tendency of a material of the first wiring line layer.

5. The inductor component according to claim 3 , wherein

a material of the first wiring line layer has a copper ratio equal to or less than 99 wt %, and a nickel ratio equal to or larger than 0.1 wt %.

6. The inductor component according to claim 3 , wherein

a material of the first wiring line layer has a nickel ratio equal to or less than 99 wt %, and a phosphorus ratio equal from 0.5 wt % to 10 wt %.

7. The inductor component according to claim 3 , wherein

a material of the second wiring line layer has a copper ratio equal to or less than 99 wt %.

8. The inductor component according to claim 3 , wherein

part of an outer face of the second wiring line layer constitutes the main face of the inductor wiring line.

9. The inductor component according to claim 3 , wherein

a thickness of the second wiring line layer in a lamination direction is equal to or five times larger than a thickness of the first wiring line layer in a lamination direction.

10. The inductor component according to claim 3 , wherein

the inductor wiring line includes a catalyst layer containing at least one or more metals among palladium, platinum, silver, or gold,

the catalyst layer is disposed on the first wiring line layer on a side of the magnetic layer, and

a face of the catalyst layer on a side of the magnetic layer constitutes the main face of the inductor wiring line.

11. The inductor component according to claim 3 , wherein

the inductor wiring line has a thickness from 40 μm to 120 μm, and

the first wiring line layer has a thickness from 0.3 μm to 10 μm.

12. The inductor component according to claim 1 , wherein

the base material contains at least one resin among epoxy-based resin, phenol-based resin, or acrylic-based resin, and an inorganic filler having an average particle size equal to or less than 1 μm.

13. The inductor component according to claim 1 , wherein

an average particle size of the magnetic metal powder is equal to or less than 5.0 μm.

14. The inductor component according to claim 1 , wherein

an average particle size of the magnetic metal powder is equal to or less than one-tenth of a wiring line width of the inductor wiring line.

15. The inductor component according to claim 1 , wherein

a plurality of inductor wiring lines, each of which is the inductor wiring line laminated on the surface of the magnetic layer, is arranged in a direction parallel to the main face.

16. The inductor component according to claim 1 , wherein when the inductor wiring line is denoted as a first inductor wiring line,

a second inductor wiring line being different from the first inductor wiring line is laminated on the first inductor wiring line with an interval in the direction perpendicular to the main face, and

the second inductor wiring line does not include the anchor portion.

17. The inductor component according to claim 2 , wherein

the inductor wiring line includes a first wiring line layer and a second wiring line layer laminated on the first wiring line layer on a side opposite to the magnetic layer, and

a face of the first wiring line layer on a side of the magnetic layer constitutes the main face.

18. The inductor component according to claim 4 , wherein

a material of the first wiring line layer has a copper ratio equal to or less than 99 wt %, and a nickel ratio equal to or larger than 0.1 wt %.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2021
From: YOSHIOKA, YOSHIMASA; IMAEDA, HIROKI; OTANI, SHINJI
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 055238/0961 →
Priority Claims (1)
JP 2020-030655 · Feb 26, 2020 · national
Continuity (1)
Related Publication 20210265097A1 · Aug 26, 2021