Semiconductor structure and manufacturing method thereof

1. A semiconductor structure, comprising:

a transistor structure, comprising:

a gate region arranged over an upper surface of a substrate, wherein the gate region extends substantially in a first direction that is perpendicular to the upper surface of the substrate;

a first source/drain region over the upper surface of the substrate;

a second source/drain region over the upper surface of the substrate; and

a channel region laterally between an outermost edge of the first source/drain region and an outermost sidewall of the gate region facing the channel region, wherein the channel region vertically extends in the first direction between the first source/drain region and the second source/drain region, and wherein the channel region comprises an oxide semiconductor material;

wherein, along the first direction, the gate region covers a sidewall of the channel region.

2. The semiconductor structure of claim 1 , further comprising:

a third source/drain region over the upper surface of the substrate and arranged along an opposing side of the gate region as the first source/drain region; and

a second channel region laterally between the gate region and the third source/drain region.

3. The semiconductor structure of claim 1 , further comprising:

a gate dielectric region laterally between the gate region and the channel region, wherein the gate region and the gate dielectric region have substantially equal heights.

4. The semiconductor structure of claim 1 , wherein:

along the first direction, the first source/drain region is between the substrate and the second source/drain region;

the first source/drain region has a bottom surface that is closer to the substrate than a bottom surface of the channel region.

5. The semiconductor structure of claim 1 , wherein:

along the first direction, the first source/drain region is between the substrate and the second source/drain region;

the second source/drain region extends, along the first direction, past an uppermost surface of the channel region.

6. The semiconductor structure of claim 1 , wherein a sidewall of the channel region vertically overlaps the outermost edge of the first source/drain region.

7. The semiconductor structure of claim 6 , further comprising:

a gate dielectric arranged laterally between the outermost sidewall of the gate region and a sidewall of the channel region.

8. The semiconductor structure of claim 1 ,

wherein the transistor structure further comprises:

an additional channel region extending substantially in the first direction, wherein the additional channel region comprises an oxide semiconductor material;

a third source/drain region; and

a fourth source/drain region;

wherein, along the first direction, the gate region covers substantially an entirety of the additional channel region;

wherein the first source/drain region and the second source/drain region are in contact with the channel region;

wherein the third source/drain region and the fourth source/drain region are in contact with the additional channel region.

9. The semiconductor structure of claim 8 , wherein the first source/drain region and the second source/drain region are on a first side of the gate region, wherein the third source/drain region and the fourth source/drain region are on an opposing second side of the gate region.

10. The semiconductor structure of claim 8 , wherein, in plan view, the first source/drain region and the second source/drain region are separate from the third source/drain region and the fourth source/drain region by the gate region.

11. The semiconductor structure of claim 8 , wherein the first source/drain region, the second source/drain region, the third source/drain region, and the fourth source/drain region form a pair of transistors with the gate region shared.

12. A semiconductor structure, comprising:

a gate region arranged over a substrate;

a first source/drain region disposed along a side of the gate region and over the substrate;

a second source/drain region disposed along the side of the gate region and over the substrate and the first source/drain region; and

a channel region arranged along the side of the gate region and vertically extending from along a side of the first source/drain region to along a side of the second source/drain region.

13. The semiconductor structure of claim 12 , wherein a bottom of the channel region is below a top of the first source/drain region and a top of the channel region is above a bottom of the second source/drain region.

14. The semiconductor structure of claim 12 , further comprising:

a gate dielectric region arranged along an outermost sidewall of the gate region, wherein the channel region is arranged laterally between an outermost sidewall of the gate dielectric region and the first source/drain region.

15. A method of manufacturing a semiconductor structure, comprising:

forming a first source/drain region;

forming a first dielectric layer above the first source/drain region;

forming a first recess by removing a portion of the first dielectric layer that does not substantially cover the first source/drain region;

forming a channel region in the first recess;

forming a gate dielectric region in the first recess and in contact with the channel region;

filling the first recess with a second dielectric material;

forming a second recess by removing a portion of the second dielectric material and exposing the gate dielectric region;

filling the second recess to form a gate region;

forming a second dielectric layer above the first dielectric layer and the gate region;

removing a portion of the second dielectric layer and the first dielectric layer to expose the channel region; and

forming a second source/drain region that is in contact with the channel region.

16. The method of claim 15 , wherein forming the channel region in the first recess comprises depositing an oxide semiconductor material.

17. The method of claim 16 , wherein forming the channel region in the first recess comprises anisotropically etching the oxide semiconductor material.

18. The method of claim 16 , wherein forming the gate dielectric region in the first recess and in contact with the channel region comprises depositing a gate dielectric material.

19. The method of claim 18 , wherein the gate dielectric material comprises a high-k dielectric material.

20. The method of claim 18 , wherein forming the gate dielectric region in the first recess and in contact with the channel region comprises anisotropically etching the gate dielectric material.