Sputtering target

1. A sputtering target comprising a target material, wherein a sputtering face of the target material has a circular shape and a ramp, wherein

the target material includes a flat circular first region positioned at a center of the sputtering face, and a flat ring-shaped second region positioned around the first region, wherein

the ramp has been provided so as to reduce a thickness of the target material, toward inner part of the sputtering face in the radial direction of the sputtering face between the first region and the second region, wherein

a diameter of the first region accounts for 32% or more and 58% or less of a diameter of the sputtering face, and

a thickness of the ramp is 0.5 mm to 5 mm, wherein

the thickness of the first region is 10 mm to 30 mm, wherein

the ring width of the second region is 5 mm to 75 mm.

2. A sputtering target comprising a target material, wherein a sputtering face of the target material has a circular shape and a ramp, wherein

the target material includes a flat circular first region positioned at a center of the sputtering face, and a flat ring-shaped second region positioned around the first region, wherein

the ramp has been provided so as to reduce a thickness of the target material, toward inner part of the sputtering face in the radial direction of the sputtering face between the first region and the second region, wherein

a diameter of the first region accounts for 32% or more and less than 50% of a diameter of the sputtering face, and

a thickness of the ramp is 0.5 mm to 5 mm, wherein

the thickness of the first region is 10 mm to 30 mm, wherein

the ring width of the second region is 5 mm to 75 mm.

3. The sputtering target according to any one of claims 1 to 2 , further comprising a backing plate.

4. The sputtering target according to claim 3 , wherein

the thickness of the backing plate is 5 mm to 30 mm.

5. The sputtering target according to claim 3 , wherein

the entire height of the sputtering target is 10 mm to 70 mm.