Electronic device and method for manufacturing the same
An electronic device is provided. The electronic device includes a display, a substrate, and an anti-explosion layer. The substrate is disposed on the display. The anti-explosion layer is disposed between the substrate and the display, and the anti-explosion layer has a tensile strength in a range from 10 MPa to 30 MPa.
1. An electronic device, comprising:
a display;
a substrate disposed on the display; and
an anti-explosion layer disposed between the substrate and the display, wherein the anti-explosion layer has a tensile strength, and the tensile strength is in a range from 10 MPa to 30 MPa,
wherein the anti-explosion layer has a first side and the substrate has a second side, and a distance between the first side and the second side is in a range from 0 mm to 0.3 mm,
wherein the anti-explosion layer is in contact with the display and the substrate, the display is adhered to the substrate through the anti-explosion layer, and the anti-explosion layer has a peel adhesion, and the peel adhesion is in a range from 40 N/mm to 150 N/mm, wherein the anti-explosion layer comprises a first surface, a portion of the first surface is in contact with the display and another portion of the first surface is not in contact with the display has a roughness, and the roughness (Ry) is in a range from 10 μm to 40 μm.
2. The electronic device as claimed in claim 1 , wherein an area of the anti-explosion layer is greater than an area of the display.
3. The electronic device as claimed in claim 1 , wherein the display has a third side, the third side of the display shrinks inward compared to the first side of the anti-explosion layer.
4. The electronic device as claimed in claim 1 , wherein an area of the anti-explosion layer is substantially equal to an area of the substrate.
5. The electronic device as claimed in claim 4 , wherein a ratio of the area of the anti-explosion layer to the area of the substrate is in a range from 99.5% to 100%.
6. The electronic device as claimed in claim 1 , wherein the anti-explosion layer has a haze, and the haze is in a range from 0% to 1%.
7. The electronic device as claimed in claim 1 , wherein the anti-explosion layer comprises a heat-curing glue, a thermoplastic glue, or a combination thereof.
8. The electronic device as claimed in claim 1 , further comprising a shielding layer disposed between the anti-explosion layer and the substrate.
9. A method for manufacturing the electronic device according to claim 1 , comprising:
providing a substrate and performing a first pre-processing step on the substrate;
providing an anti-explosion layer and a display, wherein the anti-explosion layer has a tensile strength and the tensile strength is in a range from 10 MPa to 30 MPa;
performing an alignment step to align the substrate and the anti-explosion layer with the display; and
performing a bonding step to bond the substrate and the anti-explosion layer to the display to form the electronic device, wherein the anti-explosion layer is disposed between the substrate and the display.
10. The method for manufacturing an electronic device as claimed in claim 9 , wherein in the bonding step, a degree of vacuum is in a range from 0 Pa to 100 Pa, a temperature is in a range from 60° C. to 120° C., and a pressure is in a range from 0.5 kgf/cm 2 to 5 kgf/cm 2 .
11. The method for manufacturing an electronic device as claimed in claim 9 , wherein the first pre-processing step comprises a laser cleaning process, an ultraviolet cleaning process, coating of a material modification layer, a detergent cleaning process, a plasma cleaning process, or a combination thereof.
12. The method for manufacturing an electronic device as claimed in claim 9 , further comprising:
performing a first post-processing step on the electronic device, the first post-processing step comprising a heating step and a pressurization step.
13. The method for manufacturing an electronic device as claimed in claim 12 , wherein a temperature of the heating step is in a range from 70° C. to 150° C., and a pressure of the pressurization step is in a range from 7 kgf/cm 2 to 15 kgf/cm 2 .
14. The method for manufacturing an electronic device as claimed in claim 9 , further comprising:
performing a second pre-processing step on the anti-explosion layer, the second pre-processing step comprising performing a heating step and a pressurization step on the anti-explosion layer in a vacuum environment.
15. The method for manufacturing an electronic device as claimed in claim 14 , wherein in the second pre-processing step, a degree of vacuum is in a range from 0 Pa to 100 Pa, a temperature is in a range from 60° C. to 120° C., and a pressure is in a range from 0.5 kgf/cm 2 to 5 kgf/cm 2 .
16. The method for manufacturing an electronic device as claimed in claim 9 , further comprising:
performing a second post-processing step on the anti-explosion layer to remove portions of the anti-explosion layer extending beyond the substrate.
17. An electronic device, comprising:
a display comprising a polarizing plate;
a substrate disposed on the display; and
an anti-explosion layer disposed between the substrate and the polarizing plate, wherein the anti-explosion layer has a tensile strength, and the tensile strength is in a range from 10 MPa to 30 MPa,
wherein the anti-explosion layer has a first side and the substrate has a second side, and a distance between the first side and the second side is in a range from 0 mm to 0.3 mm,
wherein the anti-explosion layer is in contact with the polarizing plate and the substrate, and the display is adhered to the substrate through the anti-explosion layer, wherein the anti-explosion layer comprises a first surface, a portion of the first surface is in contact with the display and another portion of the first surface is not in contact with the display has a roughness, and the roughness (Ry) is in a range from 10 μm to 40 μm.