Integrated GaN power module

1. An integrated power module comprising:

a printed circuit board characterized by a first surface and a second surface, and including a thermal via extending from the second surface towards the first surface;

one or more surface-mounted components coupled with the first surface of the printed circuit board;

a heat-transfer substrate;

one or more gallium nitride transistors coupled between and soldered to each of the second surface of the printed circuit board and the heat-transfer substrate; and

a spacer coupled between and soldered to each of the printed circuit board and the heat-transfer substrate, wherein the spacer is directly coupled to the thermal via.

2. The integrated power module of claim 1 , wherein the heat-transfer substrate is an insulated metal substrate.

3. The integrated power module of claim 2 , wherein the insulated metal substrate comprises a copper base and one or more insulation layers.

4. The integrated power module of claim 1 , wherein the one or more surface-mounted components comprise at least one of a gate driver, a capacitor, a diode, a switch, or a thermistor.

5. The integrated power module of claim 1 , wherein the one or more spacers comprise solder-plated copper spacers.

6. The integrated power module of claim 5 , wherein at least one spacer is coupled with a via formed through the printed circuit board, and configured to transfer heat from the one or more surface-mounted components to the heat-transfer substrate.

7. The integrated power module of claim 1 , further comprising:

molding extending between the printed circuit board and the heat-transfer substrate, and further extending about the one or more gallium nitride transistors and the one or more spacers.

8. The integrated power module of claim 1 , further comprising:

potting extending across the first surface of the printed circuit board and extending about the one or more surface-mounted components.

9. An integrated power module comprising:

a printed circuit board characterized by a first surface and a second surface, and including a thermal via extending from the second surface towards the first surface;

one or more surface-mounted components coupled with the first surface of the printed circuit board;

a first heat-transfer substrate;

a second heat-transfer substrate;

a first gallium nitride transistor coupled between and soldered to each of the second surface of the printed circuit board and the first heat-transfer substrate;

a second gallium nitride transistor coupled between and soldered to each of the second surface of the printed circuit board and the second heat-transfer substrate; and

a first spacer coupled between and soldered to each of the printed circuit board and the first heat-transfer substrate, wherein the spacer is directly coupled to the thermal via.

10. The integrated power module of claim 9 , wherein at least one of the first and second heat-transfer substrates comprise a direct-bonded copper board.

11. The integrated power module of claim 10 , wherein the direct-bonded copper board comprises a first copper layer coupled with the one or more gallium nitride transistors, a second copper layer, and a ceramic layer, and wherein the first copper layer is characterized by an arcuate profile along the integrated power module.

12. The integrated power module of claim 11 , wherein at least a portion of the second copper layer is removed exposing the ceramic layer.

13. The integrated power module of claim 9 , further comprising:

at least four heat-transfer substrates including the first heat-transfer substrate and the second heat-transfer substrate; and

at least four gallium nitride transistors including the first gallium nitride transistor and the second gallium nitride transistor.

14. The integrated power module of claim 9 , wherein the first heat-transfer substrate and the second heat-transfer substrate each are an insulated metal substrate comprising a copper base and one or more insulation layers.

15. The integrated power module of claim 9 , further comprising:

molding extending along the second surface of the printed circuit board, and extending between the first heat-transfer substrate and the second heat-transfer substrate.

16. The integrated power module of claim 9 , wherein the first heat-transfer substrate and the second heat-transfer substrate each are a direct-bonded copper including a ceramic layer between copper layers.

17. The integrated power module of claim 9 , further comprising:

a transformer core coupled with the first surface of the printed circuit board, wherein the transformer core separates the surface-mounted components into a first subset of surface-mounted components and a second subset of surface-mounted components.

18. The integrated power module of claim 17 , wherein the first heat-transfer substrate is coupled with the printed circuit board in association with the first subset of surface-mounted components, and wherein the second heat-transfer substrate is coupled with the printed circuit board in association with the second subset of surface-mounted components.

19. The integrated power module of claim 17 , further comprising

one or more second spacers coupled between and soldered to each of the printed circuit board and the second heat-transfer substrate.

20. An integrated power module comprising:

a printed circuit board characterized by a first surface and a second surface, and including a via extending from the second surface towards the first surface;

one or more surface-mounted components coupled with the first surface of the printed circuit board;

a heat-transfer substrate comprising an insulated metal substrate including a copper base and one or more insulation layers;

one or more gallium nitride transistors coupled between and soldered to each of the second surface of the printed circuit board and the heat-transfer substrate; and

a spacer coupled between and soldered to each of the printed circuit board and the heat-transfer substrate, wherein:

the spacer is directly coupled to the via; and

wherein the one or more spacers comprise solder-plated copper spacers.