Integrated circuit memory and manufacturing method thereof, and semiconductor integrated circuit device
A manufacturing method of an integrated circuit memory includes: a substrate is provided; a bit line extending along a first direction is formed on the substrate; a word line extending along a second direction is formed on the bit line; and a vertical storage transistor is formed in an overlapping region where the word line and the bit line are spatially intersected, the vertical storage transistor being located on the bit line, and connected to the bit line.
1. An integrated circuit memory, comprising:
a substrate;
a bit line formed on the substrate and extending along a first direction;
a word line formed on the bit line and extending along a second direction; and
a vertical storage transistor formed in an overlapping region where the word line and the bit line are spatially intersected, located in the word line, and connected to the bit line, wherein a lower part of the vertical storage transistor is embedded in the bit line.
2. The manufacturing method of claim 1 , wherein the step of forming the vertical storage transistor in the overlapping region where the word line and the bit line are spatially intersected comprises the steps of:
providing a through hole in the overlapping region with the through hole exposing the bit line; and
forming an active pillar of the vertical storage transistor and a gate dielectric layer surrounding the active pillar in the through hole,
wherein a diameter of the through hole is less than a width of the word line.
3. The manufacturing method of claim 2 , wherein the step of providing the through hole in the overlapping region comprises the steps of:
forming a first sacrificial layer pattern which covers a preset region of the through hole, and exposes a region other than the preset region; and
providing the through hole in the preset region by means of a pattern transfer process.
4. The manufacturing method of claim 2 , wherein the step of forming the active pillar of the vertical storage transistor and the gate dielectric layer surrounding the active pillar in the through hole comprises the steps of:
forming an annular gate dielectric layer on a sidewall of the through hole; and
forming the active pillar in the through hole with a first doped region being formed in a lower end portion of the active pillar and connected to the bit line, a second doped region being formed on an upper end portion of the active pillar and being configured to connect a storage element, and a third doped region being formed between the lower end portion and the upper end portion of the active pillar,
wherein the first doped region, the second doped region and the third doped region are respectively constructed to a drain region, a source region and a channel region of the vertical storage transistor.
5. The manufacturing method of claim 1 , further comprising:
forming an insulation dielectric layer on the substrate, with the insulation dielectric layer filling a gap between two adjacent bit lines and covering the bit lines before forming the word line on the bit line.
6. The manufacturing method of claim 1 , further comprising:
forming an insulation dielectric layer on the substrate, with the spacing dielectric layer filling a gap between two adjacent word lines and covering the word lines, after forming the word line on the bit line.
7. The manufacturing method of claim 1 , wherein a width of the word line, width of the bit line, a spacing between two adjacent word lines and a spacing between two adjacent bit lines are all a preset value, and the preset value is greater than or equal to 30 nm and less than or equal to 60 nm.
8. The manufacturing method of claim 1 , wherein a projection of the second direction in which the word line extends and a projection of the first direction in which the bit line extends on the substrate are intersected with a first angle of greater than or equal to 60° and less than or equal to 90°.
9. The manufacturing method of claim 4 , wherein the step of forming the annular gate dielectric layer on the sidewall of the through hole comprises the steps of:
forming a gate dielectric layer film in the through hole, with the gate dielectric layer film covering the sidewall of the through hole and a bottom wall of the through hole;
forming a protective layer film on the gate dielectric layer film; and
removing the gate dielectric layer film and the protective layer film on the bottom wall by an etching process to provide an opening exposing the bit line in the through hole; and
wherein a distance between a bottom of the opening and a top of the bit line is greater than or equal to 5 nm and less than or equal to 8 nm; and a distance between the bottom of the through hole and the top of the bit line is greater than or equal to 3 nm and less than or equal to 5 nm.
10. The manufacturing method of claim 1 , wherein one said overlapping region corresponds to one said vertical storage transistor, and a unit configuration size of the vertical storage transistor on the substrate is greater than or equal to 4 times of a square of a minimum feature size.
11. A manufacturing method of the integrated circuit memory according to claim 1 , comprising:
providing the substrate;
forming the bit line on the substrate with the bit line extending along the first direction;
forming the word line on the bit line with the word line extending along the second direction; and
forming the vertical storage transistor in the overlapping region where the word line and the bit line are spatially intersected, in which the vertical storage transistor is in the word line, and is connected to the bit line, wherein the lower part of the vertical storage transistor is embedded in the bit line.
12. The integrated circuit memory of claim 11 , wherein the integrated circuit memory further comprises a through hole provided in the overlapping region, and exposing the bit line, in which an active pillar of the vertical storage transistor and a gate dielectric layer surrounding the active pillar are arranged; and wherein a diameter of the through hole is less than a width of the word line.
13. The integrated circuit memory of claim 12 , wherein the vertical storage transistor comprises:
an annular gate dielectric layer located on a sidewall of the through hole; and
the active pillar located in the through hole, with a first doped region being formed in a lower end portion of the active pillar and connected to the bit line, a second doped region being formed in an upper end portion of the active pillar and being configured to connect a storage element, a third doped region being formed between the lower end portion and the upper end portion of the active pillar, and the first doped region, the second doped region and the third doped region being respectively constructed to a drain region, a source region and a channel region of the vertical storage transistor.
14. The integrated circuit memory of claim 13 , wherein the integrated circuit memory further comprises the storage element formed above the vertical storage transistor, and electrically connected to the second doped region.
15. The integrated circuit memory of claim 11 , wherein the integrated circuit memory further comprises an insulation dielectric layer, which fills a gap between two adjacent bit lines, and covers the bit lines.
16. The integrated circuit memory of claim 11 , wherein the integrated circuit memory comprises an insulation dielectric layer, which fills a gap between two adjacent word lines, and covers the word lines.
17. The integrated circuit memory of claim 11 , wherein a width of the word line, a width of the bit line, a spacing between two adjacent word lines and a spacing between two adjacent bit lines are all a preset value, and the preset value is greater than or equal to 30 nm and less than or equal to 60 nm.
18. The integrated circuit memory of claim 11 , wherein a projection of the second direction in which the word line extends and a projection of the first direction in which the bit line extends on the substrate are intersected with a first angle of greater than or equal to 60° and less than or equal to 90°.
19. The integrated circuit memory of claim 11 , wherein one said overlapping region corresponds to one said vertical storage transistor, and a unit configuration size of the vertical storage transistor on the substrate is greater than or equal to 4 times of a square of a minimum feature size.
20. A semiconductor integrated circuit device, comprising:
a substrate;
a first conducting line formed on the substrate and extending along a first direction;
a second conducting line formed on the first conducting line and extending along a second direction; and
a vertical storage transistor formed in an overlapping region where the second conducting line and the first conducting line are spatially intersected, located in the second conducting line, and connected to the first conducting line, wherein a lower part of the vertical storage transistor is embedded in the first conducting line.