Optical proximity sensor integrated into a camera module for an electronic device
An optical sensing system can be integrated into a camera module. In particular, an optical element of an optical sensing system can be disposed entirely or partly within a barrel of a camera module. The optical element can be oriented toward a reflective surface, such as an infrared cut filter, such that an optical path is defined between free space and the optical element via at least one reflection off the reflective surface.
1. An electronic device comprising:
a housing;
a camera module disposed within the housing and comprising:
a barrel defining an exterior surface and an interior surface;
a lens group within the barrel and coupled to at least a portion of the interior surface; and
an image sensor positioned below the lens group; and
an infrared laser element positioned on the exterior surface of the barrel and oriented to emit infrared laser light into the barrel along an optical path intersecting at least one lens of the lens group and exits the barrel.
2. The electronic device of claim 1 , wherein the infrared laser is a vertical cavity surface-emitting laser.
3. The electronic device of claim 1 , wherein the infrared laser comprises a photodiode configured to monitor power output from the infrared laser.
4. The electronic device of claim 1 , comprising a display, wherein the camera module is disposed within an active display area of the display.
5. The electronic device of claim 4 , wherein the camera extends through a circular aperture defined through the active display area of the display.
6. The electronic device of claim 1 , wherein the camera module comprise an infrared filter positioned over the image sensor.
7. The electronic device of claim 6 , wherein the infrared laser is oriented to emit infrared laser light toward the infrared filter.
8. The electronic device of claim 6 , wherein the infrared filter is an infrared cut filter.
9. A camera module for a portable electronic device, the camera module comprising:
a module enclosure configured to be disposed within a housing of the portable electronic device, the module enclosure formed from a material opaque to visible light;
a filter element within the module enclosure;
an image sensor below the filter element and disposed within the module enclosure;
an infrared laser light source disposed on an exterior surface of the module enclosure and oriented to emit light through a sidewall of the module enclosure toward the filter element so as to reflect from the filter element and exit the module enclosure.
10. The camera module of claim 9 , wherein the filter is an infrared cut filter.
11. The camera module of claim 9 , wherein the infrared laser light source is configured to emit laser light through the module enclosure.
12. The camera module of claim 9 , wherein the infrared laser light source is configured to emit laser light through an aperture defined through a sidewall of the module enclosure.
13. The camera module of claim 9 , wherein the module enclosure defines a barrel and the infrared laser light source is coupled to an exterior sidewall of the barrel.
14. An electronic device comprising:
a housing;
a display within the housing and defining an active display area, the active display area having a circular aperture defined therethrough;
a camera module disposed within the housing and aligned with the circular aperture, the camera module comprising:
a module enclosure defining a barrel having an internal volume, a central axis of the barrel aligned with the circular aperture;
a lens group aligned with the central axis of the barrel and within the internal volume of the module enclosure;
an infrared cut filter aligned with the central axis of the barrel; and
an imaging sensor within the module enclosure and aligned with the infrared cut filter; and
a proximity sensor comprising a laser light source, the laser light source disposed within the housing and oriented to emit light through the module enclosure to the internal volume of the module enclosure.
15. The electronic device of claim 14 , wherein the laser light source is configured to emit infrared light toward the infrared cut filter.
16. The electronic device of claim 14 , wherein the laser light source comprises a vertical cavity surface emitting laser disposed on an external sidewall surface of the module enclosure.
17. The electronic device of claim 14 , wherein the laser light source is configured to emit light through an aperture defined through an external sidewall surface of the module enclosure.
18. The electronic device of claim 14 , wherein the infrared cut filter is configured to reflect infrared light.
19. The electronic device of claim 14 , wherein the proximity sensor is an interferometric sensor.
20. The electronic device of claim 14 , wherein the module enclosure is formed at least in part from a material optically opaque to visible light.