Inductor built-in substrate
An inductor built-in substrate includes a core substrate having openings and first through holes formed therein, a magnetic resin filling the openings and having second through holes formed therein, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes an electroless plating film and an electrolytic plating film, and second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes an electroless plating film and an electrolytic plating film. The first through-hole conductors and the second through-hole conductors are formed such that a thickness of the electroless plating film in the first through-hole conductors is larger than a thickness of the electroless plating film in the second through-hole conductors.
1. An inductor built-in substrate, comprising:
a core substrate having a plurality of openings and a plurality of first through holes formed therein;
a magnetic resin filling the plurality of openings and having a plurality of second through holes formed therein;
a plurality of first through-hole conductors formed in the plurality of first through holes respectively such that each of the first through-hole conductors comprises an electroless plating film and an electrolytic plating film; and
a plurality of second through-hole conductors formed in the plurality of second through holes respectively such that each of the second through-hole conductors comprises an electroless plating film and an electrolytic plating film,
wherein the plurality of first through-hole conductors and the plurality of second through-hole conductors are formed such that a thickness of the electroless plating film in the first through-hole conductors is larger than a thickness of the electroless plating film in the second through-hole conductors.
2. The inductor built-in substrate according to claim 1 , wherein the plurality of first through-hole conductors and the plurality of second through-hole conductors are formed such that a thickness of the electrolytic plating film in the first through-hole conductors is larger than a thickness of the electrolytic plating film in the second through-hole conductors.
3. The inductor built-in substrate according to claim 1 , wherein the plurality of first through-hole conductors and the plurality of second through-hole conductors are formed such that a pitch of the first through-hole conductors is smaller than a pitch of the second through-hole conductors.
4. The inductor built-in substrate according to claim 1 , wherein the plurality of first through-hole conductors and the plurality of second through-hole conductors are formed such that a number of the first through-hole conductors is larger than a number of the second through-hole conductors.
5. The inductor built-in substrate according to claim 1 , wherein the plurality of first through-hole conductors and the plurality of second through-hole conductors are formed such that the plurality of first through-hole conductors is configured to transmit signals and that the second through-hole conductors is configured to be connected to a power supply.
6. The inductor built-in substrate according to claim 1 , wherein the core substrate includes a core material, inorganic particles, and a resin material, and the magnetic resin includes a resin material and magnetic particles comprising iron oxide filler.
7. The inductor built-in substrate according to claim 2 , wherein the plurality of first through-hole conductors and the plurality of second through-hole conductors are formed such that a pitch of the first through-hole conductors is smaller than a pitch of the second through-hole conductors.
8. The inductor built-in substrate according to claim 2 , wherein the plurality of first through-hole conductors and the plurality of second through-hole conductors are formed such that a number of the first through-hole conductors is larger than a number of the second through-hole conductors.
9. The inductor built-in substrate according to claim 2 , wherein the plurality of first through-hole conductors and the plurality of second through-hole conductors are formed such that the plurality of first through-hole conductors is configured to transmit signals and that the second through-hole conductors is configured to be connected to a power supply.
10. The inductor built-in substrate according to claim 2 , wherein the core substrate includes a core material, inorganic particles, and a resin material, and the magnetic resin includes a resin material and magnetic particles comprising iron oxide filler.
11. The inductor built-in substrate according to claim 3 , wherein the plurality of first through-hole conductors and the plurality of second through-hole conductors are formed such that a number of the first through-hole conductors is larger than a number of the second through-hole conductors.
12. The inductor built-in substrate according to claim 3 , wherein the plurality of first through-hole conductors and the plurality of second through-hole conductors are formed such that the plurality of first through-hole conductors is configured to transmit signals and that the second through-hole conductors is configured to be connected to a power supply.
13. The inductor built-in substrate according to claim 3 , wherein the core substrate includes a core material, inorganic particles, and a resin material, and the magnetic resin includes a resin material and magnetic particles comprising iron oxide filler.
14. The inductor built-in substrate according to claim 4 , wherein the plurality of first through-hole conductors and the plurality of second through-hole conductors are formed such that the plurality of first through-hole conductors is configured to transmit signals and that the second through-hole conductors is configured to be connected to a power supply.
15. The inductor built-in substrate according to claim 4 , wherein the core substrate includes a core material, inorganic particles, and a resin material, and the magnetic resin includes a resin material and magnetic particles comprising iron oxide filler.
16. The inductor built-in substrate according to claim 5 , wherein the core substrate includes a core material, inorganic particles, and a resin material, and the magnetic resin includes a resin material and magnetic particles comprising iron oxide filler.
17. The inductor built-in substrate according to claim 7 , wherein the plurality of first through-hole conductors and the plurality of second through-hole conductors are formed such that a number of the first through-hole conductors is larger than a number of the second through-hole conductors.
18. The inductor built-in substrate according to claim 7 , wherein the plurality of first through-hole conductors and the plurality of second through-hole conductors are formed such that the plurality of first through-hole conductors is configured to transmit signals and that the second through-hole conductors is configured to be connected to a power supply.
19. The inductor built-in substrate according to claim 7 , wherein the core substrate includes a core material, inorganic particles, and a resin material, and the magnetic resin includes a resin material and magnetic particles comprising iron oxide filler.
20. The inductor built-in substrate according to claim 1 , wherein the core substrate and the magnetic resin are formed such that a diameter of each of the first through holes in the core substrate is substantially equal to a diameter of each of the second through holes in the magnetic resin.